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Acquisition ST GNSS IC And Module:TeseoVI,TeseoV,TeseoIV,TeseoIII
Latest company news about Acquisition ST GNSS IC And Module:TeseoVI,TeseoV,TeseoIV,TeseoIII

Acquisition ST GNSS IC And Module:TeseoVI,TeseoV,TeseoIV,TeseoIII

 

Shenzhen Mingjiada Electronics Co., Ltd, as a professional service provider in the field of electronic components recycling, has been focusing on the recycling service of all kinds of high-end electronic components for a long time. With a professional evaluation team, a global recycling network and strong financial strength, we help our customers to solve the problem of inventory backlog and achieve the optimal allocation of resources and rapid return of funds.

 

Recycling products include: IC ICs, 5G chips, new energy ICs, IoT chips, Bluetooth chips, automotive chips, artificial intelligence ICs, Ethernet ICs, memory chips, sensors, IGBT modules and a series of other products.

 

Recycling specific process:

1.You will be backlog of IC / module inventory for simple classification, to determine the model, brand, production date, quantity, etc. .

2. Please send the inventory list to our evaluation team by fax or email.

3.Wait for the company's professionals to make a purchase offer, after reaching an agreement, both sides will discuss the specific transaction mode for delivery.

4. The company only recycles formal channel sources, such as agents, traders, terminal factories, etc., and does not accept sources that are not formal channels.

 

Our advantages:

1. Strong strength, abundant funds.

2. Recovery of a wide range of geographical areas, domestic and foreign areas can be.

3. Provide reasonable prices, try to help you improve the cost.

4. Intermediary rewards.

 

ST's Teseo family of global navigation satellite system (GNSS) integrated circuits (ICs) and modules provide high-accuracy positioning capabilities. These standalone ICs and modules support up to quad-band operation and are compatible with multiple global navigation constellations: BeiDou, Galileo, GLONASS, GPS, Navic, and QZSS.

 

GNSS IC and Module types

In addition to single-die standalone ICs, the Teseo family includes modules that integrate the GNSS chipset with necessary external components for a reduced Time To First Fix (TTFF):

 

Reduced design risk and simplified development, as the complex RF path design is already done

Embedded temperature-compensated crystal oscillator (TCXO), dedicated real-time clock (RTC), SAW filter, and RF front-end components

Larger, with fewer pins, and only require the connection of an appropriate antenna

GNSS modules offer a simpler and faster development process with reduced design complexity, while standalone GNSS ICs provide more flexibility for those with the necessary design expertise.

 

TeseoVI

Single-die, simultaneous quad-band (L1+L2+L5+E6) GNSS devices using ST’s proprietary phase-change memory with a single configurable firmware binary for multi-band reception up to quad band.

 

TeseoV

GNSS receiver ICs, offering on-chip, dual and triple (L1+L5 or L1+L2+L5), multi-constellation, carrier-phase tracking for higher accuracy and precise positioning and autonomous position, velocity and time (PVT) calculations on a single chip.

 

TeseoIV

Tiny, dual-band, low-power GNSS module

 

TeseoIII

Standalone GNSS-L1 receiver ICs with reduced power consumption, carrier-phase tracking for higher accuracy, and support for Read-only Memory (ROM).

Pub Time : 2025-11-04 14:18:38 >> News list
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