company blog about Recycle Amphenol Mezzanine Connectors:SK Series,CA Series,M Series,ICFP

Recycle Amphenol Mezzanine Connectors:SK Series,CA Series,M Series,ICFP

Shenzhen Mingjiada Electronics Co., Ltd., as a leading enterprise in the electronic component recycling industry, provides comprehensive recycling solutions through professional services, competitive pricing and a principled business philosophy.

Recycling Features:

I. Product Categories

Specialising in mainstream original manufacturer components across various categories: primarily recycling memory (DDR3/4/5, LPDDR, NAND flash, eMMC, UFS, etc.), microprocessors (MPU/MCU), FPGA/SoC, 5G/Bluetooth/Wi-Fi 6 communication chips, automotive-grade ICs, AI/AR chips, sensors and module products; We accept only brand-new, genuine products sourced through authorised channels; we do not accept counterfeit, disassembled, unidentified-origin or severely damaged components.

Comprehensive brand portfolio: Covers inventory from leading international manufacturers and top domestic chip suppliers; model compatibility spans consumer-grade to industrial/automotive-grade applications.

Diverse inventory types: Factory surplus stock, project surplus, over-purchased stock, goods compliant with customs regulations, port returns, and full warehouse clearances; supports bulk and full-container recycling, whilst also accepting small batches of high-quality stock.

II. Condition and Testing Standards

Packaging requirements: Priority is given to products with original boxes, tubular packaging or vacuum-sealed packaging, accompanied by complete batch numbers and COC documents. Bulk products must undergo X-ray inspection and functional testing to confirm wafer layer integrity and the absence of physical damage, corrosion or oxidation.

Data security compliance: Standardised data erasure protocols are performed on chips and modules with storage capabilities, accompanied by erasure reports, to prevent customer data leakage.

Graded Pricing System: Graded as “Brand New & Unopened > Unused & Opened > Tested & Approved > Repairable Stock”; quotations are dynamically adjusted based on global real-time market conditions, model scarcity, year of manufacture and market demand.

III. Recycling Solutions

Global Coverage: Supports cross-border delivery, door-to-door collection and global logistics tracking; multi-currency settlement.

Flexible Transaction Models: Cash on delivery (24–48-hour rapid settlement), consignment sales, consignment stock, and bulk warehouse clearance; catering to clients’ diverse needs regarding capital recovery and inventory management.

Channel Legitimacy: We collaborate exclusively with authorised distributors, original equipment manufacturers (OEMs) and compliant traders; we reject goods from illegal sources, smuggled goods or infringing materials; mutual obligations are clearly defined through compliance agreements.

I. SK Series: Ultra-High Frequency Chip-Scale Compression Connectors

Core Positioning

Ultra-high frequency, ultra-fine-pitch compression sockets specifically designed for advanced chip packages such as BGA, LGA, ASIC and FPGA, featuring 40GHz+ extreme bandwidth and high-density interconnects.

Key Technical Parameters

Pitch: Minimum 0.4mm, breaking through the limits of traditional fine-pitch designs

Bandwidth: Supports 40GHz+ ultra-high-frequency signals, with low insertion loss and high signal integrity

Mechanical Life: 10,000+ mechanical mating cycles, delivering exceptional durability

Package Dimensions: Up to 80×80mm, covering mainstream high-end chip specifications

Installation Method: Patented compression mounting technology, requiring no soldering, and facilitating easy disassembly and reuse

Contact Design: Dual-point contact and long-stroke elastic structure, ensuring high contact reliability

Core Advantages

Ultimate high-frequency performance: 40GHz+ bandwidth meets the demands of ultra-high-frequency applications such as 5G/6G, radar, and high-speed ADC/DAC.

Ultra-fine pitch and high density: 0.4mm pitch achieves the highest contact density per unit area, suitable for advanced small-sized chips.

High reliability and reusability: Screw-fixed + compression structure supports repeated disassembly and reassembly, suitable for multiple PCB versions and test scenarios.

Flexible Customisation: Offers a variety of cover and base designs, supporting OEM custom moulds.

Typical Applications

High-end FPGA/ASIC/SoC chip testing and validation

5G/6G communication base stations, radar, and satellite communication equipment

High-speed data acquisition and high-precision instrumentation

High-performance computing (HPC) and AI accelerator card chip interconnects

II. CA Series: 32Gb/s+ High-Performance Vertical Mezzanine Connectors

Core Positioning

A 32Gb/s+ pure vertical compression connector designed for high-speed backplanes, mezzanines, edge cards and optical modules, featuring offset-free, high-density and high signal integrity.

Key Technical Parameters

Pitch: 0.4mm, high-density differential pair design

Speed: 32Gb/s+ per channel, compatible with PCIe 4.0/5.0 and 100G/400G Ethernet

Structure: Pure vertical interface, no offset required, simplifying PCB layout

Impedance Control: Precise 85Ω/100Ω differential impedance, optimising high-speed signal transmission

Installation: Compression Mount, no soldering required, suitable for solderless interconnects

Environment: Industrial-grade wide temperature range, vibration and shock resistant, suitable for harsh equipment environments

Key Advantages

High-Speed, Offset-Free: Pure vertical structure completely eliminates PCB offset errors, enhancing assembly precision and signal quality.

High-Density, Compact Size: 0.4mm pitch enables high pin counts (up to several hundred pins), saving PCB space.

Solderless and Highly Reliable: Compression contact replaces soldering, reducing the risk of thermal stress and supporting repeated disassembly and maintenance.

Versatile Application: Compatible with interlayer, backplane, edge card and optical module interconnects, offering high versatility.

Typical Applications

Data centre switches, routers, and server board-to-board interconnects

Enterprise-grade storage, NVMe SSDs, and optical module interconnects

Network communication equipment, PCIe accelerator cards, and high-speed I/O interfaces

Industrial control, medical imaging, and high-performance automotive electronics

III. M-Series™: 56Gb/s/112Gb/s Premium BGA Interlayer Connectors

Core Positioning

Amphenol’s flagship BGA architecture high-speed interposers, encompassing the M-Series VR (56Gb/s) and M-Series 56 (112Gb/s PAM4), are specifically designed for AI, HPC and OCP (Open Compute Project) platforms.

Key Technical Specifications

Data Rate: 56Gb/s NRZ / 112Gb/s PAM4, supporting next-generation high-speed SerDes

Pitch: 1.27mm/1.6mm column pitch, balancing density and routing space

Stack Height: 4mm/5mm ultra-low profile, suitable for high-density stacked computing

Core Features: Self-Align/Self-Level, supporting parallel assembly of multiple connectors

Contacts: Dual-point contact, long-strike structure, offering vibration resistance, pin-bending protection and extended service life

Protocols: Fully compatible with PCIe 5.0/6.0, CXL, UCIe, 1.6T/3.2T Ethernet

Key Advantages

Ultra-high-speed flagship performance: 112Gb/s PAM4 meets the core interconnect requirements of large AI models, HPC and supercomputing.

Intelligent mechanical design: Self-alignment and self-levelling significantly reduce the difficulty of multi-connector assembly, eliminating misalignment and bent pins.

Ultra-low profile and high density: 4mm stacking height achieves optimal space utilisation, suitable for blade and modular servers.

Military-grade reliability: Passes rigorous vibration, shock and thermal cycling tests, ensuring 24/7 high-reliability operation in data centres.

Typical Applications

AI training/inference servers, GPU/TPU accelerator card interconnects

Supercomputing centres, High-Performance Computing (HPC) clusters

OCP Open Compute, high-density storage/computing nodes in data centres

6G communications, quantum computing, high-end radar signal processing

IV. ICFP Series: IC Package Probes

Core Positioning

50Ω precision probe connectors specifically designed for IC chip package testing, signal probing and circuit debugging, replacing traditional XY stages and flat probes to enable efficient multi-signal synchronous probing.

Key Technical Parameters

Impedance: Standard 50Ω, suitable for high-frequency digital / RF signal probing

Pitch: 0.8mm/1.0mm, compatible with mainstream IC packages (BGA, QFP, chip carriers)

Bandwidth: 40GHz+, supports lossless probing of ultra-high-frequency signals

Structure: Pure vertical compression interface with guided alignment for rapid and precise positioning

Function: Direct contact with IC pads and signal paths, supporting multi-channel synchronous probing

Core Advantages

High-efficiency, low-cost probing: Eliminates the need for expensive XY platforms; a single probe enables multi-signal synchronous acquisition, significantly reducing costs and improving efficiency.

Ultra-high-frequency precision measurement: 50Ω impedance + 40GHz bandwidth, ensuring accuracy in high-speed and RF signal testing.

Convenient alignment: Guided structure + vertical compression enables rapid positioning, high repeatability and simple operation.

Universal adaptability: Compatible with mainstream IC packages featuring 0.8/1.0mm pitch, covering digital, RF and mixed-signal chips.

Typical Applications

IC design verification, chip mass production testing, failure analysis

Signal integrity testing for high-speed chips (CPU/GPU/FPGA)

Debugging of RF/millimetre-wave chips and 5G/6G front-end modules

Interconnect testing for memory chips (DDR5, HBM, EDSFF)