Amid the rapid growth of the TWS (True Wireless Stereo) BT earbud market, a controller chip that combines low power consumption, high audio quality, and high integration is a key factor for end products to succeed in the market. Shenzhen Mingjiada Electronics Co., Ltd. offers a long-term supply of brand-new, genuine, in-stock Bestechnic BES2000-IZ BT audio SoCs, providing stable and reliable chip procurement services for TWS earbud manufacturers, smart audio device solution providers, and IoT device manufacturers.
BES2000-IZ Product Overview
The BES2000-IZ is a fully integrated dual-mode BT audio SoC designed by Bestechnic specifically for TWS (True Wireless Stereo) BT earbuds and smart audio devices. It features low power consumption, high audio quality, high integration, and dual-microphone noise cancellation. Widely used in TWS earbuds from brands such as Huawei FreeBuds and Meizu POP TW50, it is a classic control solution for early high-end TWS earbuds.
Manufactured using an advanced 40nm low-power CMOS process, this chip integrates RF, Power Management Unit (PMU), Baseband (BB), Audio Codec, and a Cortex-M4F CPU onto a single die. This significantly reduces the number of external components, freeing up valuable PCB space for compact devices like TWS earbuds where every millimeter counts.
Key Specifications
Brand/Model: Hengxuan Technology BES2000-IZ
BT Specifications: BT 4.2 Dual-Mode (BR/EDR + BLE)
Controller Core: ARM Cortex-M4F, maximum clock speed 300MHz
Storage Capacity: Built-in 4MB serial flash memory, no external flash required
Audio Interfaces: Dual DACs, four ADCs
Audio Performance: DAC SNR ≥105dB, supports up to 384kHz/24-bit Hi-Fi audio
Key Features: FWS full wireless stereo, dual-microphone noise cancellation/echo cancellation, multi-band EQ, bass boost, wear detection, USB audio
Power Management: Integrated PMU, wide input voltage range 3.1V – 5.5V
Operating Temperature: -40°C to +85°C
Package: 96-ball BGA, 5.5mm × 5.9mm
Manufacturing Process: Advanced 40nm low-power CMOS process
BES2000-IZ Key Technology Highlights
1. Powerful processing performance to empower audio algorithms
The BES2000-IZ features an ARM Cortex-M4F processor running at up to 300MHz, with a built-in 80MIPS high-speed DSP. It offers strong voice recognition capabilities and can smoothly execute various audio processing algorithms, providing users with a high-quality audio experience. The chip integrates 4MB of serial flash memory for user programming, along with on-chip boot ROM and RAM, supporting a secure boot mechanism to effectively protect customers’ intellectual property.
2. Fully Integrated Design, Significantly Simplifying the BOM
The single-chip solution integrates RF, power management (PMU), baseband (BB), audio codecs, and the CPU, eliminating the need for external memory chips. Combined with the integrated power management unit, it supports a wide input voltage range of 3.1V–5.5V and can operate directly from a lithium battery, significantly reducing peripheral circuit complexity and overall BOM costs.
3. Hi-Fi-grade audio quality
The BES2000-IZ delivers outstanding audio performance. The DAC signal-to-noise ratio (SNR) exceeds 105dB, with some DAC specifications reaching 120dB SNR. Sampling rates range from 8kHz to 384kHz, supporting up to 384kHz/24-bit Hi-Fi audio. The chip integrates a multi-band, fully configurable equalizer (EQ) and bass enhancement technology, supporting immersive audio effects such as 3D or virtual surround sound, delivering a rich and clear audio experience to users.
4. Efficient Noise Cancellation and Voice Enhancement
The chip supports dual-microphone noise cancellation and echo cancellation, delivering high-quality noise-canceling performance during dual-microphone calls and significantly improving call clarity in noisy environments. It also supports dual-microphone voice recognition and dual-microphone feedforward active noise cancellation (ANC), with a noise cancellation depth of up to 46 dB, meeting noise cancellation requirements across various scenarios.
5. Ultra-Low Power Consumption for Extended Battery Life
The BES2000-IZ utilizes an advanced 40nm low-power process and an innovative power management architecture, with average current consumption during normal operation below 10mA. The chip supports a low-power mode enabled by an internal low-power oscillator (LPO) and a Class H audio amplifier, effectively reducing power consumption while maintaining audio quality. This extends the battery life of TWS earbuds, delivering a longer-lasting user experience.
6. Rich Connectivity and Expandability
The chip supports mainstream BT protocols such as A2DP v1.3, AVRCP v1.5, and HFP v1.5, and is compatible with the USB 2.0 HS specification. It features a temperature sensor interface to enable smart functions such as body temperature monitoring, and supports UART serial communication controlled by an external MCU. In terms of expandability, the chip integrates ROM, RAM, and Flash on a single die, facilitating OTA firmware updates and enabling continuous product iteration and optimization.
IV. Major Application Areas
Thanks to its outstanding performance and highly integrated design, the BES2000-IZ has found widespread application in the following areas:
TWS True Wireless BT Earbuds: Serves as the main control chip, providing stable wireless connectivity, high-quality audio playback, and call noise cancellation
High-End BT/Wi-Fi Dual-Mode Speakers: Supports dual-mode operation via BT and Wi-Fi, enabling audio playback across multiple scenarios
Smart BT/Wi-Fi Music Players: Provides high-quality audio decoding and wireless connectivity capabilities
Internet of Things (IoT) Platforms: Serves as an edge node for BT connectivity and audio processing
V. Classic End-User Applications
Thanks to its outstanding performance and mature solutions, the BES2000-IZ has been successfully implemented in several market-leading products, including Huawei’s FreeBuds true wireless BT earbuds, Meizu’s POP TW50, and Suning’s XiaoBiu smart BT earbuds. The successful launch of these products fully validates the BES2000-IZ’s exceptional performance in terms of stable connectivity, low power consumption, and high audio quality.
VI. About Bestechnic
Founded in early 2015 and headquartered in Shanghai, Bestechnic is a leading domestic smart audio SoC chip design company specializing in the R&D and sales of RF SoC chips for wireless audio platforms. In 2017, the company launched the BES2000 series of chips, which were the first to enable dual-ear calling functionality (excluding Apple’s AirPods) and were adopted by Huawei, quickly meeting the demand from other brands in the industry to follow suit after the launch of AirPods. In 2018, Bestechnic introduced the BES2300 series of low-power smart BT audio chips, the world’s first to utilize the advanced 28nm process, solidifying its position in the industry’s “first tier.” Hengxuan Technology is committed to providing customers with Wi-Fi/BT wireless-enabled audio system-on-chip (SoC) solutions, hardware and software development kits, and comprehensive reference designs to help them rapidly launch industry-leading wireless smart products.
Contact Us
For inquiries regarding the BES2000-IZ or other Hengxuan BT audio SoC chips, please contact:
Phone: +86 13410018555 (Mr. Chen) / 86-755-83294757
Email: sales@hkmjd.com
Website: www.integrated-ic.com
Address: Rooms 1239-1241, New Asia Guoli Building, Zhenzhong Road, Futian District, Shenzhen, Guangdong Province
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