company blog about Mingjiada Electronics: In-Stock Supply and Professional Recycling of Xilinx High-Integration SoC FPGA Chip XAZU3EG-1SFVC784Q

[Mingjiada Electronics] Automotive-Grade Extended Temperature Heterogeneous Computing Core! Xilinx XAZU3EG-1SFVC784Q Zynq UltraScale+ MPSoC Supply and Recycling

Product Introduction: XAZU3EG-1SFVC784Q

The XAZU3EG-1SFVC784Q is a high-end automotive-grade heterogeneous computing platform from AMD (formerly Xilinx) within the Zynq® UltraScale+™ MPSoC EG series. Certified to AEC-Q100 Grade 2, this device supports an extended operating temperature range from -40°C to +125°C. Packaged in a 784-pin FCBGA (23mm×23mm), it provides up to 252 programmable I/Os, delivering powerful computing capabilities for next-generation ADAS (Advanced Driver Assistance Systems), autonomous driving domain controllers, and industrial edge computing.

XAZU3EG-1SFVC784Q Core Specifications

Core Architecture

Heterogeneous Multi-core Design:

- 4x ARM Cortex-A53 (64-bit architecture, up to 1.0GHz)

- 2x ARM Cortex-R5 (real-time processing cores, up to 600MHz)

- 1x Mali-400 MP2 GPU (supports OpenGL ES 2.0 graphics acceleration)

FPGA Logic Resources

- Logic Cells: 25,400

- Lookup Tables (LUTs): 25,400

- Flip-Flops: 50,800

- Block RAM: 1.3Mb (includes UltraRAM for high-speed data caching)

- DSP Slices: 60 (supports high-precision digital signal processing and AI algorithm acceleration)

Memory Interfaces

- 2x DDR4/DDR4L/LPDDR4 controllers (supports ECC error correction, up to 2133Mbps)

- On-chip OCM (On-Chip Memory): 256KB

- Supports external storage expansion via QSPI Flash, NAND Flash, eMMC, etc.

Peripherals and Communication Interfaces

- 2x Gigabit Ethernet (supports TSN time-sensitive networking for industrial real-time communication)

- 2x USB 3.0 (backward compatible with USB 2.0/1.1, supports OTG functionality)

- 4x UART, 4x I2C, 4x SPI (serial communication interfaces)

- 2x CAN FD (automotive-grade interface), 1x I2S (audio interface)

- Multi-channel GPIO, ADC interfaces, supporting PCIe Gen2 x4 high-speed protocol

Power & Power Consumption

- Core supply voltage: 0.8V-1.0V

- Typical power consumption: 3.5W (at full load)

- Supports low-power modes including deep sleep and standby, with power consumption as low as microampere level

Package and Environment

- Package type: 784-pin SFVC (BGA package), dimensions 27mm × 27mm

- Operating Temperature Range: -40°C to +100°C (Industrial Grade Standard)

- Moisture Sensitivity Level: MSL 3 (Compliant with IPC/JEDEC Standards)

- Immunity: Supports ESD Protection, Suitable for Complex Industrial Electromagnetic Environments

Security and Reliability

- Integrated Hardware Cryptographic Engine (AES-256, SHA-256)

- Supports secure boot and tamper-proofing, compliant with PSA Level 3 security certification

- Select versions certified to AEC-Q100 Grade 2 automotive electronics standards

This chip is suitable for applications demanding extreme reliability and performance, such as industrial IoT gateways, machine vision, advanced driver assistance systems, communication equipment, and high-end consumer electronics.

Professional High-Value Recycling Service:

Mingjiada Electronics offers long-term electronic component recycling services, explicitly covering all categories of integrated circuits. Specifically listed are Xilinx's Zynq series FPGA products.

Therefore, the company provides specialized recycling for XAZU3EG-1SFVC784Q and similar chips. Advantages include global coverage, high-value cash recycling, and professional team evaluation.

Primary Contact Information:

Phone: +86 13410018555 (Mr. Chen, Recycling Services) or 0755-83294757 (Company Switchboard)

Email: sales@hkmjd.com (Sales & General Inquiries)

Address: Room 1239-1241, Xin Asia Guoli Building, Zhenzhong Road, Futian District, Shenzhen, Guangdong Province