company blog about Recycle Samtec High Density Array Connectors:SUPERNOVA™ Series,HD MEZZ Series,E.L.P.™ Series,SureWare™ Series

Recycle Samtec High Density Array Connectors:SUPERNOVA™ Series,HD MEZZ Series,E.L.P.™ Series,SureWare™ Series

Shenzhen Mingjiada Electronics Co., Ltd. is a company that focuses on electronic components recycling, sales and inventory disposal. Below are the company's detailed information on electronic components recycling:

1. Recycling scope
Electronic components: including integrated circuits (ICs), diodes, transistors, connectors, sensors, microcontrollers, 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, Telematics ICs, automotive ICs, automotive-grade ICs, telecommunication ICs, AI ICs and so on.
Inventory disposal: Recycle the backlog of electronic components inventory of factories, individuals and agents.

2. Recycling process
Consultation and quotation: Customers provide information such as component model, quantity, brand, etc., and the company provides quotation after evaluation.
Detection and evaluation: After receiving the components, we will carry out professional testing to ensure that the quality and model are correct.
Payment and Settlement: After confirming the correctness, payment will be made according to the agreed method, and a variety of settlement methods will be supported.

3. Service Advantages
Professional team: We have an experienced technical team to ensure that the recycling process is efficient and accurate.
Reasonable price: Provide competitive offer according to market conditions.
Confidentiality agreement: Strictly protect customer information to ensure transaction security.

SUPERNOVA™ Series
High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

Features
1.27 mm standard body height
1.00 mm pitch
Dual compression contacts
100 – 300 total pins
Ideal for low cost board stacking, module-to-board and LGA interfaces
Minimizes thermal expansion issues
Analog Over Array™ capable

Product：GMI

HD MEZZ Series
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.

Features
Application specific capability to stack heights from 20 mm to 35 mm
Open pin field design
Performance: Up to 9 GHz / 18 Gbps
Integrated guide posts to minimize contact damage when mating and unmating
Solder charge terminations for ease of processing
2.00 mm x 1.20 mm pitch
Up to 299 I/Os
Intermateable with Molex HD Mezz Arrays
HD Mezz is a trademark of Molex Incorporated

Product：HDAF，HDAM

E.L.P.™ Series
These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

Features
Passed 10 year Mixed Flowing Gas (MFG)
High-mating cycles (250 to 2,500)
Variety of high-reliability, rugged contact systems
Various connector types and pitches available

Product：ADF6，ADM6，BCS，TSW，BSE，BTE，BSH，BTH，BSS，BTS，CLM，FTMH，CLP，FLE，FTSH，CLT，TMMH，ERF8，ERE8-S，HSEC8-DV，HSEC8-EM，HSEC8-PV，HSEC8-RA，QRF8，QRM8，QSE，QTE，QSH，QTH，QSS，QTS，SEAF，SEAM，SEAF8，SEAM8，SEM，TEM，SFM，TFM，SMM，TMM，SSM，TSM

SureWare™ Series
Samtec offers a variety of SureWare™ hardware for connector support, including precision standoffs, alignment hardware, and guidance modules to assist with mating/unmating and help ensure a reliable connection.

Features
Standoffs for 4 mm to 30 mm stack heights
Reduces risk for component damage on boards
SureWare™ guide post standoffs (GPSO) allow for 0.035" of initial misalignment and assist with "blind mate"
Standoffs designed for PCI/104-Express™ and VITA™ standards
Guidance modules for ExaMAX® backplane systems

Product：GPSO，GPSOM，SO，JSO，JSOM，GPSK，GPPK，EGBF，EGBM