company blog about Mingjiada Supply/Recycle Infineon CYW55572MIUBG High-Performance Wi-Fi 6 + BT 5.3 SoC

Mingjiada Supply/Recycle Infineon CYW55572MIUBG High-Performance Wi-Fi 6 + BT 5.3 SoC

I. Product Overview
The Infineon AIROC™ CYW55572MIUBG is a highly integrated wireless communication system-on-chip (SoC) belonging to the AIROC™ Wi-Fi 6 and Bluetooth® combo chip family. The chip supports Wi-Fi 6 (802.11ax) dual-band (2.4 GHz/5 GHz) 2x2 MIMO technology and integrates Bluetooth® 5.3 dual-mode functionality, designed specifically for edge AI, IoT end devices and embedded systems requiring high-performance wireless connectivity.
The CYW55572MIUBG is housed in a 225-BGA (WLBGA) package and operates within a temperature range of -40°C to 85°C, making it suitable for demanding industrial and commercial environments. Built on an Arm Cortex-M33 coprocessor, the chip offers powerful data processing capabilities and flexible scalability.
Shenzhen Mingjiada Electronics Co., Ltd. — specialising in the distribution of wireless RF components and the recovery of idle stock — maintains a stock of brand-new, original CYW55572MIUBG units; simultaneously, the company offers high-value buyback services for idle end-of-line stock and returned wireless chips from the CYW55572 series to electronics manufacturers, solution providers and traders.

II. Key Specifications (CYW55572MIUBG)
1. Wi-Fi 6 Wireless Baseband RF Specifications
Wireless Standard: IEEE 802.11ax Wi-Fi 6, 2.4GHz + 5GHz dual-band, 2x2 MIMO dual-antenna architecture
Channel Bandwidth: 20MHz/40MHz/80MHz, supports 1024-QAM high-order modulation, physical layer peak data rate of 1.2Gbps
Wi-Fi 6 Core Technologies: OFDMA, MU-MIMO multi-user concurrent transmission, TWT (Target Wake Time), DCM (Dual Carrier Modulation); outstanding interference resistance in dense networks
On-chip integrated RF power amplifier (PA) and low-noise amplifier (LNA); no external RF matching components required, reducing BOM costs
Operating Modes: Compatible with both STA (Station) and SoftAP (Soft Access Point) dual modes
2. Full Bluetooth 5.3 RF Capabilities
Bluetooth Standard: Bluetooth 5.3 dual-mode, compatible with traditional Bluetooth (BR/EDR) and BLE (Bluetooth Low Energy), supporting LE Audio and Auracast™ audio broadcasting
Three adjustable transmit power levels: 0 dBm, 13 dBm and 20 dBm, balancing low power consumption for wearables with long-range industrial communication
Bluetooth extension capabilities: 2 Mbps high-speed BLE, long-range communication, extended broadcasting; Bluetooth and Wi-Fi hardware coexistence to avoid co-channel interference
Dedicated audio interfaces: PCM/I2S lossless audio transmission, compatible with speakers, video doorbells and robotic voice interaction devices
3. Kernel, Storage and Host Communication Interfaces
Dual independent processing cores: Cortex-R4 for Wi-Fi and Cortex-M33 for Bluetooth; wireless protocol stacks run independently, freeing up the host’s processing power
On-board storage: 2048KB ROM + 512KB SRAM; comes pre-loaded with complete original firmware, eliminating the need for external Flash
High-speed host interfaces: SDIO 3.0 / PCIe Gen 2 for Wi-Fi; 4-wire high-speed UART for Bluetooth; 15 general-purpose GPIO pins
Supply voltage: Wide input range of 3V–4.8V, suitable for battery-powered portable devices and industrial DC power supply scenarios

III. Core Features and Technical Advantages (CYW55572MIUBG)
Wi-Fi 6, dual-band, 2x2 MIMO
20/40/80 MHz, PHY data rate up to 1.2 Gbps
OFDMA, MU-MIMO, TWT, DCM
Enhanced range, power efficiency and network efficiency
Multi-layered security protection
Intelligent coexistence
Temperature range: -40°C to 85°C
Bluetooth® 5.3, dual-mode operation
LE Audio with Auracast, LE-2M, LR, Adv Ext
Bluetooth transmission power: 20 dBm/13 dBm/0 dBm

IV. Typical Application Scenarios
Thanks to its high-performance connectivity, low-power design and extensive range of interfaces, the CYW55572MIUBG is widely suitable for the following embedded and IoT applications:
Mobile robots (AGVs, AMRs): Low-latency Wi-Fi connectivity and Bluetooth remote control functionality to meet real-time navigation and remote control requirements
Smart Home and Smart Speakers: Support for Bluetooth LE Audio and Wi-Fi 6 high bandwidth enables high-quality audio streaming and voice recognition interactions
Security Surveillance: Security cameras and video doorbells, supporting high-definition video streaming and remote control
AR/VR Devices: Augmented reality and virtual reality terminals
Industrial Gateways and Edge AI: Industrial IoT gateways and AI-enabled applications, suitable for edge computing and data acquisition scenarios requiring long-term operation and multi-node access
Digital Cameras and Gaming Devices: High-definition digital cameras and gaming consoles

V. Mingjiada Electronics | CYW55572MIUBG Supply and Recycling Dual-Service Details
Shenzhen Mingjiada Electronics Co., Ltd. — with extensive experience in the distribution of electronic components and inventory optimisation — offers the following services for Infineon’s AIROC™ series of wireless connectivity chips:
Genuine Supply: We maintain a stock of popular models such as CYW55572MIUBG, CYW55572MIUBGT and CYW55573MIUBGT. All products are genuine and factory-sealed, and we support both sample procurement and bulk orders.
Stock Buyback: We specialise in purchasing surplus factory stock, project leftovers, obsolete inventory, and Infineon wireless SoC chips held by individuals or factories. Items must come from legitimate sources, be genuine and unused, and have clear model and batch details. Mingjiada offers:
Submit an inventory list → Preliminary quotation within 24 hours;
On-site or postal sample testing and classification;
Flexible settlement within 24 hours of acceptance;
Support for consignment sales and coordinated clearance.

For further information regarding the Infineon CYW55572MIUBG – AIROC™ Wi-Fi 6 2x2 dual-band Bluetooth 5.3 SoC, to procure samples or enquire about buy-back prices, please visit the Mingjiada Electronics website (https://www.integrated-ic.com/) for further details on supply and demand.