company blog about Amphenol ExaMAX® High Speed Cable Assemblies - HS31101100, HS31102025 Cable Backplanes

Shenzhen Mingjiada Electronics Co., Ltd Acquires Amphenol ExaMAX® High Speed Cable Assemblies - HS31101100, HS31102025 Acquires Cable Backplanes, Acquires Connectors

Product Description: ExaMAX® IO Connector System

The ExaMAX® VS I/O System provides cable assemblies and I/O connector solutions for internal and external applications.ExaMAX® I/O products are capable of delivering high-speed performance at 25 Gb/s per channel, with pass-through to 40 Gb/s or higher.The ExaMAX® I/O System offers excellent linear board signal density and meets the OIF-CEI25G-LR The ExaMAX® I/O system has excellent linear board signal density and meets OIF-CEI25G-LR performance requirements. Internal I/O systems are available as cable backplanes and point-to-point internal cables with positive latching and integrated guides to ensure robust interconnections.

Internal systems are designed to be a direct replacement for vertical header connectors on the backplane and/or midplane, and use hard metric design guidelines. Fly-through applications can be designed to connect QSFP, SlimSAS, Slim Cool Edge and other connectors to meet customer specific applications.

External cable systems feature rugged metal die castings in a variety of outlet configurations as well as braided shielding and EMI liner systems to ensure reliable EMI performance. Mechanical mounting of jackscrews provides a robust and flexible strain relief solution.

Amphenol Cable Backplane Systems is able to create customised cabling solutions and configurations to meet specific design requirements.The ExaMAX® I/O system is highly scalable and modular, making it suitable for almost any application.

Target Applications

• Optical Transport
• Routers
• Switches
• Wireless infrastructure
• External Storage Systems
• Servers
• Supercomputer

Our company recycles personal and factory stock of electronic components at high price for a long time in cash, the products include 5G chips, new energy, Internet of Things, Bluetooth IC, Telematics IC, Car IC, car regulation IC, base station IC, Communication IC, Artificial Intelligence, Medical IC, Home Appliance IC, Voice IC, Memory IC, Sensor IC, Microcontroller IC, Transceiver IC and other products.

The company only recycles formal channel sources, such as agents, traders, terminal factories, etc. We do not accept sources that are not formal channels.

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