company blog about In Stock: Xilinx (AMD) XCZU19EG-2FFVC1760E —— Zynq UltraScale+ MPSoC High-End Programmable Logic Device

Shenzhen Mingjiada Electronics Co., Ltd. offers brand-new, genuine, in-stock supply of the high-end AMD Xilinx Zynq UltraScale+ MPSoC series device—XCZU19EG-2FFVC1760E.

XCZU19EG-2FFVC1760E Product Overview

The XCZU19EG-2FFVC1760E belongs to the EG (Embedded GPU) devices within AMD Xilinx's Zynq UltraScale+ MPSoC series, manufactured using 16nm FinFET+ process technology. This device tightly integrates a Processing System (PS) with Programmable Logic (PL), delivering unprecedented system integration and performance-per-watt efficiency. It supports a wide range of application scenarios from edge computing to cloud acceleration.

XCZU19EG-2FFVC1760E Key Features:

Quad-core ARM Cortex-A53 64-bit application processor (up to 1.5GHz)

Dual-core ARM Cortex-R5 32-bit real-time processor (up to 600MHz)

Mali-400 MP2 graphics processor (supports OpenGL ES 1.1/2.0)

Large-scale programmable logic with up to 1,968K logic cells

16nm FinFET+ advanced process for low-power, high-performance operation

XCZU19EG-2FFVC1760E Core Technical Specifications

Manufacturer: AMD (formerly Xilinx)

Product Series: Zynq UltraScale+ MPSoC

Device Model: XCZU19EG-2FFVC1760E

Speed Grade: -2 (Medium Speed Grade)

Temperature Grade: Extended (E): 0°C to +100°C

Package Type: FFVC1760 (Fine-Pitch Flip-Chip BGA)

Package Dimensions: 42.5mm × 42.5mm

Pin Count: 1760 pins

Pin Pitch: 1.0mm

System Logic Cells: 1,968,000

Flip-Flops: 1,790,400

LUTs (Look-Up Tables): 895,200

DSP Slices (DSP48E2): 1,968

Block RAM (36Kb blocks): 1,104 (total 39.8Mb)

UltraRAM (288Kb blocks): 960 (total 270Mb)

Total On-Chip Memory: 309.8Mb

GTH Transceivers (16.3Gbps): 72

GTY Transceivers (32.75Gbps): 0 (EG devices lack GTY)

PCIe Gen3 x16: Supported (hardwired)

100G Ethernet: Supported (hardwired)

ARM Cortex-A53: 4 cores, 64-bit, up to 1.5GHz

ARM Cortex-R5: 2 cores, 32-bit, up to 600MHz

Mali-400 MP2 GPU: Supports OpenGL ES 1.1/2.0

Video Codec: H.264/H.265 4K60 encoding/decoding

Security Features: Supports TrustZone, Secure Boot, Cryptographic Engine

Operating Voltage: 0.72V (Core) / 0.85V (BRAM) / 1.8V (Auxiliary)

XCZU19EG-2FFVC1760E Processing System (PS) Detailed Specifications

1. Application Processing Unit (APU)

CPU: Quad-core ARM Cortex-A53 MPCore (64-bit)

Max Frequency: 1.5GHz (-2 speed grade)

L1 Cache: 32KB instruction + 32KB data cache per core

L2 Cache: 1MB shared cache

NEON SIMD Engine: Supports advanced single instruction multiple data operations

Floating-Point Unit: IEEE-754 compliant double-precision floating-point

2. Real-Time Processing Unit (RPU)

CPU: Dual-core ARM Cortex-R5F (32-bit, with FPU)

Maximum Frequency: 600MHz

L1 Cache: 32KB instruction + 32KB data cache per core

Tightly Coupled Memory (TCM): 128KB per core

Lock-step Mode: Supports dual-core lock-step for functional safety

3. Graphics Processing Unit (GPU)

Model: Mali-400 MP2

Supported APIs: OpenGL ES 1.1/2.0, OpenVG 1.1

Max Resolution: 1080p60

4. Video Processing Unit (VPU)

H.264/H.265 Codec: Supports 4K@60fps

Multi-standard Support: AVC, HEVC, VP9, AV1 (partial support)

XCZU19EG-2FFVC1760E Programmable Logic (PL) Detailed Specifications

1. Logic Resources

System Logic Cells: 1,968,000

CLBs (Configurable Logic Blocks): 224,640

Flip-Flops: 1,790,400

LUTs: 895,200 (6-input LUT)

2. Memory Resources

Block RAM (36Kb): 1,104 blocks (39.8Mb)

UltraRAM (288Kb): 960 blocks (270Mb)

Total On-Chip Memory: 309.8Mb

3. DSP Resources

DSP48E2 Slices: 1,968

Performance: 27×18-bit multiply-accumulate per slice

Total Performance: Up to 12.7 TMAC/s

4. High-Speed Transceivers

GTH Transceivers: 72

Line Rate: 16.3 Gbps (Maximum)

Supported Protocols: PCIe Gen3/4, 10G/25G Ethernet, Interlaken, Aurora, etc.

XCZU19EG-2FFVC1760E Key Features

1. High System Integration

Single-chip integration of multi-core processor, GPU, FPGA logic, and high-speed transceivers

Reduces board-level component count, lowers system cost

High-bandwidth, low-latency interconnect between processor and FPGA (AXI4 interface)

2. Hardware Security Module

ARM TrustZone technology support

Secure Boot

Hardware encryption engine (AES-256/SHA-384/RSA-4096)

Physically Unclonable Function (PUF)

3. Advanced Power Management

Separation of Full Power Domain (FPD) and Low Power Domain (LPD)

Dynamic Voltage and Frequency Scaling (DVFS)

Multiple low-power modes (Suspend, Power-off)

4. Extensive Peripheral Interfaces

USB 3.0/2.0 (with PHY)

SATA 3.1 (6Gbps)

DisplayPort 1.2 (4K@60fps)

NAND/SD/eMMC Storage Interfaces

Quad-SPI Flash Interface

I2C, SPI, UART, CAN-FD, Ethernet, etc.