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Supply And Recycle Xilinx XAZU2EG-1SFVC784I: Zynq® UltraScale+™ MPSoC EG High-Performance System-On-Chip
Latest company news about Supply And Recycle Xilinx XAZU2EG-1SFVC784I: Zynq® UltraScale+™ MPSoC EG High-Performance System-On-Chip

Supply And Recycle Xilinx XAZU2EG-1SFVC784I: Zynq® UltraScale+™ MPSoC EG High-Performance System-On-Chip

 

Shenzhen Mingjiada Electronics Co., Ltd. — Long-term [Supply/Recycling] Xilinx (now AMD) XAZU2EG-1SFVC784I System-on-Chip (SoC). This product belongs to the Zynq® UltraScale+™ MPSoC EG series. Featuring an FCBGA-784 package and a core configuration of 103K+ logic units, coupled with the advantages of its heterogeneous architecture, it stands as the preferred chip for high-end electronic equipment development.

 

I. Core Parameter Analysis: XAZU2EG-1SFVC784I Performance Highlights
The XAZU2EG-1SFVC784I stands as the flagship offering within Xilinx's Zynq® UltraScale+™ MPSoC EG series. Fabricated using the industry-leading 16nm FinFET+ process technology, it centres on a ‘CPU+FPGA’ heterogeneous architecture. This design delivers a composite capability encompassing general-purpose computing, real-time control, and hardware acceleration, precisely meeting the demanding requirements of mid-to-high-end applications.
Model: XAZU2EG-1SFVC784I
Series: Zynq® UltraScale+™ MPSOC EG
Architecture: MPU, FPGA
Core Processors: Quad-core ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual-core ARM® Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size: 1, 2MB
Speed: 500MHz, 1.2GHz
Key Attributes: Zynq® UltraScale+™ FPGA, 103K+ logic cells
Operating Temperature: -40°C to 100°C (TJ)
Package/Housing: 784-FCBGA (23x23)
I/O Count: 128

latest company news about Supply And Recycle Xilinx XAZU2EG-1SFVC784I: Zynq® UltraScale+™ MPSoC EG High-Performance System-On-Chip  0

 

II. XAZU2EG-1SFVC784I Programmable Logic (PL): 103K+ logic elements, flexibly adaptable to custom requirements
As the core hardware acceleration unit of the chip, the XAZU2EG-1SFVC784I's PL section features 103K+ system logic elements (SLICE/LUT), representing the foundational core configuration of the ZU2EG series. It is complemented by extensive BRAM, UltraRAM, and DSP slices, providing ample resource support for custom hardware acceleration, interface expansion, and the implementation of timing-critical control logic. Furthermore, the chip supports high-speed transceivers (GT), enabling multi-Gbps interface transmission to meet high-speed data interaction requirements.

 

III. XAZU2EG-1SFVC784I Processing System (PS): Heterogeneous Multi-core Architecture Balancing Performance and Real-time Capabilities
The XAZU2EG-1SFVC784I's Processing System (PS) employs a heterogeneous multi-core design, seamlessly balancing general-purpose computing performance with real-time control requirements: Integrated quad-core ARM Cortex-A53 (64-bit, up to 1.2GHz, automotive-grade), each core equipped with 32KB I/D L1 cache, sharing 1MB L2 cache, paired with 256KB on-chip OCM with ECC. This enables efficient operation of operating systems such as Linux, handling complex application execution and task scheduling; Simultaneously integrates a dual-core ARM Cortex-R5F real-time processor (up to 500MHz, supporting lockstep operation), dedicated to functional safety scenarios. This enables low-latency, high-reliability real-time control, making it suitable for industrial automation, automotive electronics, and other applications demanding stringent real-time performance. Additionally, the chip incorporates a Mali-400 MP2 GPU supporting OpenGL ES 2.0, fulfilling basic graphics processing requirements.

 

IV. XAZU2EG-1SFVC784I Interfaces and Storage: Comprehensive and Adaptable for Multi-scenario Connectivity
To fulfil diverse device connectivity and storage requirements, the XAZU2EG-1SFVC784I features extensive interface resources: Memory interfaces support DDR4/LPDDR4 (with ECC), delivering high-speed, stable storage support to ensure efficient data read/write operations; High-speed peripherals encompass PCIe Gen2, USB 3.0, SATA 3.1, and Gigabit Ethernet, enabling rapid data transfer and device interconnection; fundamental peripherals include UART, SPI, I2C, and CAN, flexibly accommodating diverse low-speed peripherals to fulfil multi-scenario application requirements. This broadly covers device interconnection needs across industrial, automotive, medical, and other sectors.

 

For detailed specifications, stock availability, pricing information regarding the Xilinx XAZU2EG-1SFVC784I, or procurement requirements for other Xilinx series products, please contact Mingjiada Electronics at your convenience. We shall be delighted to assist you!
Company URL: https://www.integrated-ic.com/

Pub Time : 2026-02-07 11:24:17 >> News list
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