Introduction: In the fields of servers, network communications, and industrial control, the stability and cost-effectiveness of memory chips are of critical importance. Shenzhen Mingjiada Electronics, as an industry-leading distributor of electronic components, offers H5AN8G8NCJR-XNC DDR4 ETT memory chips in stock. This model features an 8Gb capacity and an x8-bit width architecture, supporting high-speed DDR4-3200 data transfer. It is perfectly suited for demanding applications such as servers, data storage, 5G communication base stations, and industrial embedded systems, striking a balance between performance and cost.
Product Overview: High-Quality ETT Memory Chips
The H5AN8G8NCJR-XNC is an 8Gb CMOS DDR4 SDRAM ETT memory chip launched by SK Hynix. ETT (Effectively Tested) chips indicate that the chips have undergone comprehensive factory screening for basic electrical characteristics, timing, and stability. Compared to untested UTT chips, they offer greater quality assurance while providing a significant cost advantage over the manufacturer’s Major-grade chips. This feature makes it an ideal memory solution for mid- to high-end servers, network communication equipment, and industrial control systems.
The chip features a 1G x 8-bit architecture, a 78-ball FBGA package, a standard operating voltage of 1.2V, and supports a maximum data transfer rate of 3200MT/s, perfectly balancing high bandwidth, low power consumption, and long-term reliability.
Key Specifications
Brand: SK Hynix
Model: H5AN8G8NCJR-XNC
Storage Capacity: 8 Gbit (1 GB)
Architecture: 1G × 8-bit
Memory Type: DDR4 SDRAM
Data Rate: Up to 3200 MT/s (DDR4-3200)
Clock Frequency: Up to 1600 MHz
Operating Voltage: 1.14V ~ 1.26V (typical 1.2V)
Package Type: 78-ball FBGA
Operating Temperature: 0°C ~ +85°C (commercial grade)
Refresh Current: 30mA (typical)
Operating Current: 39mA (typical)
Key Features and Advantages
1. High-Performance DDR4 Architecture
Utilizes a 16n pre-fetch architecture that transmits data simultaneously on both the rising and falling edges of the clock, achieving an equivalent data rate of 3200MT/s. Fully compliant with the JEDEC DDR4 standard, it supports a full suite of DDR4 features—including write equalization, ZQ calibration, dynamic on-chip termination (ODT), CRC checksum, and data masking (DM)—to ensure signal integrity and data reliability during high-speed transmission.
2. Low-Power, Energy-Efficient Design
With a core operating voltage of just 1.2V, power consumption is reduced by approximately 20% compared to DDR3’s 1.5V. Built-in Temperature-Compensated Self-Refresh (TCSR) and Partial Array Self-Refresh (PASR) functions effectively reduce standby power consumption, making it suitable for scenarios requiring 24/7 operation, such as servers and data centers.
3. ETT-Grade Quality Assurance
As ETT (Effective Test) certified memory chips, these have undergone the manufacturer’s full suite of electrical tests, including voltage margin, timing stress, high- and low-temperature cycling, read/write endurance, and leakage current testing. Their quality consistency and stability far exceed those of UTT (Untested) chips, resulting in a significantly lower failure rate while maintaining cost-effectiveness.
4. Standard FBGA Package
It features a compact, low-profile 78-ball FBGA package that occupies minimal PCB space, making it suitable for high-density memory module designs and compact circuit board layouts, and supports surface-mount technology (SMT).
Typical Applications
Thanks to its high speed, stability, and cost-effectiveness, the H5AN8G8NCJR-XNC is suitable for a wide range of applications:
Servers and Data Centers: Core memory chips for enterprise-class servers, cloud servers, and edge computing nodes, meeting high-bandwidth and low-power requirements.
Network and Communications Equipment: 5G base stations, core network routers, switches, and network security devices, supporting high-speed forwarding of massive amounts of data.
Industrial Control and Embedded Systems: PLCs (Programmable Logic Controllers), industrial robots, CNC machine tools, smart gateways, Human-Machine Interfaces (HMIs), and more.
Personal Computers and Workstations: Desktop/laptop memory modules and high-performance workstations, meeting the memory performance demands of high-end games and professional design software.
Consumer Electronics: Smart TVs, set-top boxes, game consoles, and more.
Why Choose Mingjiada Electronics?
Shenzhen Mingjiada Electronics Co., Ltd. was founded in 1996 and has been deeply involved in the electronic component distribution sector for over thirty years. Headquartered in Shenzhen, the company has branches in Hong Kong, Japan, Russia, Taiwan, and other locations.
Authenticity Guarantee: Certified under the ISO 9001 Quality Management System and ISO 14001 Environmental Management System, all chips are 100% sourced through official channels from original manufacturers and are batch-traceable.
In-Stock Availability: Our warehousing centers in Shenzhen and Hong Kong maintain massive inventory, enabling rapid shipment within 48 hours to meet urgent order demands.
Flexible Procurement: We support both small-batch sample production and large-volume orders, and provide one-stop BOM fulfillment services.
Global Service Network: We partner with over 500 renowned global semiconductor manufacturers, including XILINX, ALTERA, AD, TI, ST, NXP, SAMSUNG, and INTEL.
Product Availability Status
Current Status: In Stock
Lot Numbers: 26+
Stock Quantity: 1,000+ pcs (subject to real-time changes; please contact us for confirmation)
Packaging: Pallet
Package: FBGA-78
For detailed specifications, sample requests, or bulk purchase quotes, please contact:
Contact: Mr. Chen
Phone: +86 13410018555 / 86-755-83294757
Email: sales@hkmjd.com
Address: Rooms 1239–1241, New Asia Guoli Building, Zhenzhong Road, Futian District, Shenzhen
Website: https://www.integrated-ic.com/
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