company blog about Mingjiada Supply Infineon CYBLE-022001-00 AIROC™ BT® LE Module — Fully Certified Turnkey BLE Solution

Infineon CYBLE-022001-00 AIROC™ Bluetooth® LE Module Product Overview

The CYBLE-022001-00 is a fully integrated, fully certified Bluetooth® Low Energy (BLE) embedded module from Infineon Technologies’ AIROC™ series. Based on a proven hardware design and featuring an Infineon PSoC™ 4 MCU alongside the AIROC™ Bluetooth® LE solution, this module is a turnkey solution ready for immediate production.

The CYBLE-022001-00 integrates an on-board crystal oscillator, chip antenna, passive components and the PSoC™ 4 controller within a compact 10 mm × 10 mm × 1.80 mm SMT package, enabling full BLE wireless communication functionality without the need for external RF components. The module has been certified to meet regulations in multiple countries, including FCC, ISED, MIC and CE, significantly reducing time-to-market.

Key Features

The CYBLE-022001-00 module offers the following core features:

Bluetooth and Wireless Performance

Bluetooth Standard: Compatible with Bluetooth® Core Specification version 5.1; SIG-certified (QDID 141250, Declaration ID U048555)

RF Frequency: 2.4 GHz ISM band

Transmit Power: Adjustable from –18 dBm to +3 dBm

Receive Sensitivity: –87 dBm to –91 dBm

Data Rate: 1 Mbps

Communication Range: Up to 100 metres (Class 2)

Processor and Memory

CPU Core: ARM® Cortex®-M0, maximum operating frequency 48 MHz

Flash memory: 128 KB

SRAM: 16 KB

Peripherals and Interfaces

GPIO: Up to 16 configurable GPIO pins

Serial communication: I²C, SPI, UART (2 Serial Communication Blocks (SCBs))

ADC: 12-bit, 1 Msps SAR ADC with internal reference and channel sequencer

PWM: 4 x 16-bit TCPWM modules

Capacitive Sensing: Supports up to 15 CapSense® capacitive sensors

Programming Interface: Two-wire SWD (Serial Wire Debug)

Power Consumption and Power Supply

Supply Voltage: 1.8 V to 5.5 V

Low-Power Modes:

Deep Sleep: 1.3 μA (WCO enabled)

Hibernate: 150 nA (SRAM hold)

Stop: 60 nA (XRES wake-up)

Package and Temperature

Package dimensions: 10.0 mm × 10.0 mm × 1.80 mm (including shield)

Operating temperature range: –40 °C to +85 °C (industrial grade)

Technical Specifications Summary

Model: CYBLE-022001-00

Brand: Infineon (formerly Cypress)

Series: AIROC™ Bluetooth® Module

Bluetooth Version: 5.1 (compatible with 4.1)

Core Chip: PSoC™ 4 MCU + AIROC™ BLE

CPU ARM® Cortex®-M0 @ 48 MHz

Flash / SRAM: 128KB / 16KB

Transmit Power: 3dBm (maximum)

Receive Sensitivity: -87dBm to -91dBm

Interfaces: I²C, SPI, UART

GPIO: 16

Supply Voltage: 1.8V – 5.5V

Dimensions: 10×10×1.80 mm

Operating temperature: -40°C to +85°C

Certifications: FCC, CE, MIC, KC, IC, Bluetooth SIG

Applications

The CYBLE-022001-00 is suitable for a wide range of BLE wireless connectivity scenarios:

Health and lifestyle devices (wearables, medical monitoring)

Battery Energy Storage Systems (BESS)

Single-phase string inverters

Offline UPS (high-frequency transformers)

Space-constrained embedded applications

Industrial IoT sensors and controllers

Why choose the CYBLE-022001-00?

Turnkey solution: The module incorporates an oscillator, antenna, passive components and a BLE protocol stack, making it ready for use straight out of the box

Global Certifications: Complies with FCC, CE, MIC, KC, IC and Bluetooth SIG certifications, significantly reducing certification costs and time

Ultra-compact size: 10×10 mm package, suitable for space-constrained designs

Industrial-grade temperature range: -40°C to +85°C, suitable for harsh environments

Ultra-low power consumption: Multiple low-power modes, suitable for battery-powered devices

Extensive peripherals: Integrated ADC, PWM, CapSense®, serial communication and more, reducing the need for external components

About Mingjiada

Mingjiada has long been a supplier of genuine Infineon AIROC™ series Bluetooth® modules. The CYBLE-022001-00 is currently in ample stock; please feel free to enquire and place your order.