company blog about Recycle ON Power Module Evaluation Board:IGBT Module,MOSFET Module,IPM,SiC Module

Recycle ON Power Module Evaluation Board:IGBT Module,MOSFET Module,IPM,SiC Module

Shenzhen Mingjiada Electronics Co., Ltd. is a globally renowned recycler of electronic components. Through professional recycling services to help customers realise the value of idle electronic components, with strong economic strength and perfect service system, won the long-term trust and cooperation of many factory customers and traders.

Recycling products include: 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, Telematics ICs, automotive ICs, automotive grade ICs, communication ICs, artificial intelligence ICs, memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips, wireless communication modules, connectors and other electronic components.

Recycling Process:

1、Inventory classification and list submission

Customers firstly classify the backlog of inventory to determine the model, brand, production date, quantity, package form and packaging status. Customers can send the detailed inventory list to our valuation team via email or fax.

2、Professional evaluation and quotation

Upon receipt of the inventory list, the company will complete the initial evaluation and provide feedback on the quotation proposal within 24 hours.

3、Agreement signing and logistics arrangement

After both parties agree on the price, a formal recycling contract is signed to clarify the details of the transaction.

4、Goods inspection and quick payment

After the goods arrive at the warehouse, the final quality verification of the products will be carried out. After passing the inspection, the company promises to complete the payment within 3 working days to ensure that the customer quickly back to the capital. Payment methods are flexible and can be arranged according to customer demand in the form of wire transfer, cash and other forms.

I. IGBT Module Evaluation Boards: Focusing on Isolated Drive and System Integration

IGBTs (Insulated Gate Bipolar Transistors) form the backbone of medium-frequency, high-power applications. Evaluating IGBTs involves not only the device itself but critically its gate drive and isolated power supply.

Core Evaluation Board Example: SECO-LVDCDC3064-IGBT-GEVB

This evaluation board precisely addresses the core requirement for IGBT driving: providing a stable, isolated gate drive power supply.

Design Core: Incorporates an on-board ON Semiconductor automotive-grade NCV3064 controller (industrial-grade equivalent: NCP3064) to construct an input-isolated DC-DC converter.

Key Outputs: Delivers stable -7.5V/15V voltage rails, with the negative rail ensuring reliable IGBT turn-off and preventing unintended conduction. An additional 7.5V auxiliary power rail is also provided.

High-Performance Specifications: Supports a wide input range from 6V to 18V, operates at a switching frequency up to 150kHz, and achieves dielectric isolation up to 4000VAC, ensuring safe and reliable isolation between high-voltage and low-voltage sides.

Application Value: Functioning as a “plug-and-play solution”, its pinout is compatible with commercial IGBT DC/DC power supplies, enabling engineers to rapidly integrate it into inverter or motor drive boards. This allows focus on system-level debugging rather than designing a driver power supply from scratch. Its high isolation and AEC-Q compliance make it particularly suitable for demanding applications such as automotive powertrains and industrial inverters.

Furthermore, ON Semiconductor's innovative hybrid technology IGBTs (such as the AFGHL50T65SQDC, which integrates a field-stop IGBT with a SiC Schottky diode in a single package) require specialised drive evaluation to achieve an optimal balance between switching performance and losses.

II. MOSFET Module Evaluation Boards: Optimised Layout and Testing Convenience

Power MOSFET modules are pivotal for high-frequency, high-efficiency applications. Their evaluation boards prioritise minimising parasitic parameters, providing comprehensive test interfaces, and supporting advanced performance verification methodologies.

Core Evaluation Board Example: EVBUM2878G-EVB

This board is specifically designed to evaluate 1200V M3S full-bridge (4-PACK) MOSFET modules in F2 packaging.

Design Core: Utilises a four-layer FR4 PCB with 70μm copper thickness, combined with low-inductance layout to minimise parasitic inductance and resistance in the power loop – critical for high-frequency switching applications.

Key Features: Incorporates four isolated single-channel gate drivers (2.5kV withstand voltage) to ensure independent, reliable driving of each bridge arm. The board supports Dual Pulse Test (DPT) and open-loop power testing, standard methodologies for evaluating power device dynamic switching characteristics such as switching losses and overshoot voltage.

User-Friendly Design: Input/output signal connector sockets facilitate connection to external controllers (providing PWM signals) and fault signal management. Multiple test points are integrated for convenient oscilloscope probe measurements of critical waveforms.

Application Focus: Primarily targets sectors requiring high power density and efficiency, such as uninterruptible power supplies, energy storage systems, electric vehicle charging stations, and solar inverters.

III. Intelligent Power Module Evaluation Board: Simplifying Design, Enhancing Reliability

The IPM (Intelligent Power Module) highly integrates IGBTs or MOSFETs, driver circuits, and protection circuits (e.g., overcurrent, undervoltage, overtemperature) within a single package. The evaluation board enables users to rapidly validate all intelligent module functions and construct complete application systems.

Core Evaluation Components and Technology: FOD848x Opto-isolated IPM

Although detailed information on ON Semiconductor IPM evaluation boards is limited in search results, the pivotal FOD848x series opto-isolated IPM components reveal the core of IPM evaluation.

Functional Core: This device acts as a ‘bridge’ connecting the digital controller to the power module, ensuring the secure and reliable transmission of control signals.

Key Performance: Featuring exceptionally high common-mode transient immunity (CMTI) with a minimum rating of 20kV/µs, it effectively suppresses high-frequency noise interference generated by power-side switching operations, preventing logic-side malfunctions. It provides electrical isolation up to 5000VAC, ensuring system safety.

Evaluation Board Value: A comprehensive IPM evaluation board (e.g., similar to other manufacturers' EVAL-M1-IM818-A design) builds upon such isolators, integrating circuits for the IPM module, current sensing, bus voltage sampling, and EMI filtering. It provides users with a near-complete single-phase or three-phase power inverter front-end. Developers need only connect an MCU control board and motor to rapidly initiate verification of advanced algorithms such as sensorless field-oriented control.

IV. SiC Module Evaluation Boards: Cutting-Edge Platforms for High-Voltage, High-Speed Challenges

Silicon carbide (SiC) devices are revolutionising photovoltaics, electric vehicles, and high-end power supplies due to their high-voltage, high-temperature, and high-frequency capabilities. Their evaluation boards present the most demanding design challenges and complexity, requiring management of higher dV/dt, stricter gate drive requirements, and robust protection features.

Core Evaluation Board Example: EVBUM2880G-EVB

This advanced platform evaluates ON Semiconductor's 1200V M3S EliteSiC half-bridge (2-PACK) MOSFET modules.

Design Objective: To provide a robust, flexible test platform for assessing the extreme performance and functionality of SiC modules.

Core Capabilities: Comprehensive support for dual-pulse testing and open-loop power supply testing. The on-board gate driver must deliver the positive and negative gate voltages required for SiC MOSFETs (e.g., +15V/-3V to -5V), with ultra-low propagation delay and exceptional CMTI performance to leverage SiC's high-speed advantages.

System Interface: Connects to external controllers for PWM input reception and processing of fault signals returned by the module, facilitating integration into more complex digital control systems.

Compatibility and Applications: Compatible with multiple current-rated module variants (e.g., NXH010P120M3F1PTG), covering nearly all next-generation high-efficiency, high-power-density applications including electric vehicle powertrains, traction inverters, solar inverters, and high-end industrial power supplies.

Dedicated Driver Evaluation Board: NCP51705 Mini SMD Evaluation Board

Beyond module-level evaluation, ON Semiconductor offers driver-level solutions such as the NCP51705 Mini SMD Evaluation Board. This board integrates the NCP51705 driver, optimised for driving SiC MOSFETs, along with all peripheral circuitry and a digital isolator, featuring reserved pads for TO-247 packaging. It is topology-agnostic, serving as a universal low-side or high-side driver evaluation module to assist engineers in rapidly validating driver circuit performance on custom power stages.