company blog about Recycle ON Silicon Photomultipliers:ARRAYC,ARRAYJ,C-Series,J-Series

Recycle ON Silicon Photomultipliers:ARRAYC,ARRAYJ,C-Series,J-Series

Shenzhen Mingjiada Electronics Co., Ltd. has specialised in the field of electronic component recycling for many years and is a professional provider of inventory management and recycling services within the industry. We purchase genuine original manufacturer products, obsolete stock, discontinued products and idle chips at highly competitive prices, helping businesses to rapidly reduce inventory, recover capital and minimise warehousing and management costs.

Key Advantages of Our Recycling Service

1. High-value recycling with industry-leading quotes

Based on global market trends and taking into account model, batch, packaging, quantity and condition (original packaging/mounted on board/unmounted), we provide accurate quotes that are 10%–30% higher than those of our competitors.

No hidden fees; genuine OEM products (including those in original packaging or on pallets) will receive priority processing and higher quotes, whilst obsolete stock, discontinued orders and dismantled components will all be fairly priced.

2. Comprehensive purchase of all product categories, with no minimum purchase quantity requirement

No quantity restrictions: from a single sample to bulk purchases of hundreds or tens of thousands of batches, we can meet all requirements;

No condition restrictions: we purchase brand-new, factory-sealed products, slow-moving stock, board-mounted/disassembled components and tested components;

3. Secure, Efficient and Prompt Payment

Streamlined process: Simply provide part numbers, quantities, batch numbers and a condition list; we will issue a preliminary quote within 1 hour and complete an accurate valuation within 24 hours;

Flexible settlement: We accept cash, telegraphic transfers and bank transfers; payment is made immediately upon confirmation of receipt, with no credit terms or delays;

Confidential Transactions: We maintain strict confidentiality of client information throughout the entire process; we sign non-disclosure agreements to prevent the disclosure of stock information and safeguard our clients’ commercial privacy.

4. One-Stop, End-to-End Service

From stock categorisation → submission of lists → quotation → inspection → settlement → logistics, we provide full-process support to ensure you enjoy a hassle-free and efficient experience

Silicon photomultiplier tubes (SiPMs), with their advantages of single-photon detection capability, high gain, resistance to magnetic field interference, low-voltage operation and high solid-state reliability, are gradually replacing traditional vacuum photomultiplier tubes (PMTs) and are widely used in medical imaging, lidar, radiation detection, biophotonics and high-energy physics. ON Semiconductor has established a comprehensive SiPM product portfolio: the C Series and J Series comprise standalone single-pixel devices; the ARRAYC and ARRAYJ series, based on C/J bare chips respectively, form large-scale SiPM arrays designed to meet the demands of two-dimensional imaging and multi-channel photon detection. The following section provides a systematic analysis of these four product lines.

I. C-Series Single-Pixel SiPMs

Product Overview

The C-Series is ON Semiconductor’s flagship range of general-purpose SiPMs, characterised by low noise and low dark count rates. Utilising an MLP-moulded lead frame package, it supports seamless tiling on all four sides and is designed for long-duration continuous acquisition and noise-sensitive detection applications.

Key Electrical Characteristics

Ultra-low dark count rate (DCR): typically 30 kHz/mm², with minimal baseline drift during long-term detection;

PDE > 40% in the 420 nm blue light band, with spectral coverage from 300 nm (ultraviolet) to 700 nm (visible light);

Breakdown voltage consistency of ±250 mV, with a temperature coefficient of 21.5 mV/°C;

Built-in Fast Output channel with a rise time as low as 300 ps, suitable for high-speed timing;

Effective photosensitive area: 1 mm, 3 mm, 6 mm; available in various micro-cell specifications (35 μm being the mainstream);

SMT reflow soldering packaging for easy system integration.

Typical Applications

Industrial LiDAR, radiation monitors, biofluorescence detection, optical glucose monitoring, environmental photon detection, and general-purpose laboratory single-photon counting.

II. J Series (J-SERIES) Single-Pixel SiPM

Product Overview

The J Series comprises SiPMs optimised for high photon detection efficiency and high-performance timing, utilising TSV (Through-Silicon Via) chip-level packaging with minimal dead zone, specifically developed for high-end medical imaging and high-precision time-of-flight (ToF) detection.

Core Electrical Characteristics

High-density micro-cell design, with PDE at 420 nm reaching up to 50%, delivering leading sensitivity in low-light conditions;

Typical DCR of 50 kHz/mm², achieving higher detection efficiency at the expense of some noise performance compared to the C Series;

Excellent transition time dispersion (TTS), providing superior time resolution suitable for ToF systems;

TSV packaging results in pixel edge dead zones significantly smaller than those of traditional MLP packaging, making it suitable for high-density array configurations;

Also features Fast Output for high-speed signal transmission; available in 3 mm, 4 mm and 6 mm photosensitive areas;

Breakdown voltage consistency of ±250 mV, compatible with standard lead-free reflow processes.

Typical Applications

Time-of-Flight PET (ToF-PET), nuclear medicine imaging, scintillator detectors, high-energy particle detection, high-end 3D ranging, and biophotonics fluorescence lifetime measurements.

III. ARRAYC: SiPM Arrays Based on C-Series Chips

Product Overview

ARRAYC consists of a two-dimensional array of C-series single-pixel SiPMs mounted on a PCB substrate, designed for multi-channel distributed photon detection; it is a standardised, scalable array solution.

Key Features

Array specifications: Various configurations including 2×2, 4×4, 8×8 and 12×12; pixel sizes of 3 mm and 6 mm (C-Series photodetector units);

Two hardware interface options: Board-to-board connector version / BGA (Ball Grid Array) version;

Connector version: Supplied with an evaluation daughterboard (BOB) for rapid prototyping, with independent readout of pixel signals;

BGA version: Direct reflow soldering to the user’s main board, suitable for mass-production equipment;

Each pixel has independent standard output, fast output and common cathode pins, supporting per-pixel readout or signal summation;

Inherits the advantages of the C Series: low dark count, suitable for long-term imaging monitoring;

Larger pixel pitch, with an emphasis on modular layout rather than maximising fill factor.

Typical Model References

ARRAYC-30035-16P-PCB (4×4, 3 mm pixels), ARRAYC-60035-4P-BGA (2×2, 6 mm pixels)

Applications

Industrial multi-channel LiDAR arrays, distributed radiation imaging, wide-area ambient light detection, and scientific multi-channel photon acquisition systems.

IV. ARRAYJ: High-Fill-Factor SiPM Arrays Based on J-Series Chips

Product Overview

ARRAYJ comprises a two-dimensional array of J-series SiPM pixels in TSV packaging. It features a high fill factor (>90%) and is specifically designed for two-dimensional imaging systems, representing ON Semiconductor’s flagship array product for medical imaging.

Key Features

Natively equipped with J-series TSV pixels, featuring extremely low dead zone between pixels and an array fill factor of >90%;

Array specifications: 2×2 to 8×8; pixel sizes available in 3 mm, 4 mm and 6 mm; micro-cells available in 20 μm and 35 μm variants;

Integrated onto a PCB substrate, with optional high-density board-to-board connectors or BGA packaging;

Inherits the J-series’ high PDE and excellent timing performance, making it suitable for scintillation crystal-coupled imaging;

Signals can be read out independently on a per-pixel basis for tomographic imaging, or summed across multiple channels for large-area detection.

Typical model references

ARRAYJ-300XX-64P-PCB (8×8 array, 3 mm J-series pixels), ARRAYJ-60035-4P-PCB (2×2 array)

Applications

PET scanners, small-animal imaging equipment, gamma-ray imaging detectors, high-energy physics crystal detector arrays, high-end ToF 3D imaging systems.