company blog about Recycle Infineon Radiation Tolerant Power:Rad Tolerant MOSFETs,Rad Tolerant IC

Recycle Infineon Radiation Tolerant Power:Rad Tolerant MOSFETs,Rad Tolerant IC

Shenzhen Mingjiada Electronics Co., Ltd., a globally renowned electronic component recycling company, has been deeply involved in the recycling industry for many years. We purchase all types of idle stock from factories, traders, distributors, R&D companies and equipment manufacturers across the country, providing one-stop solutions to problems such as excess chip inventory, warehouse space occupation and tied-up capital.

1. Our recycling scope covers all conditions, with no entry barriers

Brand-new, factory-direct materials: palletised, in original factory-sealed reels, with original factory labels, complete batches and clear silkscreen markings;

Project offcuts/bulk new materials: unused, free from oxidation, with intact pins and undamaged packaging;

Components from dismantled equipment: chips removed from intact equipment, fully functional and free from physical damage;

Bulk clearance: Entire batches of inventory orders and surplus materials from cancelled projects; priced by quantity with preferential rates.

2. Key advantages of our professional recycling service

High-value recycling with transparent pricing: Backed by our own capital reserves, we eliminate mark-ups by middlemen and provide real-time quotations based on market conditions, chip models, product condition and quantity. There are absolutely no hidden fees, and arbitrary price reductions are strictly prohibited.

Comprehensive Coverage and Strong Processing Capacity: We accept chips of all models and quantities, whether it be large-scale factory stock clearance, bulk dismantling of corporate equipment, or small quantities of idle chips held by individuals—we can handle it all appropriately.

Professional Appraisal and Accurate Valuation: Our experienced chip appraisal team is well-versed in chip specifications, market value and authenticity verification methods. We can swiftly distinguish between brand-new, dismantled, refurbished and faulty chips, ensuring accurate valuations and fair, impartial transactions.

Flexible Transactions and Immediate Payment: We offer online quotations based on photographs, as well as on-site inspection and collection services. Our nationwide coverage ensures swift on-site collection or postal return services for non-local customers. Payment methods include cash, bank transfer, WeChat Pay and Alipay. Payment is made immediately upon successful inspection, with absolutely no delays or outstanding balances.

3. Standardised Recycling Process

Submit Inventory List

Customers compile details of the materials: model, quantity, packaging type (pallet/reel/bulk), production date and photographs of the items, and send this information to our valuation experts;

Accurate Quotation Provided Within 24 Hours

Our technical team will verify the silkscreen markings, packaging and condition of the items, and issue a transparent quotation based on real-time market conditions;

Confirmation of Transaction Arrangements

Both parties will negotiate terms such as direct purchase, consignment or on-site collection, and finalise the specific details regarding logistics, inspection and settlement;

Inspection, Handover and Settlement

Inventory counting and inspection will be carried out on-site; for goods from other locations, full payment will be made immediately upon delivery by courier and confirmation of receipt at our warehouse.

I. Infineon Radiation-Hardened Power MOSFETs

Infineon’s radiation-hardened MOSFETs are divided into two main product lines: Rad-Hard aerospace-grade devices (hermetically sealed metal packages, designed for long-lifetime high-orbit and deep-space missions) and Rad-Tolerant NewSpace devices (economical plastic-encapsulated packages, suitable for 2–5-year LEO satellite constellations). These cover N-channel and P-channel single-transistor, dual-transistor and four-channel array configurations, developed using the proven OptiMOS™ and CoolMOS™ super-junction processes.

Key Product Features

Graded Radiation Tolerance Specifications

Aerospace-grade Rad-Hard series: Total Ionising Dose (TID) of up to 500 krad (Si); characterised for high LET single-event effects; resistant to single-event burn-out (SEB) and single-event latch-up; compliant with ESA ESCC-5000 and DLA MIL-PRF-19500 certifications; offers QPL-qualified product list part numbers, with bare die availability for certain models. Voltage range: 20 V to 650 V; this is one of the few radiation-hardened MOSFET product portfolios on the market with 650 V QPL certification.

NewSpace Radiation-Hardened Series: TID tolerance of 30 krad (Si) and SEE tolerance threshold of 46 MeV・cm²/mg; optimised specifically for the low-radiation environment of LEO; The plastic-encapsulated solution significantly reduces costs and accelerates mass production delivery times compared to hermetically sealed packaging; representative models include BUP15CN060L and BUP06CP038F.

Electrical Performance Advantages

Features low on-resistance (R_{DS(on)}) and low gate charge (Q_G), with excellent switching speed, thereby reducing switching losses in DC-DC converters; Ample Safety Operating Area (SOA) margin supports topologies such as synchronous rectification, load switching, active current sharing (Active OR-ing) and surge protection; the operating temperature range covers -55 °C to +175 °C, making them suitable for the extreme thermal cycling conditions encountered in orbit.

Flexible Packaging Options

Hermetically sealed ceramic LCC and metal TO packages are designed for traditional high-end aerospace projects; TO-263 and TO-247 plastic-encapsulated surface-mount devices are suited to mass production for commercial satellites; support for single-tube, dual-tube and four-channel array integration simplifies power distribution board layout.

Typical Applications

Spacecraft bus DC-DC converters, solid-state load switching, redundant current-sharing circuits for power supplies, satellite payload power supply, on-board motor drives, battery charge/discharge management, and point-of-load (PoL) power conversion.

II. Infineon Radiation-Hardened Integrated Circuits (Rad-Hard ICs)

Radiation-hardened MOSFETs must be paired with radiation-hardened drivers and control chips from the same source to achieve system-level radiation reliability. As a complementary solution to power devices, Infineon’s radiation-hardened integrated circuits—including gate drivers, power management ICs, solid-state relays and signal isolators—are co-designed with radiation-hardened MOSFETs to realise a complete, highly reliable power chain.

1. Radiation-Hardened Gate Driver ICs (Core Product Range)

Representative products: RIC70115 (radiation-hardened GaN driver), RIC74424H high-side and low-side driver chips.

Radiation specifications: TID rating of 100 krad (Si); passes high-LET single-event effect testing; effectively suppresses radiation-induced latching and output inversion;

Key Features: Integrated independent Miller clamp circuit to prevent parasitic false triggering during high-speed switching; certain models feature True Differential Input (TDI) for strong resistance to EMI/RFI interference; built-in LDO voltage regulator to reduce the number of external components; compatible with both silicon-based radiation-hardened MOSFETs and radiation-hardened GaN power devices, supporting both traditional silicon solutions and next-generation wide-bandgap high-frequency power architectures;

Supported topologies: high-side and low-side drivers, synchronous rectification drivers, push-pull converters, and isolated power supply front-end drivers.

2. Radiation-Hardened Solid-State Relays (SSRs)

Integrate radiation-hardened MOSFET arrays and isolated drive circuits to replace traditional mechanical relays, offering contactless operation, vibration resistance and vacuum tolerance. Available in optocoupler-isolated and unbuffered architectures, they simplify on-board power distribution switching design and are used for remote control of load switching.

3. Other Supporting Radiation-Resistant Integrated Devices

Integrated synchronous rectification modules, reference sources, protection logic chips and signal conditioning integrated circuits can be used to construct a complete radiation-resistant power supply system, reducing the number of discrete components, minimising the risk of radiated coupling in circuits, and optimising the system’s SWaP (Size, Weight, Power) metrics.

III. Synergistic Advantages of the Two Major Product Lines

Coherent Design from a Single Source

Radiation-hardened MOSFETs and driver ICs have been optimised for mutual compatibility, ensuring that gate drive impedance, timing characteristics and radiation degradation trends are aligned. This eliminates the risk of mismatch failure under radiation conditions caused by combining components from different manufacturers, significantly shortening the component qualification testing cycle for space projects.

Dual Product Lines to Meet Market Demand

High-orbit GEO, deep-space exploration and long-term crewed space missions: utilising hermetically sealed, rad-hard aerospace-grade devices to meet ultra-long in-orbit lifetimes of 10–15 years;

LEO mega-constellations, commercial remote-sensing satellites and small CubeSats: utilising cost-effective plastic-encapsulated rad-tolerant devices to balance cost and in-orbit reliability, supporting large-scale network deployment.

Comprehensive Reliability Assurance System

All devices are supplied with radiation test reports and process traceability documentation to support aerospace-grade screening processes; certain ESA-certified models are manufactured in-house in Europe and are not subject to export controls; SPICE radiation degradation simulation models are provided to facilitate irradiation condition simulations by systems engineers.

IV. Target Application Areas

Low Earth Orbit (LEO)/Medium Earth Orbit (MEO) commercial satellite constellations

Geostationary Orbit (GEO) communications satellites and meteorological satellites

Power supply systems for deep-space probes and manned spacecraft

High-reliability power supplies for airborne applications and high-end defence electronic equipment

Ground-based scientific research facilities in extreme radiation environments, and power supplies for measurement and control in the nuclear industry