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New Impulse For Embedded Vision: LIFCL-40-7SG72C Lattice CrossLink-NX™ FPGA Chip
Latest company news about New Impulse For Embedded Vision: LIFCL-40-7SG72C Lattice CrossLink-NX™ FPGA Chip

New Impulse For Embedded Vision: LIFCL-40-7SG72C Lattice CrossLink-NX™ FPGA Chip

 

Shenzhen Mingjiada Electronics Co., Ltd. — Long-term supply/recycling of [Lattice] LIFCL-40-7SG72C Lattice CrossLink-NX™ FPGA chips. Product details are as follows:

 

LIFCL-40-7SG72C is built upon Lattice's Nexus platform — combining 28 nm FD-SOI technology with an optimised FPGA architecture to deliver a 100-fold reduction in soft error rates and up to 75% lower power consumption compared to competitors. It utilises compact packaging, with the smallest size measuring just 4 mm x 4 mm. LIFCL-40-7SG72C is optimised for embedded vision processing, supporting high-speed MIPI interfaces and instant configuration capabilities, making it an ideal choice for automotive ADAS, industrial vision, and edge AI applications.

latest company news about New Impulse For Embedded Vision: LIFCL-40-7SG72C Lattice CrossLink-NX™ FPGA Chip  0

 

01 Product Positioning
The Lattice LIFCL-40-7SG72C belongs to the CrossLink-NX series, representing a low-power, high-performance FPGA specifically engineered for embedded vision processing.
As one of Lattice's first products based on the new Nexus™ FPGA technology platform, the LIFCL-40-7SG72C utilises the industry's first 28nm fully depleted silicon-on-insulator (FD-SOI) process, delivering exceptional power efficiency for edge AI processing.
Primarily employed for sensor data pre-processing and aggregation, the LIFCL-40-7SG72C supports merging data streams from multiple image sensors and transmits processed data to application processors (APs) for AI functionality execution.

 

02 Core Technical Highlights
The CrossLink-NX series' technical strengths centre on power optimisation, interface performance, and reliability. These characteristics confer distinct advantages over comparable FPGA products in embedded vision processing applications.
The 28nm FD-SOI process enables dynamic power management in the LIFCL-40-7SG72C. Developers can switch between low-power and high-performance modes by applying a negative bias voltage to the chip's backside, thereby altering the threshold voltage.
In practical applications, the LIFCL-40-7SG72C consumes approximately 200mW at higher frequencies, with static leakage power reduced to just over ten milliwatts. This represents an overall power reduction of up to 75% compared to competing products.
Regarding interface performance, the LIFCL-40-7SG72C incorporates two dedicated 4-channel MIPI D-PHY transceivers, each supporting data rates up to 2.5Gbps, delivering a total bandwidth of 10Gbps.
Additionally, the LIFCL-40-7SG72C incorporates supplementary soft-core MIPI D-PHY configurations supporting up to twelve 1.5Gbps MIPI data streams. This enables direct connection to multiple high-resolution image sensors without requiring additional interface conversion chips.

 

03 Technical Specifications Analysis
The LIFCL-40-7SG72C utilises a 72-pin QFN (10x10mm) package supporting surface mount technology. Its logic architecture comprises 39,000 logic elements organised into 9,750 LAB/CLB units, delivering flexible programming capabilities.
Regarding memory resources, the LIFCL-40-7SG72C integrates 1,548,288 bits of on-chip RAM. This high storage density enables local storage of neural network activations and weights, reducing reliance on external memory.
The LIFCL-40-7SG72C also boasts exceptional I/O capabilities, offering 40 configurable pins supporting multiple interface standards. Beyond high-speed MIPI interfaces, it incorporates a hard-wired 5Gbps PCIe Gen2 interface and a 1066 Mbps LPDDR3 DRAM interface.
Operating within a voltage range of 0.95V to 1.05V and a temperature range of 0°C to 85°C (TJ), it adapts to diverse environmental conditions. Notably, the LIFCL-40-7SG72C supports rapid configuration: I/O pins can be configured within 3 milliseconds, while full logic configuration completes in 8 to 14 milliseconds, enabling near-instantaneous start-up.

 

04 Application Scenario Analysis
The CrossLink-NX FPGA demonstrates broad application potential across multiple domains, particularly in scenarios requiring real-time processing of multi-sensor data such as automotive, industrial vision, and edge AI.
Within the automotive sector, the LIFCL-40-7SG72C can be deployed in advanced driver assistance systems to process data from cameras, LiDAR, radar, and infrared sensors. It can pre-process and fuse this data before sending it to an application processor for AI analysis.
Industrial vision represents another significant application domain. The LIFCL-40-7SG72C can be integrated into industrial cameras to acquire and perform preliminary processing on image sensor data from LVDS, SubLVDS, SLVS, DVP, or MIPI interfaces. Panda's practical application case demonstrates that the selection of CrossLink-NX was primarily driven by its compact size, low power consumption, and advantages such as a 2.5Gbps MIPI hard core.
With the rise of edge AI, the LIFCL-40-7SG72C, combined with Lattice's sensAI solution stack, provides robust support for device-side AI processing. When running on CrossLink-NX, sensAI version 3.0 delivers double the performance and halves power consumption compared to previous iterations.
An object counting demonstration based on the VGG network achieves 10 frames per second processing speed on the CrossLink-NX FPGA while consuming merely 200mW of power.

 

Mingjiada Electronicsoffers long-term supply and recycling services for the LIFCL-40-7SG72C CrossLink-NX™ Field-Programmable Gate Array (FPGA) chip. For further product information, sample procurement, or recycling price enquiries regarding the LIFCL-40-7SG72C, please visit the Mingjiada Electronics official website (https://www.integrated-ic.com/) for comprehensive supply and demand details.

Pub Time : 2026-01-29 13:22:05 >> News list
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