company blog about Recycle Broadcom StrataXGS® Switch Solutions:Trident3-X3+,Trident4-X11C,Trident 5,Trident 4

Recycle Broadcom StrataXGS® Switch Solutions:Trident3-X3+,Trident4-X11C,Trident 5,Trident 4

Shenzhen Mingjiada Electronics Co., Ltd. has been deeply involved in the electronic component recycling sector for over 20 years. As a globally renowned recycling service provider, the company combines core capabilities in high-value recycling with substantial financial resources, professional valuation expertise and compliant channels. We provide efficient, transparent and high-value solutions for converting inventory into cash for factories, R&D institutions, distributors and end-user enterprises, helping clients to utilise idle assets and rapidly recover capital.

[Recycling Advantages]

1. High-value recycling for maximised returns: Leveraging global supply chain resources and real-time market data, we provide fair and competitive quotations within 24 hours—exceeding industry averages and eliminating price undercutting—to help clients maximise the value of their inventory.

2. Professional assessment, precise pricing: Our team of senior technical assessors possesses in-depth expertise in component parameters, performance and market value. We can accurately identify genuine, original products, as well as batch numbers, packaging types and grades (commercial, industrial or aerospace-grade), thereby preventing losses due to misjudgement.

3. Comprehensive Product Coverage, No Inventory Gaps: Whether standard commercial models, industrial-grade high-power components or aerospace-grade radiation-resistant products, we accept brand-new, original items, obsolete stock, end-of-line stock and samples for recycling, with no restrictions on quantity or batch.

4. Compliant, transparent and worry-free: We only source from legitimate channels (distributors, manufacturers and end-user inventories). Our processes are compliant, formal contracts are signed to ensure the legality of transactions, and we maintain confidentiality throughout to protect our clients’ commercial privacy.

5. Efficient, convenient and global service:

Submit a list: Clients provide details such as part numbers, quantities, batch numbers and packaging types (via email, our website or WeChat);

Rapid Quotation: Professional assessment and quotation provided within 24 hours;

Logistics and Delivery: Global cash-on-delivery (COD) supported (DHL/UPS/SF Express), with full value insurance throughout;

Prompt Payment: Payment made within 24–48 hours upon successful inspection (RMB or USD available).

[Core Capabilities of StrataXGS® Switch Chips and Solution Compatibility]

I. Trident3-X3+: A Cost-Effective, Mature Networking Solution

The Trident3-X3+ is an enhanced commercial chip in the Trident3 series, utilising a mature 16nm manufacturing process. With a core switching capacity of 3.2 Tbps, it offers stable multi-layer forwarding capabilities and extensive port adaptability, perfectly meeting the large-scale deployment requirements of mid-to-high-end networks. It is the cost-effective, go-to choice for government and enterprise networks, as well as traditional data centres.

Key Technical Features: Supports full-speed port compatibility for 10G, 25G, 40G, 50G and 100G; a single chip enables high-density port configuration, supporting up to 128 x 25G SerDes interfaces, thereby meeting the high-density access requirements of small and medium-sized data centres and the core aggregation networking needs of enterprises; Equipped with industry-proven QoS scheduling mechanisms and an ultra-large shared packet buffer, it effectively handles burst traffic and concurrent multi-service scenarios, ensuring the stable transmission of voice, video and core business services; fully compatible with enterprise-grade standard protocols such as IPv4/IPv6, OSPF, BGP and VRRP, it supports granular traffic management and ACL access control, and offers comprehensive network reliability assurance capabilities.

Suitable Scenarios and Solution Value: Primarily used in core switches for large enterprise campuses, aggregation-layer switches for government and enterprise networks, ToR access switches for small and medium-sized data centres, and traditional IDC backbone access equipment. Compared to next-generation chips, Trident3-X3+ offers mature technology, a stable supply chain and controllable hardware costs. It enables network performance upgrades without the need for large-scale modifications to existing network architectures, whilst remaining compatible with existing services. This maximises the protection of customers’ existing investments, making it the optimal solution for the smooth upgrade of traditional networks.

II. Trident4: General-Purpose Solution for Large-Scale Cloud Data Centres

The Trident4 series (BCM56690 series) utilises an advanced 7nm process to achieve a breakthrough balance between performance and power consumption, with a core switching capacity of up to 12.8 Tbps. As a general-purpose, high-end switching chip designed for large-scale cloud data centres and large-scale government and enterprise backbone networks, it has become the industry’s mainstream choice for mid-to-high-end networking solutions thanks to its ultra-high port density and standardised programmability.

Key technical features: Supports high-density port configurations of 128×100GbE and 64×200GbE, meeting the high-density interconnection requirements of cloud data centre leaf-spine architectures; features a fully programmable forwarding architecture driven by a compiler, supporting user-defined forwarding logic and service function development to adapt to the flexible and ever-changing service scenarios of cloud networks; It integrates comprehensive in-band telemetry technology (IFA 2.0), enabling visualised monitoring of network-wide traffic and precise fault localisation; it features dynamic load balancing, elastic hashing, elephant traffic detection and reprioritisation capabilities, significantly enhancing network bandwidth utilisation; it supports advanced functions such as SRv6 network slicing, large-scale NAT and basic DDoS protection, catering to the needs of cloud tenant isolation and customised networking for multiple services.

Suitable Scenarios and Solution Value: Primarily serves as the core for leaf-spine switches in large-scale cloud data centres, mid-to-high-end government and enterprise backbone switches, and data centre interconnect (DCI) equipment. Trident4 achieves a balanced advantage of high performance, high density, low power consumption and strong programmability, supporting the deployment of large-scale virtualised and containerised cloud services whilst balancing standardised service implementation with customised functional expansion, aligning with the trends towards scalability, consolidation and intelligence in data centres.

III. Trident4-X11C: High-End Enterprise Core Intelligent Security Solution

The Trident4-X11C (BCM56890 series) is an enhanced Trident4 architecture chip customised by Broadcom specifically for high-end enterprise core networks and large-scale campus backbone networks. Building upon the standard Trident4, it places particular emphasis on strengthening traffic analysis, security protection and high-density chassis networking capabilities, making it a dedicated high-performance solution for high-end enterprise core networking.

Key Technical Features: Maintains 12.8 Tbps line-rate switching capacity and supports the deployment of multiple port configurations—including 32×400 GbE, 64×200 GbE and 128×100 GbE—making it suitable for high-speed interconnection in large enterprise core networks; Equipped with a core-class BroadScan traffic analysis engine, it can simultaneously perform per-packet detection and analysis of 512k flows at full line-rate bandwidth of 12.8 Tbps, enabling granular identification and monitoring of network-wide traffic; optimised chassis networking architecture supports redundant, fast-switching switch boards and a high-density chassis design with hundreds of downstream ports, significantly enhancing the scalability and reliability of enterprise core equipment; Enhanced enterprise-grade security capabilities, with native support for high-precision DDoS attack detection and mitigation, application load balancing, and large-scale traffic isolation, enabling the precise identification of malicious attacks within mixed traffic; Integrated 4GHz-class on-chip processors support offline streaming telemetry and embedded application deployment, comprehensively upgrading operations and maintenance monitoring capabilities.

Suitable Scenarios and Solution Value: Primarily targeted at core chassis switches for ultra-large enterprises, high-end campus backbone networking, enterprise-grade traffic security analysis and protection equipment, and large-scale government and financial core networks. Addressing the characteristics of enterprise networks—complex traffic, high security demands, multi-tiered networking, and stringent reliability requirements—the Trident4-X11C achieves a four-in-one integration of high-performance forwarding, intelligent traffic analysis, comprehensive security protection, and highly reliable networking. This resolves the pain points of traditional enterprise core equipment, such as poor traffic visibility, passive security protection, and insufficient network scalability.

IV. Trident5: Next-Generation Ultra-High-Speed Intelligent Solution for AI Computing Centres

As Broadcom’s new-generation flagship switching chip, the Trident5 (BCM78800 series) utilises an industry-leading 5nm ultra-low-power process, with core switching capacity increased to 16.0 Tbps. It pioneers the on-chip neural network traffic analysis engine, NetGNT, and is tailor-made for AI computing centres and next-generation ultra-high-speed cloud data centres, leading the way in the evolution of intelligent networking technology.

Key technical features: At the hardware level, it supports 800G/400G ultra-high-speed ports; a single chip can achieve a high-density configuration of 24×400G + 8×800G, perfectly meeting the ultra-high-bandwidth, ultra-low-latency interconnect requirements of AI computing clusters; Equipped with the proprietary NetGNT universal neural network traffic analysis engine, it utilises AI algorithms to identify typical incast congestion traffic patterns in AI computing scenarios in real time, proactively triggering congestion control whilst maintaining full line-rate performance with zero loss or latency, thereby comprehensively resolving traffic congestion issues in computing clusters; traffic analysis capabilities have been comprehensively upgraded to support new tunnel encapsulation formats and high-precision telemetry protocols, meeting the demands of future network technology evolution; Equipped with a 6GHz-class on-chip processor, combined with fourth-generation Broadview™ network-wide visualisation technology, it enables comprehensive and precise monitoring of packet behaviour, traffic status and device performance; building on the NPL programmable architecture, it is compatible with the previous generation’s software ecosystem and supports innovative services such as customised AI traffic scheduling and intelligent operations and maintenance.

Suitable Scenarios and Solution Value: Primarily targeted at ToR switches in AI computing centres, next-generation cloud data centre leaf-spine networking, high-end data centre interconnects, and high-density, high-speed networking for edge computing. Through AI-native intelligent scheduling, ultra-high port density, ultra-low latency and ultra-low power consumption, Trident5 addresses the core pain points of traditional networks—such as their inability to handle AI computing burst traffic, cluster congestion and bandwidth shortages—providing dedicated network support for high-end services including large-model training, computing power scheduling and distributed computing.