company blog about Recycle Nexperia MOSFETs:Automotive MOSFETs,Power MOSFETs,Small Signal MOSFETs

Recycle Nexperia MOSFETs:Automotive MOSFETs,Power MOSFETs,Small Signal MOSFETs

Shenzhen Mingjiada Electronics Co., Ltd. is a globally renowned electronic component recycling company. Through our professional recycling services, we help clients realise the value of their idle electronic components. With our strong financial standing and comprehensive service system, we have earned the long-term trust and cooperation of numerous manufacturing clients and traders.

Recycling Process:

1. Inventory Classification and Submission of List

Clients should first classify their idle inventory, specifying the model, brand, production date, quantity, packaging type and condition. A detailed inventory list may be submitted to our evaluation team via email or fax.

2. Professional Evaluation and Quotation

Upon receipt of the list, we will complete a preliminary evaluation and provide a quotation within 24 hours.

3. Contract Signing and Logistics Arrangements

Once both parties have agreed on the price, a formal recycling contract will be signed to clarify the transaction details.

4. Goods Inspection and Prompt Payment

Upon arrival at our warehouse, the goods will undergo a final quality inspection. Upon passing the inspection, we guarantee payment within three working days to ensure rapid capital recovery. Flexible payment methods include wire transfer, cash, or other arrangements tailored to the client’s requirements.

I. Automotive MOSFETs

Core Positioning

Designed specifically for the demanding environments of automotive electronics, the entire range is AEC-Q101 certified, meeting requirements for a wide temperature range of -55°C to +175°C, high vibration, high humidity and heat, and low failure rates. It covers all scenarios including body control, powertrain systems, on-board charging, lighting and safety systems.

Core Product Series

MLPAK Series (MLPAK33-WF/MLPAK56-WF)

Package: Micro-pin, wet-side pads (-WF), supports AOI (Automated Optical Inspection), high solder joint reliability.

Specifications: 40V–100V, N/P-channel, RDS(on) as low as 1.3mΩ.

Applications: Body control, infotainment, LED lighting, battery reverse protection.

LFPAK Series (LFPAK33/56/88)

Technology: Copper-Clip packaging, low inductance, high thermal dissipation, high current capability.

Specifications: 20V–100V, maximum current 425A, RDS(on) as low as 0.7mΩ.

Applications: 48V mild hybrid systems, on-board chargers (OBC), traction inverters, BMS.

CCPAK1212 Series

Package: 12×12mm, top/bottom cooling, suitable for high-density power modules.

Specifications: 80V/100V, RDS(on) as low as 0.99mΩ, maximum current 460A.

Applications: 48V automotive powertrain systems, DC-DC converters, industrial high-current modules.

SiC MOSFET (Automotive Grade)

Specifications: 1200V, RDS (on) 30/40/60mΩ, D2PAK-7 package.

Applications: Electric vehicle OBC, traction inverters, high-voltage DC-DC.

Key Advantages

Fully AEC-Q101 certified, 175°C continuous operation, service life exceeding 10 years.

Low RDS(on), low conduction losses, high energy efficiency.

Diverse packaging options: MLPAK/LFPAK/CCPAK/SiC, suitable for different power ratings.

High reliability: copper clamp technology, wet-side pads, high avalanche withstand capability.

II. Power MOSFETs

Core Positioning

Designed for medium-to-high voltage, high-current, high-efficiency applications in industrial, power supply, motor drive, server and renewable energy sectors, covering voltages from 12V to 200V. Comprehensive range of N-channel and P-channel devices, balancing low on-resistance with fast switching speeds.

Core Product Series

NextPowerS3 Series

Technology: Advanced Trench process, ultra-low RDS(on), high switching speed.

Specifications: 25V/30V, RDS(on) as low as 0.72mΩ, maximum current 300A.

Packages: LFPAK56, SOT1023A.

Applications: Server power supplies, industrial DC-DC converters, battery management, motor drives.

Trench 9 Series

Technology: Low-voltage superjunction + advanced packaging.

Specifications: 40V–100V, RDS(on) as low as 1.18mΩ.

Packages: LFPAK, MLPAK, CCPAK.

Applications: Industrial power supplies, PV inverters, new energy vehicles, telecommunications equipment.

ASFET (Application-Specific MOSFET)

Specifications: 12V–100V, enhanced SOA (Safe Operating Area), low peak voltage, high breakdown voltage.

Packages: LFPAK, CCPAK.

Applications: Hot-swap, battery protection, load switching, high-reliability power supplies.

Key Advantages

Low RDS(on): as low as 0.7 mΩ, reducing conduction losses and improving efficiency.

High power density: copper clip / CCPAK packaging, offering superior heat dissipation and compact size.

Wide voltage range: 12V–200V, with both N-channel and P-channel options available.

High switching speed: low Qg and low reverse recovery, suitable for high-frequency applications.

III. Small-Signal MOSFETs

Core Positioning

Targeting low-power, compact, portable device applications, covering 20V–100V and currents ≤6A. Focusing on ultra-small packages, low RDS(on), high ESD protection and automotive-grade certification, these are suitable for consumer electronics, IoT, wearables and automotive electronics.

Core Product Series

DFN Series (DFN0603/1006/1110/2020)

Package: Ultra-compact, DFN0603 (0.63 × 0.33 × 0.25 mm).

Specifications: 20V–80V, RDS(on) as low as 15 mΩ, maximum current 6A.

Features: >2kV ESD protection, thermal resistance < 10K/W.

Applications: Wearables, mobile phones, tablets, e-cigarettes, hearing aids, battery switches.

SOT Series (SOT23/323/363/457)

Package: Standard SMD, compact size, easy to solder.

Specifications: 20V–100V, RDS(on) as low as 15mΩ.

Applications: Automotive electronics (seat control, windows, LED lighting), consumer electronics, signal switching.

Automotive-grade small-signal MOSFETs (Q-portfolio)

Certification: AEC-Q101, -55°C to +175°C.

Package: DFN1110D-3, DFN1412-6, SOT23.

Applications: Automotive body control, infotainment, safety systems, LED lighting.

Key Advantages

Ultra-compact packaging: DFN0603/1006, saving PCB space.

Low RDS(on): as low as 15 mΩ, reducing power loss and extending battery life.

High ESD protection: >2 kV, strong resistance to electrostatic discharge.

Automotive-grade certification: Full range AEC-Q101 certified, suitable for automotive electronics.

IV. Summary

Nexperia’s three major MOSFET series cover all application scenarios, ranging from microwatts to kilowatts and spanning from consumer electronics to the automotive industry:

Automotive MOSFETs: Automotive-grade, high reliability, high current, suitable for new energy vehicles and traditional automotive electronics.

Power MOSFETs: Low loss, high power density, suitable for industrial power supplies, motors and new energy applications.

Small-signal MOSFETs: Ultra-compact, low power consumption, high ESD protection, suitable for portable devices and automotive small-signal applications.