company blog about Supply TI Automobile Chips DRA770PJGACDQ1 Embedded Microprocessors

Supply TI Automobile Chips DRA770PJGACDQ1 Embedded Microprocessors

Product Description
DRA770PJGACDQ1 Up to Thirty-Two 16 x 16-Bit Fixed-Point Multiplies per Cycle, Supports up to DDR2-800 and DDR3-1333, SuperSpeed USB 3.0 Dual-Role Device.

Features
Four Multichannel Serial Peripheral Interfaces (McSPI)
Quad SPI (QSPI)
Eight Multichannel Audio Serial Port (McASP) Modules
SuperSpeed USB 3.0 Dual-Role Device
Three High-Speed USB 2.0 Dual-Role Devices
Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces ( MMC™/ SD® /SDIO)
PCI Express® 3.0 Subsystems with Two 5-Gbps Lanes
One 2-Lane Gen2-Compliant Port or Two 1-Lane Gen2-Compliant Ports
Up to Two Controller Area Network (DCAN) Modules
Power, Reset, and Clock Management
On-Chip Debug with CTools Technology
28-nm CMOS Technology
23 mm × 23 mm, 0.8-mm Pitch, 784-Pin BGA (ACD)

Applications
Integrated Automotive Digital Cockpit
Infotainment / Center Stack