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Acquisitions Infineon IGBT Modules:Easy Series,IHV B Series,XHP™ Series
Latest company news about Acquisitions Infineon IGBT Modules:Easy Series,IHV B Series,XHP™ Series

Acquisitions Infineon IGBT Modules:Easy Series,IHV B Series,XHP™ Series

 

Shenzhen Mingjiada Electronics Co., Ltd. is a world-renowned electronic component recycler.

 

Specific recycle process:
1. You can simply classify your IC/module stocks and identify the model, brand, production date, quantity, etc.
2. Please send your inventory list to our evaluation team by fax or e-mail.
3. When you receive the purchase offer from one of our professionals, we can negotiate the specific transaction method and delivery and reach an agreement.

4. We only recycle from regular channels, such as agents, traders, and factories, and do not accept irregular sources.

 

Easy Series:
The Easy family is the best choice for customers who are looking for a flexible and scalable power module solution. With the extension of the Easy 3B package, we now offer the broadest base-plate-less package portfolio with 12mm height. The flexible pin grid system is a perfect fit for customizing layout and pinout. The packages are without a base plate. The Easy 3B package extends the DCB surface area (DCB, direct copper bonding, is a substrate in the power module) of the current package by a factor of two while maintaining the same height.

 

IHV B Series:
The well-known IHV (IGBT High- Voltage Modules) are robust and work with supreme reliability at any temperature condition from -40°C up to +150°C. The IHV-B are offered in a range of 500 A to 3600 A at 1200 V to 4,5 kV in various combinations, which enable together with different topologies (single switch-, chopper- and diode modules) the usage in various high power inverter sizes and performances.

 

XHP™ Series:
XHP™ is the flexible module platform for high-power applications. Ranging from 1.7 kV to 6.5 kV, the XHP™ presents an excellent solution for demanding applications like traction, CAV and medium-voltage drives. The module allows for scalable design with best-in-class reliability and highest power density.

Pub Time : 2024-12-04 11:40:36 >> News list
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