company blog about ADI ADSP-BF707KBCZ-3 Low Power 400MHz Blackfin Embedded Processor with 1MByte L2 SRAM and DDR2/LPDDR Interface

ADI ADSP-BF707KBCZ-3 Low Power 400MHz Blackfin Embedded Processor with 1MByte L2 SRAM and DDR2/LPDDR Interface

This device is a member of the ADSP-BF70x Blackfin Digital Signal Processor (DSP) product family. The new Blackfin+ processor core combines dual-MAC 16-bit, 32-bit MAC and 16-bit complex MAC in to a state-of-the-art signal processing engine. It also combines advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities within a single instruction-set architecture. Further new enhancements to the Blackfin+ core add cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.

The processor offers performance up to 400 MHz, as well as lowest power consumption at <100mW. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance.

By integrating a rich set of industry-leading system peripherals, large on-chip memory & a high speed external memory interface, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.

Features of ADSP-BF707KBCZ-3
Blackfin+ core with up to 400 MHz performance
Dual 16-bit or single 32-bit MAC support per cycle
16-bit complex MAC and many other instruction set enhancements
Instruction set compatible with previous Blackfin products
On-Chip Memory
136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)
1MByte on-chip L2 SRAM with ECC protection
512KByte On-chip L2 ROM
L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz)
Key Peripherals include
USB2.0 HS OTG
2x CAN2.0B
ePPI Video I/O
2x SPORTs (w/I2S)
2xQuad-SPI / 1xDual-SPI (w/ Host mode option)
I2C
2xUART
SD/SDIO/MMC (8-bit)
4-ch 12-bit 1MSPS ADC
Security and one-time-programmable memory
Crypto hardware accelerators for fast secure boot/IP protection
memDMA encryption/decryption for fast run-time security
Low-cost packaging
184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant
Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION

Processor Block Diagram of ADSP-BF707KBCZ-3