company blog about Qualcomm QCA6174A-5: Supports Low-Power PCIe 2.1 for WLAN and USB 1.1 Interface for BT

The Qualcomm® QCA6174A SoC (System on Chip) is an integrated single-chip solution in a small form factor designed for mobile and consumer electronics applications, providing a cost-effective combined Wi-Fi/Bluetooth solution.

The QCA6174A integrates an RF front-end and single-ended design for simpler design and lower cost.The QCA6174A is available in three models:

QCA6174A-1: Supports low-power PCIe 2.1 (with L1 daughterboard) interface for WLAN and UART/PCM interface for Bluetooth.

QCA6174A-3: Supports low-power SDIO 3.0 interface for WLAN and UART/PCM interface for Bluetooth.

QCA6174A-5: Supports low-power PCIe 2.1 (with L1 daughter board) interface for WLAN and USB 1.1 interface for Bluetooth.

Model Number: QCA6174A-5

Brand: Qualcomm

Lot: New

Package: BGA

Advanced 802.11ac

Advanced Wi-Fi features, such as MU-MIMO and Transmit Beamformee, increase network capacity and improve connectivity.

Dual-mode Bluetooth

Supports legacy Bluetooth as well as low-power Bluetooth hubs and peripherals.

Integrated RF Front End

Supports single-ended RF port designs for simpler, lower cost designs.

Features

2x2 802.11ac + Bluetooth 5.0 in a single SoC

Supports Bluetooth 5.0 and Bluetooth Low Energy, and is backward compatible with Bluetooth 2.x

Integrated RF front-end and single-ended design

Runs from a single 3.3 V supply and 1.8 V or 3.3 V I/O supply

Advanced 11ac features: MU-MIMO, transmit beam fuser

Advanced power-saving techniques for both WLAN and Bluetooth power management

Maximum Likelihood (ML) decoding, Low Density Parity Check (LDPC), Maximum Ratio Combining (MRC) for robust link connectivity

256-QAM at 2.4GHz

1216KB RAM and 448KB ROM for Wi-Fi

192KB RAM and 672KB ROM for Bluetooth

Company home page: www.hkmjd.com