company blog about Supply and Recycling (Xilinx) XAZU3EG-1SFVA625I Embedded System-on-Chip SoC FPGA

Mingjiada Electronics specializes in high-end heterogeneous computing chips. We now offer stable, brand-new supply of the Xilinx Zynq UltraScale+ MPSoC series XAZU3EG-1SFVA625I embedded system-on-chip (SoC) FPGA for industries including industrial automation, intelligent vision, and edge computing. We also provide long-term, high-value buyback services for idle inventory and bulk shipments of this chip. All products originate from legitimate channels, with core computing power and interface performance meeting specifications. They are ideal for embedded development and mass production scenarios with size constraints and high computing demands, helping customers build stable heterogeneous computing chip supply chains while efficiently repurposing idle hardware resources.

XAZU3EG-1SFVA625I Product Overview

The Xilinx XAZU3EG-1SFVA625I is a standard miniaturized variant of the Zynq UltraScale+ MPSoC series. built on advanced 16nm FinFET process technology. It employs a heterogeneous computing architecture combining an application processor, real-time processor, graphics processor, and programmable logic. Within its compact 21×21mm FCBGA-625 package, it integrates 7 compute cores alongside extensive logic, memory, and interface resources. Classified as Speed Grade 1, it balances miniaturization with full-performance computing capabilities. The chip supports dynamic voltage and frequency scaling, with industrial-grade wide temperature operation for harsh environments. It enables real-time control, high-speed data processing, graphics rendering, and programmable logic operations in parallel, making it the core computing choice for edge intelligence and industrial embedded devices in space-constrained scenarios.

Core Specifications

Core Architecture: 7-core heterogeneous design, including 4 ARM Cortex-A53 cores (1.2GHz), 2 ARM Cortex-R5 cores (600MHz), and 1 ARM Mali-400 MP2 GPU (500MHz)

Cache and Memory: L1 instruction/data cache each with 2×32kB+4×32kB, 7.6Mbit embedded memory, supports external high-speed memory expansion

Logic Resources: 154,350 logic elements (LE), 8,820 adaptive logic modules (ALM), supporting medium-to-high complexity logic circuit design

Interface Configuration: 180 user I/O ports supporting mainstream protocols including CAN, I²C, SPI, UART, enabling medium-scale expansion with multiple peripherals

Electrical Characteristics: SMD/SMT mounting, operating voltage 850mV, typical power consumption ~5W, supports dynamic power regulation

Temperature Range & Package: FCBGA-625 package (21×21mm), operating temperature -40°C to +100°C, compliant with RoHS environmental standards

Additional Features: Supports IEEE 1588 clock synchronization, integrated Gigabit Ethernet MAC for high-speed network communication scenarios

Key Product Features

Heterogeneous Computing Fusion: Integrates APU, RPU, GPU, and FPGA programmable logic for flexible task allocation, balancing general-purpose computing, real-time control, graphics processing, and hardware acceleration to consolidate multiple system functions onto a single chip

High Performance in Compact Package: 21×21mm compact package delivers full heterogeneous computing capabilities within size-constrained embedded devices, supporting real-time data processing and parallel execution of complex algorithms

Low Power, High Adaptability: Typical power consumption of just 5W on a 16nm process. Dynamic voltage and frequency scaling automatically adjusts power based on workload, meeting power constraints for edge devices and portable terminals.

Industrial-Grade Reliability: Wide operating temperature range of -40°C to +100°C. Withstands harsh industrial and automotive environments, ensuring long-term stable operation without additional thermal protection.

Robust Development Ecosystem: Compatible with Xilinx official development toolchain and supports Linux system development. Programmable logic can be customized via hardware description languages, lowering barriers for hardware-software co-design.

Flexible Interface Expansion: 180 universal I/O ports support multi-protocol adaptation, enabling connectivity with sensors, cameras, network modules, and other peripherals to meet expansion needs for industrial embedded and smart vision devices.

Typical Application Scenarios

Leveraging heterogeneous computing power, compact packaging, and industrial-grade features, this chip is widely applicable in size-constrained embedded domains requiring computational performance:

Smart Vision Devices: Core computing modules for portable industrial vision inspectors, smart vision sensors, and compact machine vision acquisition/processing terminals

Edge Computing Terminals: Compact edge gateways and industrial IoT edge nodes enabling on-site data collection, local analysis, and protocol conversion

Industrial Embedded Devices: Portable industrial controllers, compact CNC equipment, industrial robot joint control modules balancing real-time control and data processing

Automotive Electronics Systems: In-vehicle auxiliary control systems, compact in-vehicle smart terminals meeting automotive-grade wide-temperature and power consumption requirements

Premium Consumer Electronics: Core modules for smart hardware, portable intelligent inspection devices achieving miniaturization and high performance

Mingjiada Electronics Supply Advantages

Genuine OEM Assurance: XAZU3EG-1SFVA625I is an AMD automotive-grade chip with COC compliance certificate and AEC-Q100 traceability support

Temperature Grade Verification: Strictly differentiated Class I (-40°C to +100°C) and Class Q (-40°C to +125°C) to prevent cross-grade mixing

Package Integrity: 625-FCBGA package, 21×21mm dimensions, 0.8mm ball pitch. X-ray inspection services ensure no bridging in BGAs.

Recycling Process:

1. Categorize your surplus IC/module inventory by model, brand, production date, and quantity.

2. Fax or email the inventory list to our evaluation team.

3. Await a professional purchase quote from our company. Upon agreement, negotiate specific delivery methods for transaction completion

4. We exclusively recycle products from authorized channels (e.g., distributors, traders, end-user factories). Non-authorized sources are not accepted

Mingjiada Electronics—Specializing in AMD/Xilinx automotive-grade MPSoC supply, delivering core chip solutions for intelligent driving and industrial automation!