company blog about Recycle Infineon AIROC™ BT And Multiprotocol:AIROC™ BLE,AIROC™ BT MCU,AIROC™ BT Module

Recycle Infineon AIROC™ BT And Multiprotocol:AIROC™ BLE,AIROC™ BT MCU,AIROC™ BT Module

Shenzhen Mingjiada Electronics Co., Ltd., a specialist electronic component service provider with nearly two decades of industry experience, has long been offering high-value recycling services for a wide range of electronic components worldwide. We offer a variety of service models, including cash purchases, consignment sales and consignment arrangements, to help you quickly convert your inventory into cash flow.

Why choose Mingjiada Electronics?

Official channels, secure and compliant

We only purchase goods sourced through official channels (such as distributors, end-user factories and traders), and require inventory to be brand-new, factory-sealed and unused. We rigorously vet all sources to ensure transactions are legal and compliant, whilst protecting our clients’ commercial confidentiality.

Professional Assessment, Fair Pricing

With a team of experienced technical assessors, we can accurately identify part numbers and condition. We quote based on real-time market conditions, offering a pricing structure that exceeds industry standards. We support rapid payment within 24 hours, cash transactions and flexible settlement options.

One-Stop Process, Efficient and Convenient

Submit your list: Simply provide the part numbers, quantities and photographs of your surplus stock via email or telephone.

Rapid Quotation: We will respond within 24 hours and provide an estimated price.

On-site Inspection: We can arrange for a specialist to visit your premises to inspect the goods or collect samples for testing.

Prompt Payment: Full payment is made immediately upon successful inspection. We support in-depth cooperation, including consignment and consignment sales.

I. AIROC™ Bluetooth Low Energy: The Core Power of Connectivity

The AIROC™ Bluetooth Low Energy product line primarily comprises high-performance SoCs (System-on-Chip) and MCUs, which combine RF cores with ARM Cortex processors and are designed to serve as the main control chips for devices.

AIROC™ CYW20829 Series

The CYW20829 is a flagship product in Infineon’s latest generation of Bluetooth Low Energy 5.4 MCUs, optimised for the industrial, consumer and automotive markets.

Powerful processing capabilities: Featuring a dual-core ARM® Cortex®-M33 design, one core operates at up to 96 MHz for application processing, whilst the other is dedicated to the Bluetooth controller subsystem. This architecture ensures a smooth user experience even when the Bluetooth stack is under heavy load.

Leading RF performance: Featuring an integrated internal power amplifier (PA), it delivers a transmit power of up to +10 dBm at the Bluetooth Low Energy 1 Mbps data rate, with a receive sensitivity ranging from -98 dBm to -106 dBm. This provides an excellent link budget, enabling long-range connectivity even in complex environments.

Standard Support: Supports all new features of Bluetooth 5.4, particularly Periodic Broadcast with Response (PAwR), making it an ideal choice for Electronic Shelf Labels (ESL) and Wireless Battery Management Systems (wBMS).

Security: Integrates secure boot, Root of Trust (RoT) and cryptographic accelerators, meeting PSA Level 1 security certification requirements to effectively protect sensitive data.

AIROC™ CYW89829

Building on the CYW20829, the CYW89829 is an optimised variant for automotive applications. It integrates a CAN FD interface for direct connection to automotive networks, making it highly suitable for automotive access systems (such as digital keys) and wireless battery management, whilst meeting automotive-grade reliability requirements.

II. AIROC™ Bluetooth MCUs: The Ultimate Single-Chip Solution

This category emphasises ‘high integration’, aiming to replace the traditional ‘separate MCU + Bluetooth chip’ solution with a single chip, thereby reducing BOM (Bill of Materials) costs and board space.

Key Advantages:

Abundant internal resources: The CYW20829 series integrates up to 256 KB of SRAM and supports XIP (execute-in-place) via an external Flash connected through a Quad SPI interface, whilst also incorporating 32 KB of cache to enhance efficiency.

Diverse peripheral interfaces: In addition to standard UART/SPI/I2C, these MCUs integrate a PDM (Pulse Density Modulation) digital microphone interface, an I2S audio interface, capacitive touch button matrix scanning, as well as CAN FD and LIN interfaces.

Low-power audio: Support for LE Audio enables higher-quality, lower-power audio transmission, making it suitable for next-generation wireless headphones and hearing aids.

Application scenarios:

These MCUs are ideally suited for applications requiring both computational logic and wireless connectivity, such as blood glucose monitors, wearable devices, game controllers and PC peripherals (mice/keyboards).

3. AIROC™ Bluetooth Modules: The Secret Weapon for Accelerating Time-to-Market

For customers wishing to focus on application-layer development rather than RF hardware debugging, Infineon offers pre-certified AIROC™ Bluetooth modules. These modules integrate a crystal oscillator, passive components, flash memory and the AIROC Bluetooth SoC, forming a complete ‘plug-and-play’ solution.

Representative Models and Features:

CYW20822 Module: Supports Bluetooth Low Energy (BLE) long-range, available in versions with integrated or external antennas, suitable for Industrial IoT, beacons, asset tracking and medical devices

CYW20835 module: Bluetooth 5.2 certified, ultra-low power consumption (Rx 8mA / Tx 18mA @ 12dBm), suitable for home automation, mesh networks and lighting control

CYW20829 Module: Bluetooth 5.4 certified, supports Low Energy Audio and PAwR, with excellent long-range performance; suitable for power tools, solar micro-inverters and general IoT applications