company blog about Recycle Murata Power Semiconductor Series:FlexiCP™,FlexiBK™,LED Boost

Recycle Murata Power Semiconductor Series:FlexiCP™,FlexiBK™,LED Boost

Shenzhen Mingjiada Electronics Co., Ltd., as a leading enterprise in the electronic component recycling industry, provides customers with comprehensive electronic component recycling solutions through professional services, highly competitive prices and a firm commitment to integrity.

[Recycling Advantages]

1. High-value recycling with industry-leading quotes

Based on global market trends and taking into account model, batch, packaging, quantity and condition (original packaging/surface-mounted/unmounted), we provide accurate quotations that are 10%–30% higher than those of our competitors.

No hidden fees; genuine, original products (in original packaging or on trays) will receive priority processing and higher quotations, whilst obsolete stock, discontinued orders and dismantled components will all be fairly priced.

2. Comprehensive Recycling Across All Categories, with No Entry Barriers

No quantity restrictions: we accept everything from single samples to batches of hundreds or tens of thousands of items;

No condition restrictions: we accept brand-new, original products, slow-moving stock, components mounted on circuit boards or dismantled components, as well as tested components;

3. Secure, Efficient and Prompt Payment

Streamlined process: Simply provide part numbers, quantities, batch numbers and a list of component conditions; we will issue a preliminary quote within one hour and complete an accurate valuation within 24 hours;

Flexible settlement: We support cash, telegraphic transfers and bank transfers; payment is made immediately upon confirmation of receipt, with no credit terms or delays;

Confidential transactions: Customer information is kept strictly confidential throughout the entire process; a non-disclosure agreement is signed to prevent the leakage of inventory information and safeguard customers’ commercial privacy.

4. One-stop, end-to-end service

From inventory categorisation → submission of the list → quotation → inspection → settlement → logistics, we provide full-process support to ensure you enjoy a hassle-free and efficient experience

【Transaction Process】

Submit the list: Compile detailed chip information (model, quantity, batch, package type, condition, packaging) and send it via WeChat, email or telephone;

Accurate Quotation: Our evaluation team will swiftly verify the specifications based on market conditions and issue a formal quotation;

Transaction Confirmation: Once both parties have reached an agreement, a buyback agreement is signed, specifying the delivery method (collection from your premises/courier);

Delivery and Payment: Settlement is processed immediately following on-site inspection or receipt of goods, ensuring prompt payment.

I. FlexiCP™ Charge Pump Capacitor Voltage Divider Series

The FlexiCP™ (PE252xx Series) is a pure charge-pump voltage divider IC, featuring an integrated MOSFET, controller and driver circuitry. It utilises a WLCSP bare die package, with no inductors involved in the main power conversion; instead, it relies on capacitors to achieve lossless voltage division and step-down conversion. It supports multiple voltage division ratios of 2:1, 3:1 and 4:1, and multiple devices can be connected in parallel to increase power output, with a peak conversion efficiency of up to 98.2%.

Key Features

Architecture: Patented adiabatic switched-capacitor charge pump; voltage division output Vo = Vin/N; efficiency is virtually unaffected by the input–output voltage difference, significantly reducing system losses.

Voltage Capabilities: The PE25200 supports an 8.2–15 V input; the PE25208 supports a wide 18–60 V input voltage range, suitable for 48 V mid-bus and USB-PD EPR systems; single-device output current ranges from 4 to 10 A, and can be scaled up to 240 W high-power output via parallel operation.

Protection Features: Built-in overcurrent protection, over-temperature protection, UVLO (undervoltage lockout), Power Good, frequency synchronisation and skip-cycle mode; supports current sharing in parallel configurations (Murata Manufacturing).

Package: Compact WLCSP (Wafers-Level Chip-Scale Package), suitable for high-density board layouts.

Typical Models

PE25200: 2/3 voltage division, 10 A output, compatible with 12 V intermediate bus, for powering FPGAs and DDR memory

PE25204: 4 voltage divisions, converts 48 V input to 12 V, winner of the power supply industry’s Green Energy-Saving Product Award

PE25208: 2/3 voltage division, up to 8A, designed for 48V telecommunications and high-power USB-PD applications

Application Scenarios

48V to 12V intermediate bus conversion in data centres, network switches and optical transmission equipment; voltage conversion for multi-cell lithium-ion battery platforms; front-end voltage division and pre-regulation in humanoid robot power supply systems, providing efficient pre-conversion for downstream POL buck converters; Distributed point-of-load power supply systems.

II. FlexiBK™ Two-Stage Point-of-Load Regulator Series

The FlexiBK™ (PE241xx series) is a two-stage PoL device featuring a charge pump + two-phase buck architecture. It first performs a preliminary step-down via the charge pump, followed by a buck step-down in the subsequent stage, significantly reducing the high input voltage; with the downstream Buck stage handling low-dropout conversion. This enables small inductors, low ripple, low EMI and high transient response, addressing the pain points of traditional single-stage Buck converters—namely, large inductor size and excessive heat generation under high-voltage input conditions.

Key Features

Two-stage pipelined architecture: charge pump pre-voltage division + two-phase interleaved buck, reducing stress on the downstream switching devices and allowing the use of low-voltage FETs, whilst significantly reducing inductor size; two-phase interleaved operation suppresses output ripple and EMI interference.

Power Specifications: The representative model, the PE24110, is a single-chip solution delivering 12A per phase in a dual-phase configuration; up to four devices can be connected in parallel to achieve a 48A output. With a 12V input and an output range of 0.5–3.6V, it supports dynamic voltage regulation via an external AVS DAC, making it suitable for powering FPGA, ASIC and DSP cores.

Electrical and Protection: Switching frequency of 1.6 MHz; operating temperature range of –40 °C to +125 °C; features enable, Power Good, output voltage detection, overcurrent, overtemperature and undervoltage protection; QFN package facilitates soldering and heat dissipation.

Application Scenarios

Power supply for DSP/ASIC cores in optical communication modules; FPGAs in network equipment; industrial control boards; power supply for high-current load points in humanoid robot main control MCUs and servo drive units; high-density computing boards with noise-sensitive and space-constrained requirements.

III. LED Boost Series

The LED Boost series (ARC/PE23xxx) comprises two-stage architecture LED backlight driver ICs, combining a Boost converter with a charge pump for voltage multiplication. They integrate all MOSFETs, controllers and programmable current sinks, eliminating the need for complex peripherals. Available in WLCSP and QFN packages, they are specifically designed for multi-string LED display backlights and achieve a peak efficiency of up to 96%.

Key Features

Patented two-stage architecture: Boost + charge pump voltage multiplication, reducing the proportion of power handled by the inductor to enable a slim, compact solution suitable for ultra-thin end products; supports independent driving of 6–8 LED strings, with programmable current adjustment per string.

Electrical Specifications: Input 2.5–15 V, maximum output 45 V; single-string output current 25–43 mA; dual-mode I²C+PWM dimming with a dynamic range of up to 15 bits, ensuring smooth, flicker-free backlight transitions.

Integration: All power MOSFETs, drivers and current sensing circuits are integrated, requiring very few external components; package options include ultra-compact WLCSP bare die and LGA/QFN, catering to the varying board thickness requirements of mobile phones, laptops and industrial displays.

Protection mechanisms: Comprehensive protection against LED open circuit, short circuit, overtemperature and overvoltage, enhancing the reliability of the display system.

Representative models

ARC1C0605: Input 2.5–5.5 V, 6 strings of LEDs, 30 V output, WLCSP package, for mobile device applications

ARC3C0845 / ARC3C0845W: Up to 8 LED strings, 45V output, 43mA per string; for laptops and industrial displays; ‘W’ and ‘non-W’ denote WLCSP and QFN packaging respectively

PE23108: Up to 96% efficiency; designed for high-power display backlight systems

Application Scenarios

Backlighting for laptop and tablet LCD/UHD screens; industrial human-machine interface (HMI) displays; in-vehicle displays; backlight drivers for humanoid robot interactive panels.