Mingjiada Electronics: Professional Supply and Recycling of Qualcomm Dragonwing™ QCS-8550-2-MPSP1581-TR-02-0-AB Flagship Edge AI Processor Chip
Product Overview
The QCS-8550-2-MPSP1581-TR-02-0-AB is a flagship edge AI processor chip from Qualcomm's Dragonwing™ series. Built on the Snapdragon 8 Gen 2 mobile platform, it utilizes TSMC's advanced 4nm (N4) process technology. This chip deeply integrates 48 TOPS AI computing power, Wi-Fi 7 high-speed connectivity, and enhanced graphics/video processing capabilities. It delivers core computing support for high-performance IoT applications such as autonomous mobile robots (AMR), industrial drones, smart cockpits, and cloud gaming terminals, enabling customers to achieve rapid deployment and mass production.
Specifications
■ Processor Architecture
Core CPU: Octa-core Kryo CPU (1x 3.2GHz + 4x 2.8GHz + 3x 2.0GHz)
AI Computing (NPU): Dual eNPU V3, 48 TOPS (INT8)
GPU: Adreno™ 740 with hardware-accelerated ray tracing
Image Processing: Cognitive ISP supporting up to 108MP single camera or 64MP+36MP dual cameras
Video Codec: Supports 8K60 decoding and 4K120 encoding, integrated AV1 decoder
■ Memory & Storage
Memory Support: Quad-channel LPDDR5X, up to 4200MHz, supports 16GB high-capacity configuration
Storage Support: Compatible with eMMC 5.1 and UFS 4.0, doubling sequential read/write speeds for enhanced system responsiveness
■ Connectivity
Wi-Fi: FastConnect 7800, supports Wi-Fi 7 (802.11be), peak speed 30Gbps, tri-band concurrent operation
Bluetooth: Bluetooth 5.3, supports LE Audio and multi-device simultaneous connections
Cellular:
QCM-8550 variant integrates Snapdragon X70 5G modem, supports dual-connectivity with mmWave and Sub-6GHz
SA/NSA modes, 8-carrier mmWave 2×2 MIMO, Sub-6GHz 4×4 MIMO
Positioning Systems: Parallel GPS, Glonass, BeiDou, Galileo, NavIC, QZSS, Sensor-Aided Positioning 6.0
■ Multimedia Performance
Video Encoding: 8K@30fps, 4K@120fps H.264/H.265 recording
Video Playback: 8K@60fps HDR10+ decoding
Camera Support:
Triple Camera Concurrent: Up to 36MP@30fps (Zero Shutter Lag)
Dual Camera Combination: 64MP+36MP@30fps ZSL
Single Camera Mode: Up to 108MP@30fps ZSL, 200MP photo capture
■ System & Power
Operating Systems: Compatible with Android, Linux, and RTOS
Power Management: Advanced thermal management with Dynamic Voltage and Frequency Scaling (DVFS) for optimized efficiency
Operating Temperature: Industrial-grade -40°C to +85°C
Package: FC-BGA high-density ball grid array
Target Applications
• Autonomous Mobile Robots (AMR)
• Industrial Drones
• Retail
• Video Collaboration
• Video Transcoding
• Cloud Gaming
• Edge AI Gateways
Mingjiada Electronics Supply & Recycling Details
Mingjiada Electronics supplies brand-new, original QCS-8550-2-MPSP1581-TR-02-0-AB processor chips from stock with ample inventory and fast delivery.
Professional Recycling Services
Mingjiada Electronics offers long-term, high-value recycling for all Qualcomm AI processor chips, including this model. Standard recycling process:
Communication: Provide chip model, quantity, production batch, and other details.
Quotation: Our evaluation team responds with a quote within 24 hours.
Inspection & Payment: Supports on-site pickup or logistics delivery with prompt settlement after inspection.
Contact Information
For procurement or recycling inquiries, contact Mingjiada Electronics via:
Contact: Mr. Chen
Phone: +86 13410018555
Email: sales@hkmjd.com
Address: Room 1239-1241, Xin Asia Guoli Building, Zhenzhong Road, Futian District, Shenzhen, Guangdong Province
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