company blog about Mingjiada Supply TI Power Modules, Supply Buck Modules, Boost Modules, Multiphase Buck Modules And Flyback Modules

Mingjiada Supply TI Power Modules, Supply Buck Modules, Boost Modules, Multiphase Buck Modules And Flyback Modules

Shenzhen Mingjiada Electronics Co., Ltd. — Long-term supplier of [TI] power modules (with integrated inductors), covering:
Buck modules (with integrated inductors)
Buck/Boost and Inverters (with integrated inductors)
Modules utilising MagPack™ packaging technology
Multi-phase buck modules (with integrated inductors)
Boost modules (with integrated inductors)
Flyback modules (with integrated inductors)
Mingjiada Electronics maintains stock of mainstream models and supports both small-batch samples and large-volume orders. Backed by an efficient logistics system, we ensure rapid product delivery.

TI Power Modules (Integrated Inductors) — Ultra-simple, ultra-compact options for DC/DC buck conversion
Overview: Power modules featuring integrated inductors and innovative packaging technologies (such as those utilising TI’s new MagPack™ packaging) are designed to achieve compact solution sizes, high power density and efficiency, whilst meeting EMI standards through their design and the option to place them close to the load (minimising parasitic inductance by positioning them near the connection points).

Models supplied by Mingjiada Electronics:
TPSM65610SVCGR
CSDM65295TVCQ
TPSM828511RDYR
TPSM828512RDYR
TPSM8287A12BASRDVR
TPSM8287A12BBSRDVR
TPSM828303APVCBR
TPSM828303ARDSR
TLVM23615RDNR
TPSM560R6HRDAR
TPSM831D31MOA
TPSM82823SILR
LMZM33602RLRR
LMZM33603RLRR
TPSM84424MOLR
TPSM84824MOLR

Advantages of TI power modules:
Reduced overall solution size
- Modules that integrate FETs, controllers, inductors and passive components into a single package (using 3D integration technology) enable higher power density and a smaller overall solution size.
Improved efficiency
- MagPack™ packaging technology delivers outstanding efficiency; this technology also increases thermal resistance for more efficient heat dissipation and enables a high Safe Operating Area (SOA).
Accelerate time-to-market
- These easy-to-use modules, which comply with EMI requirements and reduce power supply design effort by up to 45% (compared to discrete solutions), eliminate the need to source external components, thereby accelerating time-to-market.
Minimise system losses
- The modules allow the power supply to be positioned closer to the load, thereby reducing PCB and system losses. Furthermore, they utilise the 3D integration and excellent shielding performance of MagPack™ technology to improve EMI performance.

For further details on TI’s power modules or to enquire about sample prices, please visit the Mingjiada Electronics website (https://www.integrated-ic.com/) for more information on availability.