company blog about Recycle Broadcom StrataDNX™ Switch Solutions:Qumran4D,Qumran3a,Qumran3D,Qumran2a

Recycle Broadcom StrataDNX™ Switch Solutions:Qumran4D,Qumran3a,Qumran3D,Qumran2a

Shenzhen Mingjiada Electronics Co., Ltd., as a leading enterprise in the electronic components recycling industry, provides comprehensive recycling solutions through professional services, competitive pricing and a principled business philosophy.

[Recycling Advantages]

1. Product Categories

We specialise in all types of mainstream original manufacturer components. We only accept genuine, brand-new products sourced through authorised channels and in full working order; we do not accept counterfeit or substandard components, those that have been dismantled, those of unknown origin, or those that are severely damaged.

Comprehensive brand portfolio: covering leading international manufacturers and top domestic brands; model compatibility spans consumer, industrial and automotive applications.

Diverse inventory types: factory surplus stock, project surplus stock, over-purchased stock, goods compliant with customs regulations, port return stock and complete warehouse clearances; we support bulk and full-container recycling, whilst also accepting small batches of high-quality stock.

2. Condition and Testing Standards

Packaging requirements: Priority is given to products with original boxes, tubular packaging or vacuum-sealed packaging, accompanied by complete batch numbers. Bulk products must undergo X-ray inspection and functional testing to confirm wafer layer integrity and ensure there is no physical damage, corrosion or oxidation.

Data security compliance: Standardised data erasure procedures are carried out on chips/modules with storage functions, accompanied by erasure reports, to prevent the leakage of customer information.

Tiered Pricing System: Products are categorised as ‘Brand New, Unopened > Unused, Opened > Tested and Approved > Repairable Materials’; pricing is dynamically adjusted based on real-time global market conditions, model scarcity, year of manufacture and market demand.

3. Recycling Service Scenarios

Global Coverage: We support cross-border delivery, door-to-door collection and global logistics tracking; settlement is available in multiple currencies.

Flexible Transaction Models: Cash on delivery (settlement within 24–48 hours), consignment sales, inventory storage and bulk warehouse clearance; meeting customers’ diverse needs in terms of cash recovery and inventory management.

Channel Legitimacy: We collaborate exclusively with authorised distributors, original equipment manufacturers (OEMs) and compliant traders; we refuse to accept goods from illegal channels, smuggled goods or infringing sources; mutual obligations are clearly defined through compliance agreements.

I. Overall Overview of the Solution and Core Architectural Advantages

The Broadcom StrataDNX™ Qumran series is a single-chip switching and routing SoC solution designed for large-scale, high-concurrency networks with stringent security requirements. The entire series adopts a unified StrataDNX™ architecture, supporting a consistent SDK development ecosystem and operations and maintenance framework, thereby significantly reducing equipment manufacturers’ R&D, adaptation and upgrade costs. Compared to traditional switching chips, the core advantages of this series are centred on four key dimensions:

Firstly, elastic and programmable packet processing: equipped with the field-reconfigurable Elastic Pipe™ engine, it supports customised forwarding rules and new protocol iterations, enabling adaptation to network technology upgrades without the need for hardware revisions; Secondly, line-rate security encryption across all ports: the entire series integrates hardware MACSec and IPSec encryption acceleration modules, with all ports supporting line-rate encryption and decryption without any performance loss, meeting the encrypted networking requirements of operators’ private networks and government and enterprise sectors; Thirdly, intelligent caching and zero-packet-loss scheduling: paired with a high-bandwidth HBM/LPDDR5x cache architecture, this delivers over a hundredfold increase in throughput compared to traditional on-chip caching, ensuring zero packet loss even under congestion; fourthly, multi-tiered, granular traffic management: featuring a built-in multi-level traffic scheduler that supports the management of tens of thousands of flow tables, it precisely guarantees SLA bandwidth entitlements at both the user and service levels.

Based on a unified architecture, the four products in the Qumran series form a tiered portfolio comprising ultra-high-end core (4D), high-end backbone (3D), mid-range aggregation (3a) and lightweight access (2a) solutions, precisely matching the bandwidth, port density and service requirements of networks at different levels.

II. Detailed Explanation of Product Segmentation Across the Range

1. Qumran4D (BCM99430): 51.2 Tb/s Ultra-High-End Core Flagship Solution

The Qumran4D is the top-tier flagship chip in the StrataDNX™ series, offering ultra-high bandwidth, ultra-high data rates and exceptional performance across all scenarios. It is designed for the cores of ultra-large data centres, national-level carrier backbone networks, cross-border interconnection nodes and ultra-high-density 800G/1.6T networking scenarios, and ranks among the top tier of commercial switching chips in terms of performance.

In terms of performance specifications, the Qumran4D delivers a single-chip forwarding capacity of up to 51.2 Tb/s and supports the full spectrum of Ethernet speeds, including 100G, 200G, 400G, 800G and 1.6T. It enables high-density deployment of up to 32 1.6T ports or 512 100G ports, meeting the interconnection requirements of hyperscale computing clusters and backbone bandwidth expansion needs. The chip is equipped with 212.5G PAM4 ultra-high-speed SerDes, delivering industry-leading physical layer transmission speeds and providing seamless support for the evolution of next-generation ultra-high-speed Ethernet networking.

In terms of technical features, it incorporates the advanced Elastic Pipe™ flexible packet processing engine, supporting a full protocol stack including complex carrier-grade service scheduling, Segment Routing (SR), MPLS and Ethernet OAM; It is paired with a high-bandwidth HBM packet buffer, delivering 160 times the cache throughput of traditional chips and ensuring zero packet loss across the entire network even under extreme congestion scenarios. Furthermore, all ports in the series integrate hardware-accelerated line-rate MACSec and IPSec encryption, enabling end-to-end secure encrypted transmission without the need for external encryption modules, making it suitable for scenarios with high security requirements such as cross-border dedicated lines and core private networks for government and enterprise sectors.

In terms of power consumption and cost-effectiveness, the Qumran4D utilises advanced manufacturing processes to integrate ultra-high-density ports and functional modules onto a single chip. This significantly simplifies the hardware architecture of high-end routers and core switches, reducing both the physical footprint and overall power consumption of the equipment, thereby effectively lowering the long-term total cost of ownership (TCO) for the operation and maintenance of ultra-large-scale networks. It represents the optimal solution for core networking in ultra-high-speed, ultra-large-scale networks.

2. Qumran3D: 25.6 Tb/s 5nm High-End Backbone Core Solution

Qumran3D is the industry’s first 25.6 Tb/s single-chip routing solution manufactured using a 5nm process. It is characterised by extreme computing power, ultra-low power consumption and high integration. Targeted at operator provincial and municipal backbone networks, large-scale cloud data centre cores, DCI (Data Centre Interconnect) and high-end aggregation core scenarios, it balances high performance with low cost, making it the flagship core chip for large-scale, high-end networking.

In terms of core performance, the single-chip forwarding capacity stands at 25.6 Tb/s, supporting mainstream high-speed port rates from 100G to 800G. Equipped with 256 channels of 100G PAM4 SerDes, it offers flexible port configuration and can be combined as required to form high-density 400G and 800G port configurations, meeting the bandwidth upgrade and computing-centric networking requirements of medium-to-large-scale backbone networks. Built on an advanced 5nm process, it doubles the bandwidth density compared to the previous generation whilst reducing power consumption per unit of bandwidth by over 30 per cent, delivering industry-leading power management capabilities.

In terms of service capabilities, the Qumran3D inherits the full suite of high-end features from StrataDNX™, supporting deep cache scheduling, large-scale routing tables, hardware-level telemetry and traffic visualisation, enabling it to precisely handle massive volumes of concurrent computing traffic and dedicated line services for telecoms operators and enterprise customers. It also integrates full-line-rate security encryption and a trusted secure boot mechanism, balancing service flexibility with network security. It meets the high-reliability, high-security and low-latency requirements of operators’ backbone networks and cloud providers’ core networks, whilst significantly reducing the hardware complexity and deployment costs of high-end routing equipment.

3. Qumran3a (BCM88490): 2.4 Tb/s Mid-Range Aggregation Solution

Qumran3a is a mid-range flagship chip designed for metropolitan area aggregation, 5G mobile backhaul, campus cores and data centre TOR access. It offers excellent value for money, multi-speed adaptation, high-density ports and low power consumption, perfectly matching the mainstream networking requirements of operator edge aggregation, large government and enterprise campuses, and small to medium-sized data centres. It also gives rise to the Qumran3u and Qumran3n, forming a capacity range spanning 360 Gb/s to 2.4 Tb/s.

In terms of performance specifications, the single-chip forwarding capacity is 2.4 Tb/s, supporting full-rate port adaptation from 1 GE to 800 G. It enables high-density deployment of up to 80 physical ports, with a typical port configuration of 16 × 100 G + 64 × 50 G, balancing the needs for high-speed uplink and high-density access. The chip is equipped with an LPDDR5x high-speed packet buffer, whilst a four-level 32-bit cache architecture ensures service stability during congestion scenarios, enabling zero-packet-loss forwarding.

Service features are tailored to specific deployment scenarios, providing comprehensive support for carrier edge services such as 5G backhaul, base station routing, PON OLT aggregation and microwave access, whilst being compatible with a full suite of carrier features including Ethernet OAM, MPLS, segmented routing and stateful flow tracking. It also retains hardware-based line-rate MACSec and IPSec encryption capabilities, along with multi-level traffic scheduling functions, enabling granular SLA guarantees at both the user and service levels. This makes it well-suited to the differentiated traffic scheduling requirements of government and enterprise dedicated lines, campus networks, and corporate backbone networks.

The solution’s greatest advantage lies in its exceptional value for money. In mid-range aggregation scenarios, it integrates a full suite of high-end features onto a single chip, eliminating the need for additional expansion modules and significantly reducing hardware costs and power consumption. It is the optimal networking choice for carrier metropolitan area aggregation, 5G transport networks, and large enterprise campus networks.

4. Qumran2a: Lightweight, Highly Reliable Edge Access Solution

Qumran2a is a lightweight, entry-level chip in the StrataDNX™ series, characterised by low power consumption, high stability, minimal deployment requirements and full feature compatibility. It is designed for lightweight scenarios such as operator edge access, enterprise branch aggregation, campus access layers and small data centre gateways. Whilst retaining the core architectural features of StrataDNX™, it streamlines bandwidth capacity to focus on fundamental high-speed forwarding and secure access capabilities.

In terms of performance, the chip is suited to medium- to low-speed, high-density access scenarios. It supports mainstream access speeds of 10G, 25G, 50G and 100G, with flexible port configuration to meet bandwidth expansion requirements for branch networks and campus access. Leveraging the unified StrataDNX™ software ecosystem, it is fully compatible with the protocol stacks, O&M systems and programmability of the high-end Qumran series, enabling unified management and upgrades across the entire network and avoiding the operational fragmentation associated with multi-architecture networking.

In terms of functionality, it retains hardware-based traffic scheduling, basic OAM operations and maintenance, and port security management capabilities, whilst supporting lightweight encrypted access and simple SLA scheduling, thereby meeting the basic service carriage requirements of enterprise branch offices and operator edge networks. It also offers the advantages of ultra-low power consumption, high stability and excellent value for money, making it suitable for the bulk deployment of edge access devices across large-scale, wide-area networks, effectively reducing network deployment and operational costs across the entire network.