company blog about Mingjiada Electronics Recycle RF Communications Chips, Recycle Starlink Chips, Starlink Control And Link Chips

Mingjiada Electronics Recycle RF Communications Chips, Recycle Starlink Chips, Starlink Control And Link Chips

Shenzhen Mingjiada Electronics Co., Ltd. — Specialising in the long-term recycling of telecommunications chips and Starlink chips, we focus on resolving inventory backlog challenges for telecommunications enterprises, aerospace R&D institutions, terminal manufacturers, and distributors. We facilitate the efficient monetisation of idle high-value chip assets and resource recycling, thereby supporting the closed-loop upgrading of the telecommunications and satellite industry chain.

Core Recycling Categories and Product Details
Recycling categories encompass core chips for the entire communication chain and Starlink satellite networks, prioritising genuine original products, highly scarce items, and mass-produced models. We also accommodate engineering surplus, project inventory, and bulk stockpiles. Mingjiada Electronics exclusively recycles goods sourced through legitimate channels—such as agents, traders, and terminal manufacturers—and does not accept non-compliant supplies.

I. Communication Chip Recycling
Encompassing three core categories: RF, control processing, and auxiliary components, suitable for diverse applications including 5G, IoT, and smart communication terminals. Key product details are as follows:
1. RF Communication Chips: As the ‘wireless throat’ of communication equipment, we prioritise high-integration, high-performance models from renowned domestic and international manufacturers including Skyworks, Qorvo, Murata, and Angruiwei. Specific items include low-noise amplifiers, power amplifiers (PA), RF switches, BAW/SAW filters, beamformers, and 5G L-PAMiD high-integration RF front-end modules. Key models include Anruiwei's 5G Phase7LE L-PAMiD module and Qorvo's QPA3069 GaN-based high-power amplifier, catering to high-end applications such as mobile satellite direct connectivity and 5G base stations.
2. Control and processing chips: Covering core computing and controller components for communication equipment, brands include NXP, TI, ST, Intel, etc. This includes ARM architecture MPUs/MCUs, FPGA/CPLD logic devices, and communication-specific processors such as NXP's i.MX series, ST's STM32V8 high-performance MCU (18nm process, clock frequency up to 800MHz, suitable for harsh industrial communication environments), and Intel's third-generation Core Ultra processors, meeting the demands of high-data-rate communication scenarios.
3. Auxiliary Communication Chips: Includes power management ICs, high-speed memory (DRAM, Flash), analogue-to-digital converters, and communication sensors. These support communication equipment power supply, data storage, and signal acquisition requirements, covering brands such as TI, Murata, and Samsung.

II. Starlink Chip Recycling
Focusing on core components for low Earth orbit (LEO) satellite networks, we prioritise recycling Starlink user terminals and inter-satellite link-specific chips. Leveraging industry resources, we precisely match high-value models. Key product details are as follows:
1. Starlink RF antenna chips: Core recovery targets BiCMOS-based RF front-end modules and antenna components, with STMicroelectronics (ST) as the primary brand. This includes RF antenna chips supplied to SpaceX's Starlink (cumulative shipments exceeding 5 billion units, with deliveries potentially doubling over the next two years). These chips support signal transmission/reception in Starlink user terminals and inter-satellite laser link transmission, forming the network's core components.
2. Starlink Control and Link Chips: Includes inter-satellite communication-specific FPGAs, radiation-hardened MCUs, and GNSS fusion chips from brands such as ST, Xilinx, and Renesas. These components withstand harsh space environments, support high-data-rate transmission and precise positioning, and meet the networking requirements of low-Earth orbit satellite constellations.
3. Starlink Supporting Components: Includes radiation-hardened power management ICs, high-reliability memory, and space-grade sensors. These address in-orbit power stability, secure data storage, and environmental monitoring requirements for satellites. Only genuine, space-qualified components are accepted for recycling.

Recycling Process:
1. Enquiry: Should you have surplus electronic components requiring disposal, please email (chen13410018555@163.com) details of the IC/module inventory for sale.
2. On-site Collection: Our company will dispatch specialists to collect your surplus electronic components, conducting preliminary testing and classification.
3. Quotation: Our company will provide a corresponding recycling price based on the type, quantity, and quality of the recovered components.
4. Settlement: Upon mutual agreement, specific transaction methods for delivery can be negotiated.

Should you have idle communication chips or Starlink chip inventory requiring disposal, please visit Mingjiada Electronics' official website (https://www.integrated-ic.com/) for further recycling details.