company blog about Recycle Renesas Interface Evaluation Board:2-Wire Bus Buffer,Haptic Driver,IO-Link Line Driver

Recycle Renesas Interface Evaluation Board:2-Wire Bus Buffer,Haptic Driver,IO-Link Line Driver

Shenzhen Mingjiada Electronics Co., Ltd., as a specialised electronic component recycler, has long focused on acquiring electronic components including integrated circuits (ICs), 5G chips, new energy ICs, IoT chips, Bluetooth chips, automotive chips, artificial intelligence ICs, Ethernet ICs, memory chips, sensors, IGBT modules, and other electronic component products. We provide efficient inventory monetisation services for supply chains while reducing enterprises' warehousing and management costs.

Recycling Process

Inventory Classification: Clients categorise idle IC stock by model, brand, production date, quantity, etc.

Submit Inventory List: Email or fax the list to our assessment team.

Professional Quotation: Company specialists evaluate inventory and provide a purchase quotation; agreement is reached between both parties.

Transaction Delivery: Specific transaction methods are confirmed and delivery completed, supporting diverse settlement options including cash payment.

I. 2-Wire Bus Buffer Evaluation Board: Delivering Precise Timing for High-Speed Clock Networks

In cloud computing, high-performance computing, and high-speed storage systems, clock signal integrity directly determines system performance and stability. Renesas' dual-line bus buffer evaluation boards (such as EVK9ZXL1951D) are specifically designed to evaluate its high-performance clock buffers, serving as an ideal tool for constructing low-jitter, high-fanout clock trees.

1. Core Chip and Performance Highlights

At the heart of this evaluation board lies the 9ZXL1951D buffer, a second-generation enhanced DB1900ZL device optimised for PCIe Gen1-5 and UPI (Universal Processor Interface) applications.

Ultra-Low Phase Jitter: Supports programmable PLL bandwidth (1.0MHz or 2.6MHz), effectively minimising jitter peaks to deliver exceptional phase jitter performance, meeting stringent timing requirements for high-speed interfaces.

High Integration and Flexibility: Features 19 integrated outputs, with 16 independently controllable via 8 OE# pins through SMBus (System Management Bus). Its LP-HCSL (Low Power High Current Sink Logic) output mode incorporates built-in 85Ω termination resistors, potentially eliminating up to 76 external resistors and saving 130mm² of PCB area per chip. This significantly simplifies layout and reduces material costs.

User-Friendly Evaluation Environment: The evaluation board is powered via USB (3.3V) and provides an SMBus interface. Coupled with a graphical user interface (GUI), engineers can intuitively configure PLL parameters and output enable states while measuring key performance metrics in real time, accelerating design verification.

2. Typical Application Scenarios

Data Centre Servers: Provides multi-channel, low-jitter clock distribution for CPUs, PCIe switches, and NVMe SSDs.

Network Communication Equipment: Ensures clock synchronisation for high-speed SerDes interfaces in switches and routers.

Test and Measurement Instruments: Forms part of high-precision clock sources, guaranteeing timing consistency for signal acquisition.

This evaluation board enables engineers to rapidly validate buffer jitter margin, signal integrity, and power noise sensitivity within target systems, thereby optimising clock network design.

II. Haptic Driver Evaluation System: Redefining Human-Machine Interaction

From smart home appliances to industrial control panels, capacitive touch interfaces are increasingly prevalent due to their intuitive, durable, and easy-to-clean characteristics. Renesas Electronics' haptic driver evaluation systems (such as RTK0EG0022S01001BJ and RSSK-RX140) provide a complete, ready-to-use solution for rapid development and evaluation of capacitive touch user interfaces.

1. System Composition and Core Features

The evaluation system typically comprises a CPU board equipped with an MCU and an application board integrating multiple touch sensors.

High-Performance Hardware Platform: Taking the RTK0EG0022S01001BJ as an example, its core is the RA2L1 MCU (based on the Arm Cortex-M23 core), featuring an integrated capacitive touch sensing unit (CTSU). This unit supports up to 36 sensing channels and offers immunity to electromagnetic interference, complying with IEC 61000-4-3/4-6 Level 3 standards to meet reliability requirements in industrial environments.

Intelligent Development Toolchain: The system's core strength lies in its robust software support – the ‘QE for Capacitive Touch’ tool. Integrated as a plugin within Renesas' e² studio IDE, this tool provides an intuitive GUI enabling engineers to effortlessly accomplish the following tasks, even without deep expertise in touch sensing:

Sensor Initialisation Configuration: Rapidly set up controls such as buttons, sliders, and scroll wheels.

Real-time sensitivity tuning: Graphically adjust parameters to optimise response under varying conditions (humidity, gloved operation).

Automatic code generation: Upon tuning completion, the tool automatically outputs optimised C source code for direct project integration, significantly reducing development cycles.

2. Typical Application Scenarios

Consumer electronics: Touch controls for smart kitchen appliances (induction hobs, extractor hoods), smart pens, and gaming peripherals.

Industrial HMI: Non-contact control panels for factory equipment, touch interfaces for medical infusion pumps.

Building Automation: Capacitive touch-enabled light switches, temperature control panels.

This evaluation system simplifies complex touch algorithms and hardware tuning processes, enabling developers to focus on implementing application logic and innovative features.

III. IO-Link Line Driver Evaluation Board: Bridging the “Last Metre” to Industry 4.0

As a fieldbus-independent point-to-point communication standard, IO-Link has become pivotal for enabling intelligent, digital industrial sensors and actuators. Renesas' IO-Link master evaluation boards (such as components in CCE4510-EVAL-V3 and ZSSC3286KIT) provide highly integrated hardware and software reference designs for developing IO-Link systems.

1. Core Chip and Architectural Advantages

Taking the CCE4510-EVAL-V3 evaluation board as an example, its core is the CCE4510 IO-Link master transceiver IC.

Highly integrated to reduce master controller burden: The CCE4510 is not merely a physical layer driver; it incorporates an internal hardware frame processor. This module automatically handles the underlying message sequencing, timeout management, and data verification in IO-Link communications. This liberates the master MCU (such as the RX231 on the evaluation board) from cumbersome real-time communication tasks, enabling it to focus on higher-level application logic or execute additional tasks.

Robust Drive and Protection Capabilities: Each CCE4510 provides two IO-Link channels with a peak drive current of 1A, enabling direct driving of high-current loads. The evaluation board further incorporates additional protection circuits to ensure stable operation under 24V industrial voltage conditions.

Complete Evaluation and Development Kit: For sensor-side development, the ZSSC3286KIT offers a comprehensive end-to-end solution. It comprises a sensor signal conditioner (ZSSC3286) evaluation board, CCE4510 master board, IO-Link PHY board, and dedicated software. This supports sensor configuration, calibration, and functional evaluation via IO-Link or I²C interfaces, and includes an IO-Link Device Description (IODD) file generator. It serves as a rapid entry tool for implementing ‘smart sensors’.

2. Typical Application Scenarios

Factory Automation: Connecting digital pressure/temperature sensors, RFID readers, smart valve islands, etc.

Process Industries: Enabling digitalisation of analogue sensors and remote parameter configuration.

Modular Machinery: Supporting rapid changeovers and recipe switching for equipment.

Renesas also offers more advanced IO-Link master development kits based on platforms like the RZ/N1S MPU, supporting multi-protocol industrial networks and enabling the construction of complex gateway devices.