Shenzhen Mingjiada Electronics Co., Ltd. provides new and original Qualcomm/Qualcomm QCC3044 BT Audio SoC, QCC-3044-0-CSP90B-TR-01-0 Extremely low-power BT audio SoC in BGA package designed for mid-level to entry-level stereo headsets and earphones.
QCC3044 BT chip introduction:
The Qualcomm QCC3044 is an entry-level flash-programmable BT audio SoC based on an extremely low-power architecture designed for Bluetooth stereo headphones and earbuds with support for Qualcomm aptX, aptX HD, and aptX Adaptive, as well as Qualcomm Active Noise Cancellation.The QCC3044 is available in a VFBGA package The QCC3044 is available in a VFBGA package, enabling a solution that reduces development time and cost.
QCC3044 chip specifications:
Specification
Flash
Density: 32 megabytes
Location: Internal
Central Processor
Architecture: 32-bit 32-bit
Clock Frequency: Up to 32 MHz
Function: Programmable CPU
Digital Signal Processor
Name: 1x Qualcomm® Kalimba™
Clock frequency: 2x 120 MHz
Data RAM: 448 kB
Programme RAM: 112 kB
Function: Configurable DSP
BT
Specification version: BT® 5.2 certified
Connection technologies: BT Low Power, BT Classic, BT Dual Mode
Classic data rates: 3 Mbps1, 1 Mbps, 2 Mbps2
Audio
Supports Qualcomm® aptX™ audio technologies: Qualcomm® aptX™ Audio, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ HD
Supports Qualcomm® active noise cancellation (ANC) technologies: feedback, feed-forward, hybrid
Supports Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: 2-microphone headset, 1-microphone headset, 1-microphone speaker, Qualcomm® cVc™ Echo Cancellation and Noise Suppression
Voice Services
Ecosystem: Amazon Voice Services, Google Assistant
Digital Assistant Activation: Pushbutton
Power Consumption
Amperage: Less than 6 mA
Audio Characteristics
Resolution: 24-bit
Audio Playback Interface
Mode: Stereo
Package
Type: VFBGA
Pinout: 90 pins
Size: 5.9 × 5.6 × 1 mm
Pitch: 0.5 mm
Summary:
Qualcomm's advanced BT® audio platforms, the second-generation Qualcomm® S5 audio platform and the second-generation Qualcomm® S3 audio platform, both with support for Snapdragon Sound™ Snapdragon Listening technology, are feature-rich and ultra-low-power, bringing new characteristics to Snapdragon Sound Snapdragon Listening These include spatial audio support with dynamic head tracking, optimised lossless music streaming and an extremely low latency gaming experience of 48ms between phone and earbuds. It provides the best silicon solution for flagship audio products of major brands.
Contact: Mr Chen
Tel: +86 13410018555
Email: sales@hkmjd.com
Website: www.hkmjd.com
Your message must be between 20-3,000 characters!
