company blog about New and Original Xilinx Adaptive SoC XCZU47DR-2FFVE1156I A Zynq® UltraScale+™ RFSoC Chip

1. XCZU47DR-2FFVE1156I Overview

The Xilinx XCZU47DR-2FFVE1156I is an RF system-on-chip (RFSoC) based on 16nm FinFET+ process technology in a 1156-pin FCBGA package that integrates a quad-core ARM® Cortex®-A53 processor, a dual-core Cortex-R5 real-time processor, and UltraScale+ programmable logic architecture. The XCZU47DR-2FFVE1156I is unique in that it directly integrates an RF ADC up to 5GSPS and an RF DAC up to 10GSPS, eliminating the need for external data converters in traditional designs.

As the key product in the XCZU47DR-2FFVE1156I family, it provides up to 930K system logic cells, 4272 DSP slices and 38Mb of block RAM resources to handle the most complex signal processing algorithms. the XCZU47DR-2FFVE1156I is particularly suited for application scenarios requiring high bandwidth, low latency and flexible reconfigurability, such as 35 large-scale MIMO systems, phased-array radars, and software-defined radios.

The XCZU47DR-2FFVE1156I has been designed with system-level requirements in mind, supporting a variety of high-speed interface protocols including PCIe Gen3/Gen4, 100G Ethernet, and JESD204B, etc. The XCZU47DR-2FFVE1156I's power-optimised architecture enables it to deliver excellent performance while maintaining reasonable power consumption levels, with typical application scenarios consuming approximately 50W. scenarios is approximately 50W.

2.Key Features
The Xilinx XCZU47DR-2FFVE1156I RFSoC chip offers a number of breakthrough features that make it ideal for wireless communications and signal processing applications:

Highly integrated RF data converter: The XCZU47DR-2FFVE1156I integrates eight 14-bit 5GSPS ADCs and eight 14-bit 9.85GSPS DACs to support RF input/output ranges from 1MHz to 6GHz.The XCZU47DR-2FFVE1156I's ADCs include digital downconverters (DDCs) on each channel. The DAC supports multiple interpolation modes.

Powerful Processing Subsystem: The XCZU47DR-2FFVE1156I features a quad-core ARM Cortex-A53 (up to 1.3GHz) and dual-core Cortex-R5 (up to 533MHz) processing system, providing rich computing resources.The XCZU47DR-2FFVE1156I also integrates an ARM Mali-400 MP2 GPU to support graphics processing requirements.

Rich programmable logic resources: the XCZU47DR-2FFVE1156I provides 930K logic cells, 4272 DSP slices, and 38Mb blocks of RAM, enabling the implementation of complex digital signal processing algorithms. the XCZU47DR-2FFVE1156I's UltraScale+ architecture optimises clock distribution and wiring resources to improve design performance.

High-Speed Interconnect Interfaces: The XCZU47DR-2FFVE1156I supports a variety of high-speed serial interfaces, including 8-way 32Gbps GTY transceivers, PCIe Gen3x16, and 100G Ethernet. these interfaces on the XCZU47DR-2FFVE1156I simplify system-level integration.

Advanced Memory System: The XCZU47DR-2FFVE1156I supports 72-bit DDR4-2400 on the PS side and 32-bit DDR4-2400 on the PL side memory interfaces, providing high-bandwidth data access. the XCZU47DR-2FFVE1156I also integrates 32GB eMMC and 512Mbit QSPI Flash for storage. 

Wide Temperature Range Support: The XCZU47DR-2FFVE1156I offers industrial-grade temperature support (-40°C to +85°C) for harsh environment applications.The reliability of the XCZU47DR-2FFVE1156I is designed to make it suitable for aerospace and defence applications.

Comprehensive Security Features: The XCZU47DR-2FFVE1156I supports secure boot, AES/SHA encryption, and anti-tamper detection to protect the system.The XCZU47DR-2FFVE1156I's security architecture prevents IP theft and system intrusion.

3.Basic Parameters

• Family: Zynq® UltraScale+™ RFSoCs
• Packaging: Tray
• Part Status: On Sale
• Architecture: MCU, FPGA
• Core Processor: Quad-core ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual-core ARM®Cortex™-R5 with CoreSight™
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.333GHz
• Key Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package/Housing: 1156-BBGA, FCBGA
• Vendor Device Package: 1156-FCBGA (35x35)
• Number of I/Os: 366

4.Application Areas

• 5G Communications: Supports millimetre-wave RF front-end processing and baseband acceleration.
• Radar and defence: for phased-array radar and electronic warfare systems.
• Data centres: for AI inference acceleration and high-speed data exchange.

For further purchasing or technical details of XCZU47DR-2FFVE1156I, please contact Mingjiaoda Electronics for the latest quotation and stock availability.