company blog about Mingjiada Supply XCVU13P-2FLGA2577I Xilinx Virtex UltraScale+ Industrial-Grade FPGA

XCVU13P-2FLGA2577I FPGA (Field-Programmable Gate Array) | Virtex UltraScale+ Flagship | Mingjiada Electronics – Genuine Products in Stock

Product Introduction: XCVU13P-2FLGA2577I

I. XCVU13P-2FLGA2577I Product Overview

The XCVU13P-2FLGA2577I is a flagship FPGA (Field-Programmable Gate Array) in Xilinx’s Virtex® UltraScale+™ series. Built using advanced 16nm FinFET process technology and 3D IC stacking technology, it is specifically designed for applications with extreme bandwidth requirements, such as ultra-high-performance computing, 5G communications, and AI acceleration.

As part of Xilinx’s highest-performance FPGA product line, this device offers industry-leading logic density, DSP processing capabilities, and high-speed transceiver resources, making it an ideal choice for data center acceleration, 400G and above network equipment, and aerospace/defense applications.

II. XCVU13P-2FLGA2577I Key Specifications

Process: 16nm FinFET

Speed Grade: -2

Temperature Grade: Industrial Grade I, -40°C to 100°C

Package: FCBGA-2577

Programmable I/O: 448

System Logic Cells: 3,780,000

DSP Slices: Massive parallel computing power, supporting high-precision floating-point and fixed-point operations

Memory Resources: High-capacity Block RAM + UltraRAM

High-Speed Transceivers: Supports multi-channel 28 Gbps high-speed serial interfaces

Interface Support: PCIe Gen3, 100G Ethernet, FMC+, LVDS, etc.

III. XCVU13P-2FLGA2577I Key Features

Ultra-high computing density, suitable for complex algorithm acceleration and real-time signal processing

Industrial-grade wide temperature range and strong interference resistance, meeting the demands of harsh embedded environments

Rich selection of high-speed serial interfaces, suitable for high-speed data exchange and interconnectivity

Low-power architecture with dynamic power management, suitable for long-term stable operation

IV. XCVU13P-2FLGA2577I Technical Highlights

16nm FinFET process: Effectively controls power consumption while enhancing performance, delivering industry-leading power efficiency

3D IC stacking technology: Supports heterogeneous integration to achieve higher bandwidth density

UltraRAM on-chip memory: Integrates ultra-large-scale embedded memory, reducing reliance on external memory

128 high-speed transceivers: Provides unmatched serial bandwidth to meet 400G/1T network requirements

Mingjiada Supply Services

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