company blog about Supply/Recycle Infineon IRS2877C REAL3™ ToF Image Sensor With HVGA System Resolution

Supply/Recycle Infineon IRS2877C REAL3™ ToF Image Sensor With HVGA System Resolution

Amidst the rapid evolution of 3D sensing technology, Time-of-Flight (ToF) image sensors have become core components in consumer electronics, industrial automation and other sectors. Shenzhen Mingjiada Electronics Co., Ltd., a specialised electronic component distributor, supplies and recycles Infineon's IRS2877C REAL3™ Time-of-Flight image sensor. With its native HVGA system resolution and outstanding comprehensive performance, it delivers a cost-effective solution for diverse 3D sensing applications, redefining the performance benchmark for mid-to-high-end ToF sensors.

【IRS2877C Core Feature: HVGA Resolution Establishes Foundation for Precise Perception】

The IRS2877C's most compelling advantage lies in its native support for HVGA (Half-Size Video Graphics Array) system resolution, achieving approximately 153,000 pixels. Through its unique pixel layout design, it can efficiently scale to VGA-level (3,072,000 pixels) depth image output. This resolution advantage enables the sensor to capture finer scene details, generating 3D depth data with enhanced precision. Whether capturing subtle facial contours or textural variations on object surfaces, it delivers clear reproduction, providing high-quality raw material for subsequent data processing and application development.

As a flagship product of Infineon's fifth-generation REAL3™ technology, the IRS2877C incorporates a newly designed 5µm pmd pixel core. Combined with patented on-chip backlight suppression (SBI) technology, it achieves best-in-class dynamic range and outdoor performance. Even under complex lighting conditions such as direct strong sunlight or low-light environments, the sensor consistently outputs reliable depth data and greyscale images, effectively mitigating ambient light interference with perception accuracy. This capability enables adaptation to diverse application scenarios, overcoming lighting constraints typically imposed on 3D sensing devices.

In terms of power consumption control, the IRS2877C excels notably, achieving an outstanding depth performance-to-power ratio. It maintains high perception accuracy while minimising energy expenditure. For mobile devices such as smartphones and AR glasses, this low-power characteristic translates to extended battery life, laying a crucial foundation for enhancing end-user experience. Furthermore, the sensor's optimised interface design and miniaturised architecture, when paired with Infineon's proprietary IRS9100C or IRS9102C VCSEL illumination drivers, substantially reduces overall module design complexity, shrinks physical dimensions, and streamlines the bill of materials (BOM). This significantly enhances integration efficiency, perfectly aligning with mobile devices' demand for slimline designs.

【Key Specifications of IRS2877C】

The core specifications of the IRS2877C fully demonstrate its technological advantages, providing clear reference for application selection: the pixel array employs a 640×480 layout with a base resolution of 307.2K, natively supporting HVGA output and scalable to VGA; Operating at 940nm infrared wavelength—invisible to the human eye—it incorporates hardware laser safety monitoring circuits alongside stringent software configuration verification for comprehensive safety assurance; The bare die packaging accommodates wafer-level dicing and packaging requirements, meeting diverse integration needs across end products; The operating temperature range spans -40°C to 85°C, conforming to JEDEC JESD22 and J-STD-20 standards. Its exceptional environmental adaptability enables stable deployment across consumer electronics and industrial applications. This precise parameter alignment achieves an optimal balance between performance, safety, and compatibility.

【Expanding Multi-domain Applications for IRS2877C】

Leveraging its outstanding technical characteristics, the IRS2877C has demonstrated extensive application potential across consumer electronics, industrial systems, smart home solutions and other domains, serving as a core driver for the practical implementation of 3D sensing technology.

Within consumer electronics, the IRS2877C serves as the core component for smartphone 3D sensing capabilities. Its high resolution and robust security meet stringent facial authentication requirements, enabling secure applications such as device unlocking and mobile payments. Integrated with reference designs for mainstream mobile platforms like the Qualcomm Snapdragon™ 865, it has been successfully deployed in multiple smartphone models. In computational photography, the sensor's precise depth data enables advanced autofocus and video bokeh (background blur) effects, significantly enhancing mobile photography experiences. This empowers ordinary users to effortlessly capture professional-grade blurred backgrounds. Furthermore, its application in AR devices is highly representative. Through precise environmental scanning and 3D modelling, it delivers immersive augmented reality experiences, enabling natural interactions and occlusion effects between virtual objects and real environments, propelling AR technology from concept to practical application.

Within industrial and smart home sectors, the IRS2877C similarly plays a vital role. In robotics, the sensor provides precise environmental awareness for devices like cleaning robots and industrial robotic arms, enabling autonomous navigation, obstacle avoidance, and precise manipulation. In smart home scenarios, it facilitates facial recognition for smart locks and gesture control for home appliances, enhancing both security and convenience in domestic settings. Furthermore, within retail, its high-resolution 3D perception capabilities support human body 3D model reconstruction, providing data foundations for customised clothing and precise sizing recommendations. In the drone sector, it enables autonomous flight and obstacle avoidance in complex environments, expanding drone application scope.

【IRS2877C Technical Milestones and Industry Impact】

The launch of the IRS2877C marks a significant milestone in the collaborative development between pmd and Infineon. It achieves a perfect fusion of ‘highest resolution and optimal integration capability,’ not only providing end manufacturers with a high-performance, highly flexible 3D perception solution but also driving the global adoption and application innovation of ToF technology. As a universal sensor catering to both consumer and industrial markets, the IRS2877C overcomes barriers posed by differing 3D perception requirements across sectors through its balanced performance, broad compatibility, and high cost-effectiveness. It delivers robust technological support for digital and intelligent transformation across industries.

Looking ahead, as 3D sensing technology deepens its penetration across more scenarios, Infineon's IRS2877C REAL3™ Time-of-Flight Image Sensor will continue to play a pivotal role. Its precise perception advantages, enabled by HVGA resolution, will integrate seamlessly with innovative terminal product designs. This synergy will deliver smarter, more convenient, and safer user experiences, propelling the entire 3D sensing industry towards a higher stage of quality development.