company blog about [Sensor] Supply and Demand: Infineon IRS2975C, IRS2976C REAL3™ 3D Time-of-Flight Image Sensors

Mingjiada Electronics supplies Infineon's REAL3™ series i-ToF (indirect time-of-flight) 3D image sensors, with a current focus on stocking two highly integrated ToF sensor dies: the IRS2975C (HQVGA resolution) and IRS2976C (VGA resolution). These products are widely used in smartphone facial recognition, service robot navigation, AR/VR devices, and smart security systems. Simultaneously, Mingjiada offers premium buyback services for surplus inventory of this series, providing one-stop supply chain solutions.

Product Overview

The IRS2975C and IRS2976C represent the sixth generation of REAL3™ i-ToF image sensors, jointly developed by Infineon and its 3D ToF technology partner pmdtechnologies. Both sensors leverage Infineon's latest pixel technology innovations, achieving back-illuminated (BSI) sensor-level quantum efficiency (QE) while maintaining the cost advantages of front-illuminated (FSI) sensors. This delivers a cost-effective solution for consumer and industrial 3D vision applications.

Key Differences:

IRS2975C: HQVGA resolution (240×180), ultra-compact 18mm² die size, targeting smartphones and small IoT devices

IRS2976C: VGA resolution (640×480), 23mm² die size, pin-compatible with IRS2877C, supporting 10m+ long-range measurement

1. IRS2975C — HQVGA Highly Integrated ToF Sensor

Core Technical Parameters

Resolution: 240 × 180 pixels (HQVGA)

Image Circle Size: 1/6 inch, die area 18 mm²

Pixel Size: 10 µm (high-sensitivity pixels)

ToF Technology: Indirect Time-of-Flight (i-ToF), based on pmdtechnologies' patented SBI technology

Quantum Efficiency (QE): High quantum efficiency (enhanced by embedded optical reflector)

Background Light Suppression: SBI (Suppression of Background Illumination) technology, supporting High Dynamic Range (HDR) and bright light environments

Supply Voltage: 2.8V single-supply operation

Laser Safety: Integrated complete laser safety features, including unique eye protection mechanism, with flexible output power customization

*Companion Chip: IRS9102C VCSEL driver for optimized BoM cost

Package Type: Bare Die, enabling highly customized module designs

Operating Temperature: -40°C to +85°C (Industrial-grade temperature range)

Typical Applications: Smartphones (facial recognition, AR), service robots (navigation/obstacle avoidance), drones, projectors (keystone correction)

Technical Highlights

Revolutionary Pixel Technology: 3D field-effect engineering optimizes demodulation efficiency; embedded optical reflectors elevate quantum efficiency to BSI sensor levels while maintaining FSI cost advantages

Low-Power Design: Supports 2.8V low-voltage operation, ideal for battery-powered embedded devices

Compact Size Advantage: Ultra-small 18mm² die area, suitable for space-constrained consumer electronics

2. IRS2976C — VGA Long-Range High-Performance ToF Sensor

Core Technical Parameters

Resolution: 640 × 480 pixels (VGA)

Image Circle Size: 1/4-inch (4mm), 23 mm² chip area

ToF Technology: Indirect Time-of-Flight (i-ToF), 6th-generation pixel design

Quantum Efficiency (QE): ≥30% (Industry-leading, comparable to BSI sensors)

Measurement Range: 10 meters and beyond (long-range low-power mode)

Backlight Suppression: SBI technology integrated per pixel, supports HDR and sunlight scenarios

Certifications: Google Class 3 (Strong) facial recognition certified, supports under-display operation

Compatibility: Pin-compatible with IRS2877C (drop-in replacement), facilitates existing system upgrades

Package Type: Bare Die/Wafer Sawn

Operating Temperature: -40°C to +85°C

Typical Applications: Smartphone facial authentication, AR/VR headsets, smart door locks, payment terminals, service robots, AGV/AMR

Technical Highlights

Long-Range Measurement: VGA resolution combined with high-QE pixels enables precise depth measurement beyond 10 meters, ideal for robot navigation and security surveillance

Under-Display Facial Recognition: Industry's first ToF sensor certified for Google Class 3, enabling hidden installation beneath smartphone displays

Compactest 3D Camera System: Paired with IRS9102C VCSEL driver, enables ultra-small 3D camera module designs to optimize system costs

High-Value Recycling Service

Mingjiada Electronics specializes in cash purchases of IRS2975C, IRS2976C, and related ToF sensor inventory:

VI4310

VI4320

VI4330

IMX459

IRS2877C

IRS9102C

IRS2877A

IRS9103A

Recycling Advantages:

Professional Evaluation: Specialized ToF sensor testing capabilities to assess chip functionality and residual value

Flexible Settlement: Supports recycling from single units to full wafer batches with immediate cash payment

Confidential Handling: Strict protection of client product information with NDA agreements

Environmental Compliance: Recycled materials undergo professional processing before re-entering the market, reducing electronic waste