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Supply ON Discrete Evaluation Board:MOSFET,IGBT,Power Module,SiC
Latest company news about Supply ON Discrete Evaluation Board:MOSFET,IGBT,Power Module,SiC

Supply ON Discrete Evaluation Board:MOSFET,IGBT,Power Module,SiC

 

Shenzhen Mingjiada Electronics Co., Ltd., as an authorised independent distributor of globally renowned electronic components, leverages years of industry expertise and a stable supply chain system to provide clients with comprehensive electronic component solutions.

 

Principal Products: 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, telematics ICs, automotive ICs, automotive-grade ICs, communications ICs, AI ICs, memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips, wireless communication modules, connectors, and other products.

 

Supply Advantages

All products are genuine OEM items, backed by comprehensive quality assurance and traceability services.

Inventory exceeds 2 million SKUs, covering the full spectrum of electronic components.

Industry-leading pricing achieved through large-scale procurement and streamlined operational costs.

Efficient logistics system ensures punctual delivery.

Comprehensive after-sales service eliminates customer concerns.

 

1. Discrete Device Evaluation Boards: Flexibility and In-Depth Analysis

Represented by the ON Semiconductor EVBUM2897G-EVB, discrete device evaluation boards deliver core value through flexibility and deep analytical capabilities. Engineers can freely adjust parameters such as gate resistance and drive voltage, meticulously observing their impact on switching trajectories. This makes them ideal for preliminary technical research and device selection validation.

 

The EVBUM2897G-EVB advanced dual-pulse tester evaluation board serves as a versatile tool for comparative device performance analysis in laboratories. It is specifically engineered for rapid, precise switching performance comparisons of EliteSiC MOSFETs and IGBTs across various discrete packages.

 

Exceptional versatility: Its core strength lies in supporting six mainstream high-power packages, including TO247-3L/4L, D2PAK-7L, BPAK7, TOLL, and POWER88. This enables developers to use a single board to compare how different packages affect the switching characteristics of the same chip, or to evaluate how different chips perform within the same package, providing direct data support for selection.

Professional Test Architecture: This board transcends a simple adapter, integrating all critical circuitry required for comprehensive Dual Pulse Testing (DPT):

Isolated Single-Gate Driver: Provides 2.5 kV electrical isolation, ensuring safety and signal integrity during high-voltage testing.

Low-inductance PCB layout and integrated components: Power loop layout is specifically optimised to minimise parasitic inductance. It incorporates an 80 µH wire-wound air-core inductor and current measurement transformer, enabling more accurate measurement of voltage overshoot, ringing, and switching losses during the switching process.

High-voltage support: The board design supports devices up to 1200V, with a DC bus voltage of up to 1100V, covering mainstream high-voltage application scenarios.

 

2. Power Module Evaluation Boards: System-Level Applications

When devices are scaled up to higher-integration power modules, evaluation shifts towards system-level performance. For instance, ON Semiconductor's EVBUM2878G-EVB evaluation board is specifically designed for its 1200V M3S 4-PACK EliteSiC MOSFET full-bridge module.

 

System-level testing: Beyond supporting dual-pulse testing, it emphasises open-loop power testing to evaluate critical system metrics such as conversion efficiency and temperature rise during sustained operation.

 

Comprehensive Drive and Protection: The board integrates four independent isolated gate drivers, pre-installed thin-film DC bus capacitors, and an optimised thermal management design (utilising high-emissivity black PCB), enabling direct evaluation of the module's performance in practical applications such as solar inverters, energy storage systems, or electric vehicle charging stations.

 

3. Silicon Carbide Intelligent Power Module Evaluation Solution: Plug-and-Play System Integration

The highest form of power semiconductor integration is the Intelligent Power Module. ON Semiconductor's recently launched EliteSiC SPM 31 series IPM integrates SiC MOSFETs, gate drivers, protection circuits, and temperature sensing. Evaluation solutions for such modules are highly integrated.

 

Disruptive Performance Advantages: Compared to previous IGBT solutions, this SiC IPM reduces power consumption by up to 52% under typical loads, significantly lowering annual energy consumption and costs.

 

Simplified design: The evaluation focus extends beyond the device itself to leveraging its integrated advantages rapidly. With built-in under-voltage protection, bootstrap diodes, and temperature monitoring, engineers can swiftly develop efficient, compact variable-frequency drives based on manufacturer reference designs. These are suitable for applications such as AI data centre cooling fans and industrial servo drives.

Pub Time : 2025-12-23 12:15:42 >> News list
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