With the rapid expansion of AI computing infrastructure, server power supplies face extremely stringent requirements for power density, conversion efficiency, and high-temperature reliability. Shenzhen Mingjiada Electronics Co., Ltd. offers spot supply and inventory buyback services for Infineon’s three CoolSiC™ SiC MOSFET series—IMBG75R, IMDQ75R, and IMZA75R—which are key components in building energy-efficient AI server power supplies.
Why Do AI Servers Need CoolSiC™ MOSFETs?
AI servers—especially systems equipped with high-power-consumption GPUs (such as the NVIDIA H100 and B200)—are seeing their power supply units (PSUs) evolve toward high power densities of 6.6 kW or even 12 kW. Traditional silicon-based MOSFETs suffer from high switching losses at high frequencies and high voltages, which has become a bottleneck for efficiency improvements.
Infineon’s second-generation 750V CoolSiC™ MOSFET G2 series is based on an advanced trench silicon carbide process. Compared to the previous generation, it offers a 20% to 35% improvement in the Figure of Merit (FOM), featuring ultra-low switching losses, exceptional thermal performance (supporting a maximum junction temperature of 175°C), and high robustness (100% avalanche test pass rate). These characteristics make them an ideal choice for totem-pole PFC and high-voltage DC-DC converters in AI server power supplies, helping to push system efficiency beyond 97%.
Analysis of the Three Series, Models, and Packages
The three series supplied by Mingjiada cover different power ranges and package types to meet the diverse design requirements of AI server power supplies:
1. IMBG75R Series (PG-TO263-7 Package)
Features: Surface-mount package with an integrated independent Kelvin Source pin, which effectively reduces the impact of parasitic inductance on the driver; suitable for automated SMT production lines; covers medium-power applications.
Available Models:
IMBG75R007M2H, IMBG75R007M2H, IMBG75R011M2H, IMBG75R016M2H, IMBG75R020M2H, IMBG75R025M2H, IMBG75R040M2H, IMBG75R050M2H, IMBG75R060M2H
2. IMDQ75R Series (PG-HDSOP-22 Package)
Features: Utilizes a Q-DPAK package with top-side cooling (TSC), specifically designed for compact, high-power-density applications. This series supports ultra-high current (e.g., up to 357 A for 4 mΩ models), making it ideal for high-current scenarios in 12 kW AI server PSUs where parallel connection of multiple devices is not required.
Available Models:
IMDQ75R011M2H, IMDQ75R020M2H, IMDQ75R033M2H, IMDQ75R050M2H
3. IMZA75R Series (PG-TO247-4 Package)
Features: Through-hole package for easy heatsink installation and replacement. The 4-pin design includes a Kelvin source terminal to eliminate parasitic inductance interference in high-current paths, commonly used in high-voltage DC-DC conversion.
Available Models:
IMZA75R007M2H, IMZA75R011M2H, IMZA75R016M2H, IMZA75R020M2H, IMZA75R025M2H, IMZA75R033M2H, IMZA75R050M2H
Note: The numbers in the model numbers (e.g., 007, 011, 060) typically represent the on-resistance (RDS(on)) rating; the smaller the number, the lower the resistance, and the higher the current-carrying capacity.
Shenzhen Mingjiada Electronics Co., Ltd. stocks the above series of genuine, original products and also provides inventory buyback services to the entire industry. For details, please contact their Shenzhen office to obtain the latest inventory information and quotes.
Contact Information
Contact: Mr. Chen
Mobile: +86 13410018555
Email: sales@hkmjd.com
Website: https://www.integrated-ic.com/
Address: Rooms 1239–1241, Guoli Building, Zhenzhong Road, Futian District, Shenzhen
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