Shenzhen Mingjiada Electronics Co., Ltd. specializes in supplying the full range of Infineon IGBT power modules. We currently have brand-new, genuine FP50R12W2T7 modules in stock. This is a three-phase input rectified PIM (Power Integrated Module) utilizing the seventh-generation TRENCHSTOP™ IGBT7 technology, specifically designed for industrial applications such as motor drives, auxiliary inverters, and air conditioning systems. It features ultra-low saturation voltage drop, 175°C overload capability, and PressFIT crimping technology.
FP50R12W2T7 Product Overview
The FP50R12W2T7 is an Infineon EasyPIM™ 2B three-phase PIM (Power Integrated Module) based on the seventh-generation TRENCHSTOP™ IGBT7 trench-gate field-stop technology. Specifications: 1200V/50A. Integrates IGBTs, fast diodes, and NTC temperature sensors into a single unit. Designed specifically for industrial frequency conversion, servo systems, UPS, and renewable energy equipment, it offers low loss, high overload capacity, and long service life.
Specifications
Manufacturer: Infineon
Model: FP50R12W2T7 (FP50R12W2T7_B11)
Package: EasyPIM™ 2B (56.7×48mm)
Voltage / Current: VCE = 1200V, IC = 50A (100A peak)
IGBT Technology: TRENCHSTOP™ IGBT7 (7th Generation Trench Gate)
Saturation Voltage Drop: VCE(sat) = 1.5V @ 25°C (Low Loss)
Diode: 7th-generation emitter-controlled fast diode
Operating Temperature: -40°C to +175°C (high overload)
Insulation Voltage: 2.5 kV AC / 1 minute
Integrated: NTC thermistor (temperature sensing)
Mounting: PressFIT crimp pins, easy to assemble, high reliability
FP50R12W2T7 Features
• Electrical Characteristics
- VCES = 1200 V
- IC nom = 50 A / ICRM = 100 A
- Trench-gate IGBT7
- Overload operation up to 175°C
- Low VCEsat
• Mechanical Characteristics
- Low thermal resistance Al₂O₃ substrate
- Welding technology
- High power density
- Compact design
- 2.5 kV AC 1-minute insulation
FP50R12W2T7 Recommended Applications
• Air conditioning
• Auxiliary inverters
• Motor drives
Package Overview
The FP50R12W2T7 is housed in an Infineon EasyPIM™ 2B standard power module package with the following specifications:
Package Dimensions (L × W): 56.7 mm × 48 mm
Height: 12 mm
Lead Type: PressFIT (FP50R12W2T7_B11 version) or soldered leads (FP50R12W2T7 standard version)
Substrate Material: Al₂O₃ Aluminum Oxide Ceramic
Mounting Method: Surface Mount / Through-Hole Compatible
All products supplied by Mingjiada Electronics are brand-new, genuine, and authentic, ensuring chip quality and eliminating non-genuine sources such as refurbished, counterfeit, or loose-packaged goods. Whether you require samples, small-batch purchases, or large-scale production supplies, Mingjiada Electronics can provide flexible supply solutions and highly competitive pricing.
Contact Information:
Contact Person: Mr. Chen
Phone: +86 13410018555
Email: sales@hkmjd.com
Website: https://www.integrated-ic.com/
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