company blog about Acquisition ON Sensor Evaluation Board:Image Sensor,Inductive Sensing,Thermal Management

Acquisition ON Sensor Evaluation Board:Image Sensor,Inductive Sensing,Thermal Management

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1. Image Sensors: Pursuing High Fidelity and Efficiency

The primary function of image sensor evaluation boards is to provide developers with a platform for verifying imaging quality and processing efficiency. Evaluation focus has shifted from static parameters (such as resolution) to dynamic performance and system integration.

Global Shutter and High Dynamic Range: In machine vision and ADAS (Advanced Driver Assistance Systems), global shutter ensures distortion-free imaging when capturing fast-moving subjects. For instance, evaluation boards from ON Semiconductor support surveillance-grade sensors like the AR0237, whose integrated DR-PIX™ dual-gain technology delivers 60fps@1080p output, ideal for security applications demanding rapid response.

Near-Sensor Processing: To mitigate substantial power consumption from frequent off-chip data movement, the Near-Sensor Processing architecture emerged. By relocating computational units adjacent to sensors, it significantly enhances energy efficiency. However, this approach elevates local sensor temperatures, introducing thermal noise that degrades image quality. Consequently, evaluating such image sensors necessitates holistic consideration of thermal management and imaging fidelity. Melexis' EVK75024 evaluation kit for the MLX75024 automotive Time-of-Flight (ToF) sensor incorporates a complete signal processing IC and optical module, enabling developers to assess ranging accuracy and system stability under varying temperature conditions.

2. Inductive Sensing: Enabling Micrometre-Level Non-Contact Interaction

Inductive sensing evaluation boards (e.g., capacitive touch, proximity sensing) focus on detecting minute physical quantity variations and converting them into stable, reliable electrical signals.

High-Sensitivity Detection: Taking the ON Semiconductor LC717A10AR touch and proximity sensor evaluation board as an example, its differential capacitance detection (mutual capacitance) system can detect minute capacitance changes at the femtofarad level. This exceptional sensitivity enables the evaluation board to accurately assess non-contact interaction effects through glass or plastic casings, providing a critical validation tool for developing products such as white goods and computer peripherals.

Integrated Evaluation Environment: Omron's 2JCIE-EV series evaluation boards integrate up to five sensors (temperature, humidity, barometric pressure, ambient light, motion) and are compatible with mainstream development platforms including Arduino and Raspberry Pi. This design enables developers to rapidly build and validate IoT proof-of-concept (PoC) prototypes incorporating multiple sensing technologies within a unified hardware framework.

3. Intelligent Thermal Management: From Passive Protection to Active Regulation

Thermal management has evolved from simple overheat shutdown protection to active strategies safeguarding sensor performance and reliability. Its importance is particularly evident for high-power, highly integrated evaluation boards.

Image Sensors: In-vehicle camera modules typically operate within compact, enclosed spaces lacking active cooling. Prolonged high-temperature operation degrades image sensors' signal-to-noise ratio, potentially forcing electronic control units (ECUs) to throttle down or shut down to protect hardware—temporarily disabling ADAS functionality.

RF Sensors: Radar and LiDAR performance exhibits extreme temperature sensitivity. Radar reception gain and transmission power both drift with temperature. LiDAR laser arrays may degrade beyond 70°C, while their controllers require throttling around 105°C to prevent malfunction. The precision of these sensors' built-in temperature sensors may be as low as ±6°C or even less. To prevent overheating damage, systems must adopt conservative strategies, throttling well before reaching actual limits, which severely restricts the sensors' potential performance.

High-Precision Temperature Monitoring Solution

To address the inadequacy of built-in sensors, the industry consensus is to introduce independent, high-precision external temperature sensors.

Enhanced Accuracy: Placing an external temperature sensor (such as ON Semiconductor's NCT72) with accuracy of ±1°C or even ±0.25°C adjacent to the image sensor module enables more precise monitoring of the chip's junction temperature. This allows the ECU to maximise performance while maintaining safety margins.

Multi-point Monitoring and Differential Measurement: For modules with uneven heat distribution, such as radar systems, differential measurement using two independent temperature sensors can be employed. Alternatively, ultra-thin temperature sensors positioned beneath the chip can directly monitor critical hotspots, achieving ±1°C precision in die temperature control.