Shenzhen Mingjiada Electronics Co., Ltd. now stocks Changxin Memory Technologies (CXMT) CXDQ3A8AM-IJ-A industrial-grade DDR4 SDRAM memory chips. This chip features an FBGA-78 package, delivering 8Gb (1G×8) high-capacity storage with an extended operating temperature range from -40°C to +95°C. It is specifically engineered for demanding applications in industrial automation, automotive infotainment systems, communication infrastructure, and outdoor edge computing devices.
CXDQ3A8AM-IJ-A Core Specifications
Basic Parameters
Storage Capacity: 8Gb (1G×8 bits)
Package Type: FBGA-78 (11.5mm×13mm)
Data Bit Width: x8
Data Rate: 3200Mbps
Bank Architecture: 16 Banks (4 Bank Groups, 4 Banks per Group)
Electrical Characteristics
Operating Voltage: VDD/VDDQ = 1.2V (1.14V~1.26V), VPP = 2.5V (2.375V~2.75V)
Operating Current: Typical 107.7mA
Refresh current: 62.3mA
Low-power design: Supports Maximum Power Saving Mode (MPSM) and Low-Power Auto Self-Refresh (LP ASR) mode
Temperature range
Industrial wide temperature: -40°C ≤ TCase ≤ +95°C
Application scenarios: Meets high reliability requirements in harsh environments
Physical characteristics
Package size: FBGA-78 standard package
Weight: Approx. 0.19g
Environmental Standards: Compliant with lead-free/environmental requirements
CXDQ3A8AM-IJ-A Key Features
High Performance: Delivers high-speed data transfer rates to enhance system responsiveness.
Low Power Consumption: 1.2V operating voltage effectively reduces system energy consumption.
High Reliability: Built-in data integrity mechanisms like ECC ensure stable operation.
Domestic Self-Reliance: Supported by a complete domestic supply chain for stable and assured supply.
To purchase Changxin CXDQ3A8AM-IJ-A DDR4 SDRAM chips or learn more about memory chip and brand evaluation board supply information, please contact us anytime!
Contact Information
Phone: +86 13410018555
Email: sales@hkmjd.com
Website: www.integrated-ic.com
Your message must be between 20-3,000 characters!
English
