company blog about Infineon SAK-TC399XX-256F300S BD 32-Bit Single-Chip Automotive AURIX™ TC3 MCU

Shenzhen Mingjiada Electronics Co., Ltd. supplies and recycles the Infineon SAK-TC399XX-256F300S BD 32-bit single-chip automotive-grade AURIX™ TC3 MCU.

The Infineon SAK-TC399XX-256F300S BD is a high-end 32-bit single-chip automotive-grade microcontroller (MCU) within the AURIX™ TC3 series. Built on an innovative multi-core architecture and 40nm embedded flash technology, it is specifically designed to meet the stringent demands of the automotive electronics sector for high performance, high security and high reliability. It is widely applicable to core control scenarios in the new generation of smart vehicles and is one of Infineon’s flagship products launched to support the transition towards automotive electrification and intelligentisation. As a second-generation AURIX™ MCU, this chip delivers comprehensive upgrades in computing power, memory, connectivity and security. It fully complies with automotive safety standards such as ISO 26262, providing stable and efficient core computing power support for automotive electronic control systems.

I. Core Product Positioning and Design Philosophy

The SAK-TC399XX-256F300S BD is focused on automotive-grade safety-critical applications. With a core design philosophy of “high-performance multi-core collaboration + comprehensive security protection + flexible scalability and adaptability”, it resolves the traditional trade-off between computing power and security in MCUs. This single-chip solution integrates multi-core processing, large-capacity memory, a wealth of peripheral interfaces and hardware security modules, enabling it to handle complex control tasks without the need for additional auxiliary chips. This effectively simplifies the hardware design of automotive electronic control systems, reduces R&D costs and PCB layout space, whilst meeting the automotive industry’s core requirements for long-term stability, immunity to interference and wide-temperature adaptability. It is suitable for a full range of applications, from traditional internal combustion engine vehicles to new energy vehicles, and from basic control to advanced driver assistance systems.

II. Key Technical Features of the SAK-TC399XX-256F300S BD

Multi-core Architecture and Robust Computing Power

The SAK-TC399XX-256F300S BD employs an advanced six-core TriCore™ 32-bit processor architecture, with each core operating at a frequency of up to 300 MHz, and integrates four additional check cores, delivering a total computing power of up to 4,000 DMIPS. It possesses robust digital signal processing (DSP) capabilities, supporting both floating-point and fixed-point operations, and is capable of efficiently handling real-time control tasks involving complex algorithms in automotive electronic systems, such as powertrain control, chassis tuning, and Advanced Driver Assistance Systems (ADAS) data fusion. The TriCore™ architecture innovatively integrates RISC processing, DSP capabilities, and on-chip memory and peripheral control, achieving an optimal balance between computational power and energy efficiency. Compared to the previous generation, computational performance has been significantly enhanced, enabling it to effortlessly handle concurrent multi-tasking requirements and ensuring the real-time responsiveness of control systems.

Large-Capacity Storage and Reliable Protection

In terms of memory, the SAK-TC399XX-256F300S BD features up to 16MB of embedded flash memory and 6.9MB of static random-access memory (SRAM). All memory areas are equipped with ECC (Error Checking and Correction) functionality, which effectively detects and corrects data errors during storage, significantly enhancing data storage reliability and preventing system failures caused by data anomalies. Specifically, the flash memory supports program storage and firmware upgrades, including A/B Swap over-the-air (OTA) upgrade functionality, facilitating subsequent maintenance and functional iterations of automotive electronic systems; the SRAM provides high-speed cache support for real-time data processing, ensuring efficient data read/write operations. Furthermore, the chip incorporates a User-Configurable Block (UCB), allowing parameters such as the program start address and HSM function enablement to be configured according to user requirements, thereby flexibly adapting to different project needs. At the same time, its built-in private memory areas (such as PSPR and DSPR) offer fast access speeds and physical isolation, making them suitable for the efficient storage and processing of critical programs and data.

Comprehensive Security Protection System

As an automotive-grade safety-critical MCU, the SAK-TC399XX-256F300S BD strictly adheres to the ISO 26262/IEC 61508 standards, supports the highest ASIL-D safety level, and features a comprehensive hardware security protection mechanism. The chip integrates a complete HSM (Hardware Security Module, EVITA Full level) and a built-in PKC (Public Key Cryptography Module), enabling hardware acceleration of the Chinese national SM2 algorithm. It also supports various elliptic curve cryptography operations, including NIST and Brainpool, providing hardware-level support for data encryption, identity authentication and firmware tamper protection in automotive electronic systems, thereby effectively defending against cyber attacks and malicious tampering. Furthermore, the chip is equipped with security mechanisms such as a locked kernel, LBIST (Logic Built-in Self-Test) and redundant locked-loop kernels, enabling rapid detection and response to system faults. This ensures the stable operation of safety-critical applications and reduces the risk of system failure.

Extensive Peripheral Interfaces and Flexible Connectivity

To meet the diverse connectivity requirements of automotive electronic systems, the SAK-TC399XX-256F300S BD integrates a comprehensive range of peripheral interfaces, covering various communication protocols and control interfaces commonly used in the automotive sector. These include 1 Gigabit Ethernet (1 GbE), 12 CAN channels (including CAN FD), 2 FlexRay channels and 12 ASCLIN channels, meeting the requirements for multi-node, high-speed data transmission within vehicles and supporting various scenarios such as body bus, powertrain bus and ADAS bus; Storage and expansion interfaces include 6 QSPI, 2 I²C, 1 I²S, 2 HSSL, 4 MSC, and 1 eMMC/SDIO, supporting external storage expansion and multi-device interconnection; Control interfaces include 25 SENT channels, 4 PSI5 channels, 1 PSI5S channel, and over 100 ADC input channels (supporting 10-bit and 12-bit resolution), enabling precise acquisition and control of various automotive sensor signals. Furthermore, the chip integrates 128 DMA channels and a variety of redundant timer modules such as GTM, CCU6 and GPT12, further enhancing the system’s control flexibility and data processing efficiency.

Low Power Consumption and Wide Temperature Adaptability

Designed for the specific operating environments of automotive electronics, the SAK-TC399XX-256F300S BD offers excellent low-power performance and wide temperature adaptability. The chip employs a single-supply power design, supporting 5V or 3.3V power supplies, with normal operating power consumption below 2W. It also integrates an SCR (Standby Controller) module—an 8-bit microcontroller based on the XC800 core, located in a separate power domain—which can operate independently when the main CPU is shut down or reset, enabling low-power management of tasks such as network wake-up and effectively reducing the vehicle’s overall energy consumption. The temperature operating range spans from -40°C to +125°C (with support for up to +150°C in certain scenarios), enabling it to withstand extreme temperature fluctuations in harsh automotive environments such as the engine compartment and chassis. It also possesses strong electromagnetic compatibility (EMC) capabilities, meeting the stringent testing standards of the automotive electronics industry to ensure long-term, stable operation in complex environments.

III. Typical Application Scenarios for the SAK-TC399XX-256F300S BD

Thanks to its robust computing power, comprehensive security protection and extensive peripheral interfaces, the SAK-TC399XX-256F300S BD is widely used in multiple core areas of automotive electronics. It is particularly suited to high-end control scenarios arising from the evolution of E/E (Electrical/Electronic) architectures, specifically including:

- Powertrain Domain Controller: Suitable for engine control, transmission control, motor control and battery management systems (BMS) in petrol, hybrid and pure electric vehicles, enabling precise regulation of power output and high energy efficiency.

- Chassis Domain Controllers: Used for Electronic Stability Programme (ESP), Electric Power Steering (EPS), and braking control systems (such as ABS and AEB), enhancing vehicle stability and safety.

- ADAS/Autonomous Driving Controllers: Supporting Level 2 and above driver assistance, these controllers are used for environmental perception data fusion, path planning, and decision-making control, and are suitable for multi-sensor fusion scenarios involving radar, lidar, and cameras.

- Zone Controllers and Gateways: As the core of the vehicle’s centralised electronic/electrical architecture, these enable data exchange and management between ECUs in different zones. For instance, the zone controller in the Changan Qiyuan A06 utilises this chip to support the stable operation of a centralised + zone ring network architecture.

- Other Safety-Critical Applications: These include Body Control Modules (BCM), airbag control, and high-voltage safety control for new energy vehicles, meeting safety level requirements across various scenarios.

IV. Product Advantages of the SAK-TC399XX-256F300S BD

Leading Computing Power: A six-core 300MHz TriCore™ architecture, paired with four check cores, delivers 4,000 DMIPS of computing power. This enables efficient processing of complex algorithms and concurrent multitasking, meeting the demands of high-end automotive control systems.

Safety and Reliability: Supports the highest safety level, ASIL-D, and integrates an HSM hardware security module with multiple security protection mechanisms to ensure the stable operation of safety-critical applications, meeting the stringent standards of the automotive industry.

High Integration: A single chip integrates large-capacity storage, a wealth of peripheral interfaces and security modules, eliminating the need for additional auxiliary chips, simplifying hardware design and reducing R&D and production costs.

Flexible Adaptability: Supports the AUTOSAR software architecture and is compatible with multiple operating systems and development tools. It also features UCB configuration capabilities and a rich set of interfaces, making it suitable for various automotive electronics application scenarios and enabling flexible expansion.

Strong Environmental Adaptability: With a wide temperature range design and low-power characteristics, coupled with excellent electromagnetic interference (EMI) resistance, it can operate stably over the long term in harsh automotive environments, enhancing system reliability.

V. Summary of the SAK-TC399XX-256F300S BD

As a high-end automotive-grade MCU in the AURIX™ TC3 series, the Infineon SAK-TC399XX-256F300S BD, with its core strengths of multi-core high computing power, comprehensive security protection, high integration and wide environmental adaptability, has become the ideal core component for next-generation intelligent automotive electronic control systems. It not only meets the stringent performance and safety requirements of today’s automotive electronics but is also capable of adapting to the evolution of future automotive E/E architectures and the trends in advanced driver assistance and autonomous driving, providing robust technical support for the upgrading and transformation of the automotive electronics industry. Whether for the retrofitting of traditional internal combustion engine vehicles or the innovative R&D of new energy vehicles and smart cars, this chip plays a pivotal role in helping enterprises develop more competitive automotive electronic products.