company blog about Acquisitions BT IC Surface Mount BES2700YP Ultra-Low Power Dual-Mode BT 5.3 Audio SoC IC

Acquisitions BT IC Surface Mount BES2700YP Ultra-Low Power Dual-Mode BT 5.3 Audio SoC IC

Product Description Of BES2700YP
BES2700YP is the latest generation of ultra-low power, highly integrated BT audio SoC, using 12nm process, into dual-mode BT 5.3, support BT&BLE, the main processor built-in Arm Cortex-M55 CPU and Tensilica HiFi 4 DSP, greatly enhance the chip's computing performance, sensor hub subsystem built-in STAR-MC1 MCU and neural network processor BECO NPU are built into the sensor hub subsystem to achieve rich application processing capability while significantly reducing power consumption.

Product Images Of BES2700YP

We purchase a broad series of modules used in the various fields, including：

5G, new energy, Internet of Things, Internet of Vehicles, automobile-standard devices, base stations, communications, artificial intelligence, radio frequency, home appliances, thyristors, medical service, industry, BT 5.0, ethernet, sensors, optical modules, DC/DC, Wi-Fi, LPWA, GNSS, and IGBT.

Specific recycle process:

1. You can simply classify your IC/module stocks and identify the model, brand, production date, quantity, etc.

2. Please send your inventory list to our evaluation team by fax or e-mail.

3. When you receive the purchase offer from one of our professionals, we can negotiate the specific transaction method and delivery and reach an agreement.

4. We only recycle from regular channels, such as agents, traders, and factories, and do not accept irregular sources.