Recycle Silicon Labs Multiprotocol Wireless SoC Products:SiMG301 Series 3,EFR32MG27 Series 2
Shenzhen Mingjiada Electronics Co., Ltd., a globally renowned electronic component recycling company, leverages its strong financial standing and excellent commercial reputation to provide professional recycling services for personal stock, factory stock and goods detained by customs, helping customers to quickly clear their stock, alleviate warehousing pressure and recover funds.
Advantages of Mingjiada Electronics’ Recycling Services
Professional Chip Assessment: Our technical team is well-versed in product specifications, packaging variants and batch authenticity, verifying original labels, packaging and silk-screen printing. Brand-new, original, unopened and reel-and-tape materials are prioritised for higher valuations; refurbished or board-disassembled components are not accepted.
Efficient Transaction Process: We provide preliminary valuations based on photographs or lists, and support on-site inspections and sample verification via post. Upon successful acceptance, settlement is processed promptly via cash or bank transfer, shortening the payment cycle and alleviating a company’s warehousing pressures whilst freeing up working capital.
Wide service coverage: Centred in Shenzhen, we cover cities across mainland China and support settlement in Hong Kong. We accept factory end-of-line stock, surplus materials from cancelled projects, distributors’ dead stock and surplus R&D materials for recycling.
Recycling Guidelines
Please provide the complete part number, package type, quantity, batch number and packaging condition (reel/tube/pallet) of the materials, and Mingjiada Electronics will issue a quote promptly. We only accept brand-new, original, genuine electronic components.
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Silicon Labs’ Series 3 SiMG301 and Series 2 EFR32MG27 are two generations of 2.4GHz multi-protocol wireless SoCs designed for the Matter, Zigbee and BLE ecosystems. They are respectively optimised for high-performance mains-powered mesh end devices and battery-powered ultra-low-power end devices, covering smart home, building automation and smart lighting, providing IoT devices with highly reliable multi-protocol connectivity, hardware security and RF capabilities.
I. SiMG301 Series 3 Multi-Protocol Wireless SoC
The SiMG301 belongs to Silicon Labs’ new-generation Series 3 platform, utilising an advanced 22nm process. It is deeply optimised for mains-powered smart devices, targeting mesh network nodes such as smart LED lighting, smart sockets and wall switches. It supports concurrent multi-protocol operation, meeting the requirements of Matter devices for large-capacity protocol stacks and edge computing power.
1. Key Hardware Features
Multi-core architecture: Features an ARM Cortex‑M33 application core with a maximum clock speed of 150MHz, a dedicated RF core and a security engine core. Application, wireless and security tasks are physically isolated to prevent protocol stacks from competing for computing resources.
Memory Configuration: Up to 4MB of Flash and 512KB of RAM, providing ample memory to support concurrent protocol stacks for Matter over Thread, Zigbee and BLE, whilst reserving space for firmware iterations and minimising the need for hardware revisions.
RF Performance: 2.4GHz RF with a maximum transmit power of +10dBm and a receive sensitivity of –106.3dBm, enabling long-range mesh networking with strong interference resistance.
Dedicated Lighting Peripherals: Integrated enhanced PWM, PIXELRZ single-wire LED interface and LED pre-driver, eliminating the need for external LED drivers, reducing BOM costs and minimising PCB footprint, suitable for various smart lighting designs including RGB and CW.
Security Capabilities: Secure Vault™ High, PSA Certified Level 4, the highest level of hardware security for the Internet of Things (IoT), supporting secure boot, key isolation and tamper protection to safeguard device firmware and user data.
Power Supply Mode: Designed specifically for mains-powered devices, suitable for LED lighting and plug-in gateway terminals, without reliance on battery power.
2. Protocol Support
Supports concurrent multi-protocol CMP, enabling a single chip to run Matter over Thread, Zigbee 3.0 and BLE (Bluetooth Low Energy) simultaneously. A single hardware solution is compatible with multiple smart home ecosystems, simplifying product SKU management, and is compatible with the Simplicity Studio 5 development kit and the EmberZNet protocol stack.
3. Typical Application Scenarios
Suitable for whole-home smart lighting, RGB smart light strips, smart wall sockets, smart switches, mains-powered building automation nodes and Matter gateway terminals; designed for plug-in IoT devices requiring large memory capacity, concurrent multi-protocol support and high-level hardware-based security.
II. EFR32MG27 Series 2 Multi-Protocol Wireless SoC
The EFR32MG27 Series 2 is a mature, mass-produced second-generation platform focused on compact, battery-powered end devices. It is specifically designed for Zigbee Green Power devices, offering extreme energy efficiency, extremely low operating voltages and streamlined hardware, making it suitable for sensor end devices powered by button cells or single-cell alkaline batteries.
1. Key Hardware Features
Processor core: ARM Cortex‑M33, clocked at 76.8 MHz, with integrated DSP and FPU (floating-point unit), supporting lightweight signal processing to meet the local computing requirements of sensors.
Memory Configuration: Up to 768KB of Flash and 64KB of RAM, sufficient for running firmware on Zigbee, BLE and lightweight Matter end devices; QFN32 compact package; up to 18 GPIO pins, suitable for compact sensor PCB layouts.
Ultra-low-power power subsystem: Integrated DC-DC boost converter enables operation at voltages as low as 0.8V, directly supporting power from a single alkaline or button cell battery, thereby significantly extending battery life; with a receive current of just 4.0mA and extremely low sleep power consumption, it is the preferred solution for passive, low-frequency reporting end devices.
RF Specifications: 2.4 GHz RF, maximum transmit power of 8 dBm; reception sensitivity of –106.9 dBm in 125 kbps GFSK mode; excellent reception sensitivity ensures network stability in weak-signal environments.
Security Configuration: Secure Vault™ Mid, SESIP Level 3 security rating; supports secure boot and root of trust, meeting the security compliance requirements for standard IoT devices.
2. Protocol Support
Supports Zigbee 3.0 (including Green Power), BLE Low Energy, BLE Mesh and Thread; compatible with Matter terminal device firmware; adapted to the mature EmberZNet protocol stack; extensively validated in mass production; paired with the MGM270S SiP (System-in-Package) module to shorten product certification cycles.
3. Typical Application Scenarios
Suitable for battery-powered door and window sensors, infrared human presence sensors, temperature and humidity sensors, passive switches, Zigbee Green Power end devices, security detectors and small building sensor nodes; ideal for battery-powered IoT end devices where battery life, size and cost are critical considerations.
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