As a leading supplier of electronic components, Shenzhen Mingjiada Electronics Co., Ltd. leverages its global supply chain network and rigorous quality control system to offer brand-new, genuine XC7Z100-2FFG1156I—a high-end model in the Zynq-7000 series. We guarantee that all products are genuine OEM items with traceable origins, and we support both small-batch R&D and large-scale mass production needs.
XC7Z100-2FFG1156I Product Description
The XC7Z100-2FFG1156I is a high-performance PSoC/MPSoC programmable system-on-chip (SoC) from the Xilinx Zynq-7000 series. It integrates a dual-core ARM Cortex-A9 processor with Kintex-7 architecture programmable logic (FPGA), is manufactured using a 28nm process, operates at a clock speed of 800 MHz, and is packaged in an FCBGA-1156 package. with an industrial-grade temperature range of -40°C to +100°C. It serves as a core computing platform for high-end embedded systems, industrial control, communications, image processing, and smart hardware.
This chip deeply integrates the processor system (PS) with programmable logic (PL), combining software flexibility with hardware parallel acceleration capabilities. Equipped with high-capacity memory interfaces, high-speed communication peripherals, and rich DSP resources, it meets the demands of real-time processing, protocol acceleration, interface expansion, and heterogeneous computing. It is widely used in industrial automation, machine vision, data acquisition, communication equipment, automotive electronics, medical instruments, and high-end embedded systems.
Key Specifications
Product Model: XC7Z100-2FFG1156I
Product Series: Zynq-7000 All Programmable SoC
Processor Architecture: Dual-core ARM Cortex-A9, 800 MHz
Programmable Logic: Kintex-7 architecture, approximately 444K logic cells
Package: FCBGA-1156 (Fine-Pitch Ball Grid Array)
Temperature Grade: Industrial Grade I, -40°C to +100°C
Speed Grade: -2 High-Performance
Supported Interfaces: PCIe Gen2, Gigabit Ethernet, USB 2.0, SD/SDIO, DDR3/DDR3L/LPDDR2, etc.
Application Types: PSoC / MPSoC microprocessors, embedded heterogeneous computing, FPGA-accelerated controllers
Core Architecture and Technical Features
The core advantage of the XC7Z100-2FFG1156I lies in its heterogeneous computing architecture—seamlessly integrating a high-performance processor system (PS) with high-density programmable logic (PL). The two are interconnected via an on-chip high-speed bus, enabling low-latency, high-bandwidth data exchange.
1. Processor System (PS) — Dual-core ARM Cortex-A9
CPU Cores: Dual-core ARM Cortex-A9 MPCore, supporting Symmetric Multi-Processing (SMP); each core integrates a NEON™ SIMD multimedia coprocessor and a floating-point unit (FPU), with single-core performance reaching 2.5 DMIPS/MHz
Cache System:
L1 Cache: 32KB instruction cache + 32KB data cache per core
L2 Cache: 512 KB (shared between both cores)
On-Chip Memory: 256 KB on-chip memory (OCM) with ECC error correction option
External Memory Interface: Supports DDR3/DDR3L/LPDDR2 with a maximum 32-bit bus width to meet high-bandwidth data throughput requirements
DMA Controller: 8-channel DMA controller supporting efficient data transfer
2. Programmable Logic (PL) — Kintex-7 FPGA
Logic Resources: 444,000 logic cells, including a large number of look-up tables (LUTs) and flip-flops
DSP Slices: A large number of DSP48E1 slices, supporting 18×25 signed multiplication and 48-bit accumulators, suitable for high-performance digital signal processing
Block RAM: 26.5 Mbit embedded block RAM (BRAM), supporting true dual-port operation, configurable as two 18Kb BRAMs
Programmable I/O: Supports multiple I/O standards including LVCMOS, LVDS, and SSTL, with a voltage range of 1.2V to 3.3V; provides programmable I/O delay and SerDes functionality
3. Extensive Peripheral Interfaces (PS Side)
Gigabit Ethernet: 2
USB 2.0 OTG: 2
SD/SDIO: 2
SPI: 2
I²C: 2
UART: 2
CAN 2.0B: 2
GPIO: Up to 128 pins
Timers/Watchdog: Multi-channel
4. Electrical Specifications and Packaging
Supply Voltage: Nominal supply voltage 1V, maximum 1.05V, minimum 0.95V
Maximum Clock Frequency: 800MHz
Number of I/Os: Up to 400 user I/Os
Package Dimensions: 35mm x 35mm, 1mm ball pitch
Number of Pins: 1156 balls, bottom-side BGA package
Temperature Grade: Industrial grade (-40°C to +100°C), meets requirements for harsh environmental applications
5. Advanced Features
CoreSight Debugging: Integrated ARM CoreSight™ debugging technology, supporting multi-core debugging and tracing
Security Features: Supports advanced security functions such as secure boot and cryptographic accelerators
Contact Us
If you have procurement needs for the XC7Z100-2FFG1156I or other models in the Zynq-7000 series, please feel free to contact Mingjiada Electronics at any time:
Contact: Mr. Chen / Sales Team
Mobile/WeChat: +86 13410018555
Phone: 86-755-83294757
Email: sales@hkmjd.com
Address: Rooms 1239-1241, New Asia Guoli Building, Zhenzhong Road, Futian District, Shenzhen, Guangdong Province
Website: https://www.integrated-ic.com/
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