company blog about Acquisition Lattice Evaluation Board:CrossLink,CrossLink-NX,CrossLinkPlus

Acquisition Lattice Evaluation Board:CrossLink,CrossLink-NX,CrossLinkPlus

Shenzhen Mingjiada Electronics Co., Ltd., as a leading enterprise in the field of electronic component recycling, specialises in the recovery of various electronic components. We provide efficient and compliant inventory disposal solutions for global clients, enabling them to rapidly recover capital and optimise warehouse management.

【Recycling Process】

Information Submission: Simply provide details of the Lattice evaluation boards for recycling via email or telephone, including model, quantity, condition, and photographs.

Accurate Quotation: Our specialist team typically completes assessments and provides competitive quotations within 12 to 24 hours.

Secure Handling: We offer complimentary nationwide collection services across multiple cities, or arrange insured global logistics via DHL, UPS, SF Express, and other carriers to ensure safe transit.

Payment Upon Inspection: This is one of Mingjiada's core commitments. Full payment is guaranteed within 24 hours after successful goods inspection, with multiple settlement methods including wire transfer and cash – significantly exceeding the industry average payment cycle.

【CrossLink】

CrossLink: LIF-MD6000 – Master Link Board

Rapid development and performance evaluation – Access to all high performance interfaces and general purpose I/Os.

Daughter boards for system integration needs – SMA and Breakout I/O Link Boards included. Additional SMA, Breakout, Raspberry Pi AP Link and Raspberry Pi Camera Link boards also available.

Debug, IPs and development tools – Develop custom video interfacing solutions and configure CrossLink video interfacing IP with Lattice Diamond Software.

Features

Contains the Lattice CrossLink LIF-MD6000 in 81-ball csfBGA package

Contains four connectors for interfacing to MIPI D-PHY and High Speed Programmable I/Os

Includes 0.1” header board, SMA board and LEDs for interfacing and control

Provides easy programming interface via USB with FTDI device

CrossLink: LIF-MD6000 I/O Link Boards

Rapid development and performance evaluation – Allows interfacing between CrossLink and high speed video interfaces as well as lower speed peripheral control.

Demonstrate video interfacing – Each SMA I/O Link board contains 10 SMAs for connectivity to source synchronous interfaces with 4 data lanes and 1 clock lane.

Enable peripheral controls – Interface to low-speed peripherals of image sensors and displays such as I2C and SPI. Develop general purpose I/O for clock distribution, sensor triggering and power sequencing.

Features

I/O Link Boards for use with Lattice LIF-MD6000 Master Link Board for SMA or low speed peripheral connections

Contains one SMA board and one .1” header board

【CrossLink-NX Evaluation Board】

Prototyping Board with Abundant I/O, PCIe 5G SERDES, Expansion Headers and 40K Logic Cells

The Lattice Semiconductor CrossLink™-NX Evaluation Board allows you to investigate and experiment with the features of the CrossLink-NX FPGA. The features of the CrossLink-NX Evaluation Board can assist you with the rapid prototyping and testing of you specific designs.

The CrossLink-NX Evaluation Board features the LIFCL-40-9BG400C CrossLink-NX FPGA in the 400-ball caBGA package. The board can expand the usability of the CrossLink-NX device with Raspberry Pi, peripheral module (PMOD), FPGA Mezzanine Card Low Pin Count (FMC LPC) connector, along with access to the PCIe channel. 118 wide range I/O and 37 high speed differential pairs are available for user-defined applications.

Features

CrossLink-NX FPGA (LIFCL-40-9BG400C)

General Purpose Input/Output (GPIO) breakout with Raspberry Pi, PMOD, and FMC connector

Mobile Industry Processor Interface (MIPI) Camera Serial Interface-2 (CSI-2) camera connector and D-PHY connector

118 wide range I/O and 37 high speed differential pair I/O with on-board termination

x1 Gen2 Peripheral Component Interconnect Express (PCIe) interface

【CrossLinkPlus】

CrossLinkPlus LIF-MDF6000 Master Link Board

Bridging of multiple signaling standards - The board‘s key component is the CrossLinkPlus family device that features built in MIPI D-PHY Hardened blocks to support different bridging solutions.

MIPI CSI-2/DSI Hardened blocks - supports a variety of demos, encompassing different signaling logic standards bridging with MIPI® CSI-2/DSI interface.

On-chip flash memory – demonstrates instant-on (< 10 ms) configuration and flexible in-field reprogramming.

Features

Contains the Lattice CrossLinkPlus LIF-MDF6000 in 80-ball ckfBGA package

Includes SMA and Breakout I/O Link Board for interfacing and control

Provides easy programming interface via Mini USB Type-B connector to FTDI