Recycle TI Low-Power 2.4GHz Wireless Products:CC2755P20,CC2340R5MODA,CC2755P10
Shenzhen Mingjiada Electronics Co., Ltd. has specialised in the electronic component recycling sector for many years and is a professional provider of inventory management and recycling services within the industry. We purchase genuine, original manufacturer products, obsolete stock, discontinued products and idle chips at highly competitive prices, helping businesses to rapidly reduce inventory, recover capital and minimise warehousing and management costs.
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1. High-value recycling with industry-leading quotes
Based on global market trends and taking into account model, batch, packaging, quantity and condition (original packaging/mounted on boards/unmounted), we provide accurate quotations that are 10%–30% higher than those of our competitors.
There are absolutely no hidden fees; genuine, original products (including those in original packaging or on pallets) will receive priority processing and higher quotations, whilst obsolete stock, discontinued orders and dismantled components will all be fairly priced.
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No quantity restrictions: from a single sample to batches of hundreds or tens of thousands of items, we cater for all;
No condition restrictions: we purchase brand-new, original products, slow-moving stock, components mounted on boards or disassembled, as well as tested components;
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From inventory categorisation → submission of lists → quotation → inspection → settlement → logistics, we provide full-process support to ensure you enjoy a hassle-free and efficient experience
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Texas Instruments’ SimpleLink™ 2.4GHz wireless MCU portfolio, built on a unified software development ecosystem, spans three tiers: entry-level cost-effective modules, mid-range all-round multi-protocol chips, and high-end, high-power edge AI security flagships. With ultra-low power consumption, multi-protocol compatibility, hardware security and RF performance, it is fully suited to smart home, industrial sensing, wearable devices, asset tracking, building automation, and other IoT scenarios, including sensing applications for humanoid robots.
I. Detailed Analysis of Individual Product Features
1. CC2340R5MODA: Pre-certified, integrated-antenna, ultra-low-power Bluetooth module (the benchmark for entry-level value)
The CC2340R5MODA is a ready-to-use, RF-certified wireless module launched by TI. Based on the CC2340R5 chip, it features an integrated PCB antenna, eliminating the need for user RF tuning or repeated Bluetooth certification, thereby significantly shortening the hardware development cycle. Focusing on extreme power efficiency and affordability, it is one of the optimal choices for small, battery-powered IoT end devices.
Core and Computational Performance
Equipped with a 48MHz 32-bit Arm Cortex-M0+ core, it consumes just 2.6mA during operation (CoreMark benchmark), delivering excellent energy efficiency. Its streamlined architecture is optimised for lightweight tasks such as serial pass-through, button input and temperature/humidity readings, eliminating power wastage caused by redundant computing power.
Ultra-Low Power Specifications (3.3V Supply)
- Sleep mode: 710 nA (RTC always on + full SRAM data retention)
- Shutdown mode: 165 nA, supports pin wake-up
- RF reception (RX): 5.5 mA; 0 dBm transmission (TX): 5.1 mA; +8 dBm full-power transmission: <11 mA
With power consumption in the microampere range during sleep mode, a button cell battery can provide several years of battery life (Texas Instruments...).
RF and Protocol Capabilities
- Fully certified Bluetooth 5.4: supports 2 Mbps high-speed transmission, LE-coded long-range mode, periodic broadcasting, extended broadcasting, and Bluetooth channel probing for ranging; 125 kbps long-range sensitivity of –102 dBm, with a maximum line-of-sight communication range of 200 m
- Compatible with Zigbee 3.0 and TI 15.4 proprietary protocols; switchable networking modes
- Integrated balun (BALUN) reduces the number of external components and lowers BOM costs; on-board PCB antenna with reserved pads for external antennas to accommodate long-range requirements
Peripherals and Security Configuration
Equipped with an 8-channel 12-bit ADC, I²C/SPI/UART, hardware RTC, battery voltage monitoring and temperature sensor; features a built-in AES-128 encryption accelerator and true random number generator to meet basic data encryption requirements; supports OTA wireless firmware updates for convenient post-deployment maintenance.
Typical Application Scenarios
Suitable for domestic door and window magnetic contacts, temperature and humidity sensors, wireless switches, Bluetooth remote controls, smart wristbands and electronic toys; also suitable for lightweight wireless data acquisition units such as fingertip pressure sensors for humanoid robots and environmental temperature and humidity sensing nodes on robot bodies.
2. CC2755P10: Mid-range, all-round, multi-protocol, high-power, secure wireless MCU (flagship for whole-home connectivity)
The CC2755P10 is a flagship model in TI’s new-generation CC2755P series, designed for Matter multi-protocol whole-home connectivity scenarios. It strikes a balance between power consumption, RF range, hardware security and computing power, supporting high-power long-range communication and lightweight edge AI processing, whilst providing ample performance headroom for complex IoT end devices.
Core Computing Architecture
A 96MHz Arm Cortex-M33 core, integrated with a floating-point unit (FPU) and the TrustZone-M hardware-isolated security architecture; equipped with a CDE (Custom Data Path Extension) unit capable of running lightweight neural network inference; a dedicated APU (Algorithm Processing Unit) handles Bluetooth channel probing FFT and MUSIC high-precision ranging calculations without utilising main CPU resources.
Memory Resources
1MB on-chip programmable Flash + 162KB SRAM, capable of fully storing the four protocol stacks (Matter, Thread, Zigbee and BLE 5.4), supporting seamless concurrent switching between multiple protocols; 32KB system ROM containing the secure boot root of trust and bootloader, eliminating the risk of firmware tampering.
Power Consumption and RF Specifications
- Sleep mode: 0.9 μA (RTC enabled + all SRAM data retained); shutdown mode: 160 nA
- RF: Maximum transmit power of +20 dBm, with line-of-sight transmission distances far exceeding those of conventional Bluetooth chips; RX receive current 6.1 mA, 0 dBm transmission 7.7 mA, and +10 dBm high-power transmission 24.5 mA; built-in integrated RF switch and balun, with a single RF pin for both transmission and reception, simplifying PCB routing
Flagship-level Hardware Security Architecture (Core Advantage of the P Series)
Equipped with a dedicated hardware security module (HSM): supports hardware-accelerated AES-256, ECC-521, RSA-3072 and SHA-512; features differential power analysis (DPA) protection, voltage glitch attack detection, secure boot, encrypted firmware OTA updates and hardware-isolated key storage, meeting high-security IoT compliance requirements for industries such as industrial and medical applications (Texas Instruments).
Comprehensive Protocol Coverage
Native compatibility with BLE 5.4 (seamless upgrade to BLE 6.0), Matter 1.2, Thread 1.3, Zigbee 3.0 and 2.4GHz proprietary protocols, making it the core controller chip for cross-brand interconnectivity in smart homes and industrial wireless sensor networks.
Suitable Applications
Matter smart lighting gateways, industrial wireless data acquisition terminals, portable medical monitoring devices, high-precision asset tracking tags; multi-sensor fusion control units for humanoid robots, and wireless communication relay units.
3. CC2755P20: High-end, ultra-high-capacity storage AI flagship wireless MCU (the preferred choice for complex networking and edge computing)
The CC2755P20 is the top-of-the-range model in the CC2755P series, featuring double the storage capacity and maximised computing resources. Designed for high-end IoT devices requiring complex algorithmic processing, ultra-large firmware storage and long-term multi-node networking, it serves as the core component of an integrated solution for edge AI and long-range, high-power communication.
Top-tier specifications for computing power and storage
- Dual-core architecture comprising a 96MHz Cortex-M33 core and a dedicated 96MHz APU algorithm processor, significantly enhancing vector and matrix processing capabilities to support the deployment of more complex lightweight AI models for human presence detection and environmental recognition
- Storage: 2MB Flash + 288KB SRAM, providing ample space to accommodate multi-protocol stacks, AI model files and local log caches; eliminates the need for external Flash chips, further streamlining the hardware architecture
RF, power consumption and security maintain high-end standards
Inherits all features of the CC2755P10: maximum transmit power of +20 dBm, ultra-low standby power consumption of <1 μA, a comprehensive HSM hardware security encryption system, TrustZone-M software isolation, and Bluetooth high-precision channel ranging; operating temperature range covers -40°C to 125°C, making it suitable for harsh industrial environments with significant temperature fluctuations.
Extensive Peripheral Expansion Capabilities
23 programmable GPIO pins, all supporting interrupt-based wake-up; equipped with multiple timers, a quadrature decoder module, an I²S audio interface, comparators and a hardware watchdog, enabling connection to motor drivers, audio modules and various analogue sensors, offering exceptional expandability.
Core Application Scenarios
Central routing nodes for building automation; high-precision asset tracking base stations for warehousing; industrial wireless sensor gateways; portable AI sensing devices; wireless control units for humanoid robot torsos; and master controllers for multi-joint wireless collaborative communication, meeting the requirements for multi-node data exchange and environmental perception processing in robotics.
II. Key Comparison Points for Product Selection
1. For low cost, rapid mass production and minimal development effort: Select the CC2340R5MODA factory-pre-certified module to eliminate RF debugging and certification cycles; with a button cell battery providing several years of battery life, it is suitable for small sensor terminals;
2. Requiring Matter multi-protocol networking, long-range communication, basic security and light AI: The CC2755P10 is the preferred choice, offering a balanced combination of storage, power consumption and RF performance; suitable for whole-home smart home systems and industrial portable devices;
3. Edge AI processing, ultra-large firmware storage, complex networking gateways, and demanding industrial environments: Select the CC2755P20, featuring ultra-large memory and a dual-processing architecture, capable of handling complex algorithms and multi-node data forwarding.
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