company blog about Supply/Recycle OPNOUS OPN8001C High-Performance 3D Time-Of-Flight Sensor

Supply/Recycle OPNOUS OPN8001C High-Performance 3D Time-Of-Flight Sensor

As 3D sensing technology advances towards miniaturisation, low power consumption and high precision, Shenzhen Mingjiada Electronics Co., Ltd. supplies/ recycled OPN8001C 3D Time-of-Flight (ToF) sensors from OPNOUS. Featuring advanced through-silicon via (TSV) packaging technology, optimised performance parameters, and an ultra-compact design, these sensors overcome the industry bottleneck that ‘high performance and small size cannot coexist’. They have become the core preferred choice for achieving precise 3D perception in compact smart devices, widely adapting to lightweight application requirements across multiple fields such as consumer electronics, smart home, and security.

I. Core Positioning of OPN8001C: Ultra-Compact Design Balancing Performance and Adaptability

The OPN8001C is a high-performance 3D ToF sensor engineered by Juyou Intelligent specifically for compact smart devices. centred on ‘small footprint, low power consumption, high precision’. Leveraging advanced TSV (Through Silicon Via) packaging technology, it achieves efficient signal transmission and stable sensing performance within an extremely compact chip size. Requiring minimal device space, it perfectly suits scenarios with stringent volume constraints while balancing ranging accuracy and power consumption control. This delivers a cost-effective solution for upgrading 3D perception in portable, miniaturised smart devices. Compared to other products in the series, the OPN8001C prioritises compactness as its core advantage while retaining industrial-grade reliability, achieving a dual balance of performance and adaptability.

II. Core Technical Advantages of OPN8001C: Innovative Packaging Enables Comprehensive Performance Optimisation

1. Advanced TSV Packaging Technology Overcomes Size and Performance Constraints

The OPN8001C's most significant technical innovation lies in its TSV (Through-Silicon Via) packaging technology. By enabling vertical electrical interconnections via silicon vias, it substantially reduces chip volume compared to traditional packaging methods. This approach also effectively minimises signal delay while lowering parasitic capacitance and inductance, achieving high-speed, stable signal transmission. This packaging design integrates core sensing modules within an extremely compact footprint. It facilitates assembly and soldering in small devices while enhancing signal transmission efficiency, laying the hardware foundation for high-precision ranging. Concurrently, it further optimises power consumption, making it suitable for battery-powered portable devices.

2. High-Precision Ranging Capability for Enhanced Accuracy

As a high-performance ToF sensor, the OPN8001C delivers industry-leading ranging accuracy. Leveraging a 100×100 pixel array and optimised photosensitive design, it achieves ≤0.5% accuracy relative to distance. At 1 metre, precision reaches 1mm. with a measurement range spanning 0.2 to 10 metres (at 30fps). It accurately captures the three-dimensional contours and spatial positioning of target objects. Supporting target wavelengths of 850nm or 940nm, the sensor incorporates an advanced optical system solution that effectively suppresses ambient light interference. This ensures stable sensing performance across varying illumination conditions, preventing ranging deviations.

3. Low Power Consumption and High Flexibility for Multi-Scenario Operation

The OPN8001C employs an optimised circuit design with outstanding power management, achieving typical power consumption ≤50mW at 30fps. This satisfies the long-term operational requirements of battery-powered devices, enabling stable operation without frequent recharging. Additionally, the sensor supports adjustable frame rates of 5fps, 10fps, 20fps, 30fps, 60fps, and 120fps, alongside flexible Region of Interest (ROI) configuration (supporting 100×10 pixel areas). This allows operational parameters to be tailored to specific application requirements, further reducing power consumption and enhancing device endurance while maintaining perception quality.

4. Comprehensive Interfaces and High Compatibility for Streamlined Integration

The sensor features a comprehensive interface design: the control interface employs CCI (I²C), while the data interface supports MIPI CSI-2 dual lanes with an output data rate of up to 378Mbps per lane. This enables rapid transmission of depth data and image information, meeting real-time perception requirements. Additionally, the OPN8001C operates on a single 3.3V power supply, with a compact chip size of 4.12mm × 3.72mm with a 1/6-inch optical format and 15μm pixel pitch. This compact size and straightforward power supply design significantly reduce device integration complexity, enabling seamless adaptation to motherboard designs for various compact smart devices. It is compatible with the SDK, modules, and firmware of Juyou Intelligent's same-series products, facilitating rapid product integration and debugging for customers while shortening the R&D cycle.

III. Detailed Explanation of OPN8001C Core Technical Parameters

The OPN8001C's outstanding performance stems from its precise parameter configuration. The following summary of core technical specifications clearly demonstrates its hardware capabilities:

- Pixel Specifications: 100×100 pixel array, 15μm×15μm pixel pitch, 1/6-inch optical format, supporting flexible ROI settings (100×10 pixels);

- Packaging Technology: TSV (Through-Silicon Via) packaging, chip dimensions 4.12mm × 3.72mm, facilitating integration into compact devices;

- Range-finding Performance: Measurement range 0.2–10m (at 30fps), range accuracy ≤0.5% (distance percentage), achieving 1mm accuracy at 1m;

- Optical characteristics: Supports target wavelengths of 850nm or 940nm, incorporates microlens design with eye safety controllability;

- Frame rate and power consumption: Multi-frame rate adjustable (5–120fps), typical power consumption ≤50mW at 30fps, with outstanding low-power characteristics;

- Interface specifications: Control interface CCI (I²C), data interface MIPI CSI-2 (2 lanes), output data rate 378Mbps/lane;

- Power supply and environment: Single 3.3V power supply, operating temperature range -20°C to 85°C, suitable for diverse environmental scenarios;

- Additional features: Integrated 12-bit ADC, supports global shutter, enables multi-sensor collaboration, compatible with SDK and firmware of the same series.

IV. OPN8001C Multi-domain Application Scenarios: Empowering Compact Smart Device Upgrades

Leveraging its ultra-compact design, high-precision sensing, and low-power advantages, the OPN8001C seamlessly adapts to diverse 3D perception scenarios with stringent volume and power constraints. It spans consumer electronics, smart home, and security domains, endowing devices with precise spatial awareness:

1. Consumer Electronics Sector

Suitable for front-facing 3D sensing modules in laptops and tablets, enabling facial recognition unlocking and gesture control without occupying additional front-panel space, balancing security and convenience. Also applicable for spatial awareness in wearables (e.g., smartwatches, AR glasses), facilitating gesture interaction and spatial positioning to enhance intelligent wearable experiences.

2. Smart Home Sector

Core applications include smart door locks and compact facial recognition devices. Leveraging high-precision ranging and miniaturised design, these modules can be embedded within door locks to deliver rapid, accurate facial recognition unlocking, enhancing both security and convenience. They also enable gesture control for smart home appliances like lighting systems and smart speakers, facilitating contactless operation through human gesture detection to elevate home automation and comfort.

3. Security and Industrial Applications

Suited for compact security surveillance equipment, smart access control systems, and turnstiles, enabling functions like human presence detection and personnel counting. Its ultra-small form factor allows flexible integration within devices without compromising aesthetics. Furthermore, it supports close-range spatial awareness for small AGV robots and drones, assisting with obstacle avoidance and positioning to enhance operational stability and precision.

4. Other Emerging Applications

Within 3D gaming and lightweight AR/VR devices, the OPN8001C delivers precise gesture recognition and spatial positioning, creating immersive interactive experiences. It also extends the application scope of 3D sensing technology in scenarios such as distance perception for compact medical devices and interactive control for smart toys.

V. Summary of OPN8001C Product Advantages

As an ultra-compact, high-performance 3D ToF sensor launched by Juyou Intelligent, the OPN8001C achieves a triple breakthrough of ‘small size, high precision, and low power consumption’ through TSV packaging technology. It resolves the pain points of traditional high-performance ToF sensors—excessive bulk, high power consumption, while also overcoming the limitation of insufficient perception accuracy in compact sensors. This provides a comprehensive solution for upgrading 3D perception in compact smart devices.

Looking ahead, as smart devices evolve towards greater miniaturisation and intelligence, the OPN8001C will continue leveraging its technological advantages to expand application scenarios. It will inject new momentum into 3D perception upgrades across various smart device sectors, establishing itself as the benchmark product in the compact 3D ToF sensor domain.