company blog about Supply NXP Development Board:MCU And MPU,Audio,Interfaces

Supply NXP Development Board:MCU And MPU,Audio,Interfaces

Shenzhen Mingjiada Electronics Co., Ltd. is a globally renowned authorized independent distributor of electronic components, specializing in providing one-stop electronic component procurement services.

Main product categories supplied:

Integrated circuits, 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, vehicle networking ICs, automotive-grade ICs, communication ICs, artificial intelligence ICs, memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips, wireless communication modules, connectors, and other products.

Supply and service advantages:

Scalable inventory: With over 2 million inventory SKUs, we support procurement from small quantities (as low as 1 piece) to large-scale orders.

Rapid delivery: Dual warehouses in Shenzhen and Hong Kong, with a response time of 48 hours and global logistics support.

Price competitiveness: Cost reduction through direct sourcing from original manufacturers and a streamlined supply chain model.

【MCU and MPU Development Boards】

1. Microcontroller (MCU): Focused on real-time control and energy efficiency

MCU Series: These products represent NXP's key innovation focus in recent years, pushing beyond the performance boundaries of traditional MCUs. For example, the i.MX RT600 series combines an Arm® Cortex®-M33 core running up to 300 MHz with a Cadence Tensilica HiFi 4 audio DSP core operating at up to 600 MHz, optimized for 32-bit immersive audio playback and voice user interfaces. It delivers up to 4.5 MB of on-chip SRAM and rich high-bandwidth interfaces designed to unlock the potential of voice-enabled edge devices. The i.MX RT500 series within the same family employs an Arm Cortex-M33 + Cadence Fusion F1 DSP architecture, incorporates up to 5 MB of system SRAM, and even integrates a 2D GPU. It targets audio processing and wearable devices with extreme demands on form factor and power consumption.

2. Application Processors (MPU)

i.MX Series Application Processors: Taking the i.MX 8X series as an example, it integrates multiple Arm Cortex-A35 application cores, a Cortex-M4F real-time core, and a high-performance Tensilica HiFi 4 DSP. This multi-core heterogeneous architecture enables advanced multi-core audio processing for pre/post-processing and speech recognition, while integrated independent GPU and VPU subsystems support driving multiple displays. It caters to complex applications demanding high multimedia and display performance. The i.MX 8M Plus also supports the HiFi 4 DSP, enabling collaboration with the main operating system (Linux or Zephyr) through remote processing frameworks like OpenAMP to offload signal processing and neural network workloads.

【Audio Development Boards】

Most audio-related development boards integrate high-quality audio codecs or interfaces. For example, the MPC5645S development board features a headphone amplifier and a 3.5mm stereo jack for audio output. The LPC54114 Audio and Voice Recognition Kit and the NXH3670 SDK board (for low-latency wireless gaming headset solutions) both integrate the Wolfson WM8904 audio codec, controlled via I²C, providing comprehensive audio input/output interfaces.

To handle complex audio algorithms, NXP integrates dedicated DSPs into multiple chips. The HiFi 4 DSP stands out among these, appearing in the i.MX RT600 crossover MCUs and i.MX 8 series MPUs. It delivers exceptional computational efficiency, specifically designed for audio decoding, sound effects processing, and speech recognition. In the demonstration, the Cortex-M33 core of the i.MX RT600 handles application logic and file systems, while the HiFi 4 DSP exclusively manages the pipeline for audio decoding and effect processing.

【Interface Development Boards】

High-Speed Serial Interfaces: The FlexComm interface module (common in the i.MX RT series) offers exceptional flexibility, configurable as UART, SPI, I²C, or I²S, facilitating connections to various sensors, memory devices, and audio equipment. Many development boards also support CAN and LIN bus protocols to meet automotive and industrial communication requirements.

USB: USB interfaces are ubiquitous, supporting device, host, and OTG modes. The USB stack in the MCUXpresso SDK supports USB Audio 2.0, enabling rapid code generation with configuration tools.

Wireless Connectivity: Dedicated wireless development boards target IoT and consumer applications, such as the NXH3670 SDK board. It integrates a chip supporting Bluetooth Low Energy Audio (LE Audio) for developing ultra-low-power, low-latency wireless audio products.