[Shenzhen, April 27, 2026] As the global electric vehicle (EV) market accelerates its transition toward 800V high-voltage platforms and higher energy efficiency, the technological evolution of power semiconductors—the “heart” of EV powertrains—is becoming a focal point for the industry. Infineon Technologies, a global leader in power semiconductors and automotive-grade chips, is seeing its latest-generation HybridPACK™ Drive G2 series power modules being widely adopted in the next-generation platforms of major automakers. Meanwhile, to support market technology upgrades and supply chain inventory optimization, professional component distributor Shenzhen Mingjiada Electronics Co., Ltd. has announced that, effective immediately, it will offer high-value buyback services for Infineon’s HybridPACK™ Drive G2 and G1 series modules worldwide, helping manufacturers resolve inventory turnover issues during production transitions.
Technological Innovation: A Performance Leap from G1 to G2
The HybridPACK™ Drive G2 is a major upgrade launched by Infineon following the market validation of the G1 series, which has surpassed cumulative sales of 10.5 million units. While maintaining a compact form factor, this series achieves a significant leap in power density and is specifically designed for traction inverters in electric vehicles (EVs) and hybrid electric vehicles (HEVs).
Flexible Material Combinations (Si & SiC):
The G2 series’ most notable technical feature is its high scalability. It not only includes silicon-based IGBT modules based on EDT3 technology to provide cost-effective solutions but also introduces the highly anticipated CoolSiC™ G2 MOSFET version. For vehicles optimized for maximum range, Infineon has also introduced the HybridPACK™ Drive G2 Fusion solution. This module achieves system efficiency close to that of an all-SiC solution using only approximately 30% SiC and 70% silicon by area, significantly reducing BOM costs.
Leading Performance Parameters:
The module covers 750V and 1200V voltage ratings, with a power output range of up to 300kW. This means a single module, roughly the size of a palm, can power a wide range of vehicles, from compact sedans to premium SUVs.
Unmatched Durability and Integration:
To withstand the harsh automotive operating environment, the G2 module features optimized PinFin substrate direct cooling technology and improved pin-riveting processes, ensuring high reliability across extreme temperatures ranging from -40°C to 175°C. Additionally, the modules integrate on-chip temperature sensors and optional high-precision current sensors (such as XENSIV™), simplifying inverter system design.
Market Applications: The “Power Chip of Choice” for Leading Automakers
The Infineon HybridPACK™ Drive G2 series has already gained favor among major global automakers. Rivian, a leading U.S. electric vehicle manufacturer, has announced that its next-generation R2 platform will fully adopt Infineon’s HybridPACK™ Drive G2 series SiC and Si modules, with deliveries expected to begin in 2026. This partnership underscores the G2 series’ significant advantages in enhancing vehicle range and performance.
Industry Collaboration: Mingjiada Electronics Launches Dedicated G2 Module Procurement
As the HybridPACK™ Drive G2 series becomes the mainstream choice for next-generation electric drive platforms, the supply chain is facing inventory adjustments driven by technological upgrades. To address inventory backlogs experienced by original equipment manufacturers (OEMs) and Tier 1 suppliers during production transitions, Shenzhen Mingjiada Electronics Co., Ltd., leveraging its three decades of deep expertise in electronic component distribution and recycling, is launching a dedicated procurement service for Infineon’s automotive-grade power modules, effective immediately, targeting both domestic and international markets.
Key Focus of the Buyback:
Popular Models: Specifically, the HybridPACK™ Drive G2 series (including G2 Fusion hybrid solution models) and the full range of inventory from the previous-generation HybridPACK™ Drive G1 series.
Scope: Not limited to power modules, but also including Infineon’s EasyPACK™ and PrimePACK™ series SiC modules, as well as automotive-grade CoolSiC™ MOSFET discrete devices.
Why Choose Mingjiada Electronics?
Strong Credentials: Established in 1996, we hold dual ISO 9001/ISO 14001 certifications and maintain a global supply chain network.
Professional and Efficient: Equipped with military-grade testing capabilities (X-ray fluorescence spectrometers, semiconductor parameter analyzers, etc.), we ensure the elimination of counterfeit and refurbished products.
Strong Financial Backing: We support spot trading, offer a 48-hour fast payment mechanism, and facilitate bulk purchases of both small batches (minimum 50 pieces) and large inventory lots.
Service Process: We provide a one-stop, closed-loop service covering “Part Number Evaluation—Quick Quotation—Logistics Inspection—24-Hour Payment.” Customers can request real-time quotes via email (chen13410018555@163.com) or QQ: 1668527835).
Conclusion
Infineon’s HybridPACK™ Drive G2 series is redefining the power boundaries of electric vehicles, and a well-established supply chain cycle is the cornerstone of healthy technological development. Whether you are seeking design options for the latest generation of high-efficiency power modules or need to manage inventory of the previous-generation G1 or surplus G2 modules, Mingjiada Electronics can provide professional solutions.
About Mingjiada Electronics:
Shenzhen Mingjiada Electronics Co., Ltd. was established in 1996. Headquartered in Shenzhen, the company has branches in Hong Kong, Guangzhou, and other locations. As a globally renowned independent distributor of electronic components and a recycling service provider, the company has long been committed to providing high-quality chip supply and inventory optimization services to the global automotive, industrial, telecommunications, and consumer electronics markets.
Business Inquiries:
Contact: Mr. Chen
Phone: +86 13410018555 / 0755-83957301
Email: sales@hkmjd.com
Address: Rooms 1239-1241, Tower B, Guoli Building, Phase II, New Asia, Zhenzhong Road, Futian District, Shenzhen
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