Supply/Recycle VisionICs VI4310 High Integrated Single Photon 3D ToF Image Sensor
Amidst the rapid advancement of 3D imaging and ranging technologies, the convergence of single-photon avalanche diode (SPAD) detection and direct time-of-flight (dToF) techniques is driving the sensor industry towards miniaturisation, low power consumption, and high precision. Shenzhen Mingjiada Electronics Co., Ltd. supplies VisionICs' VI4310 highly integrated single-photon 3D time-of-flight imaging sensor. As China's first QQVGA resolution SPAD array dToF sensor, it has become a benchmark product in solid-state LiDAR and 3D imaging applications through its fully integrated system design, outstanding performance, and broad adaptability, providing core support for technological upgrades across multiple industries.
【VI4310 Core Technology: Single-Chip Integrated Full-Stack Solution】
The VI4310's competitive edge stems from its highly integrated System-on-Chip (SoC) design, consolidating all critical 3D imaging modules onto a single chip. This fundamentally reduces system design complexity and manufacturing costs. This sensor incorporates a 19K-pixel (160×120) SPAD detector array, paired with Xinshijie's proprietary ultra-high-precision ranging circuitry. It further integrates multiple ranging accuracy optimisation algorithms, anti-backlight interference algorithms, and backend digital signal processing (DSP) and image signal processing (ISP) modules. enabling direct output of 3D point cloud data and depth maps without requiring external ISP assistance. This achieves fully autonomous processing across the entire chain from photon detection to data output.
In core photosensitive device design, the VI4310 undergoes specialised optimisation for near-infrared (NIR) wavelengths, achieving a photon detection efficiency (PDE) exceeding 10% at the critical 940nm wavelength. This endows it with exceptional low-light detection capabilities. Leveraging single-photon-level detection sensitivity, the sensor captures faint photon signals during laser pulse round trips. Combined with nanosecond-accurate time-of-flight measurement, it achieves centimetre-level ranging performance, laying the foundation for high-precision 3D imaging. Furthermore, the chip's integrated anti-interference algorithm effectively counters strong ambient light interference. It maintains stable ranging accuracy even under 100 kLux outdoor sunlight conditions, overcoming the environmental limitations of traditional sensors.
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【VI4310 Performance Analysis: Benchmark Configuration Balancing Precision, Speed and Power Consumption】
The VI4310 achieves multidimensional precision in its performance parameters, satisfying both the high-accuracy demands of professional applications and the low-power requirements of consumer electronics. Regarding imaging specifications, it employs a 160×120-pixel QQVGA resolution design with a photosensitive area of 3900×3000μm² and a pixel pitch of 21.4μm (horizontal) × 18.8μm (vertical), enabling the output of detailed 3D imagery. Frame rates support programmable adjustment, with a standard configuration of 30fps and a maximum boost to 120fps, meeting real-time dynamic imaging requirements and enabling target detection and tracking in high-speed motion scenarios.
Distance measurement stands as the VI4310's defining strength, with an effective range extending to 15 metres. It achieves a resolution as fine as 0.75cm and maintains accuracy within ±1% error. Within 5 metres indoors, it delivers a root mean square error (RMSE) of just 1%, fully meeting the demands of precision ranging and modelling. Power consumption management is particularly impressive, with overall power draw (including DSP and ISP algorithm operation) limited to 200mW. Its flexible 1.5V/3.3V/28.5V power supply solution enables compatibility with battery-powered portable devices. Furthermore, the sensor operates within a working temperature range of -20°C to 65°C and a storage temperature range of -40°C to 105°C, demonstrating exceptional environmental adaptability to ensure stable performance under demanding conditions.
In terms of interface design, the VI4310 employs an I²C interface (200kHz) for sensor configuration and a DVP interface (75MHz) for ToF data output. This standardised interface approach simplifies compatibility with diverse terminal devices, facilitating rapid integration. The resulting VM4310 module measures just 22×23×5.5mm, enabling seamless embedding within compact devices.
【VI4310 Application Scenarios: A Cross-Industry Enabler】
Leveraging its core strengths of high integration, low power consumption, and high precision, the VI4310 has found applications across multiple sectors including consumer electronics, smart home systems, autonomous driving, and robotics. It has become a pivotal component driving intelligent upgrades across these industries.
Within consumer electronics, the VI4310 delivers high-performance 3D imaging solutions for smartphones, tablets and similar devices, enabling applications such as laser autofocus for cameras, facial recognition, and AR/VR interaction. Its compact size and low power consumption perfectly align with mobile device design requirements, while its centimetre-level ranging accuracy ensures precise fusion of virtual objects with real-world environments in AR scenarios, enhancing user interaction experiences.
Within smart home and service robotics, the VI4310 serves as the core component enabling autonomous navigation and environmental perception in devices like robotic vacuum cleaners. By generating real-time 3D point cloud data, robots achieve high-precision indoor mapping, accurate obstacle avoidance, and wall-following detection. Compared to traditional 1D ToF sensors, its 3D imaging capabilities significantly enhance a robot's environmental adaptability and cleaning efficiency.
In autonomous driving, the VI4310 provides the core chip support for solid-state LiDAR systems. Solid-state LiDAR offers superior reliability and stability due to the absence of mechanical rotating components. The VI4310's high integration and low-power design precisely meet the demands for miniaturisation and extended battery life in automotive applications. LiDAR systems based on this sensor enable long-range, high-precision road environment detection, providing critical data support for autonomous driving safety decisions.
Beyond this, the VI4310 finds extensive application in surveying and modelling, industrial inspection, and other domains. Its robust resistance to strong light interference and stable ranging performance prove vital in outdoor mapping and production line defect detection scenarios, propelling relevant industries towards automation and precision.
[VI4310 Industry Value: Pioneering Breakthroughs in Domestic 3D ToF Technology]
Against a backdrop where the global 3D ToF sensor market has long been dominated by foreign manufacturers, the launch of the VI4310 represents a technological breakthrough for domestic high-resolution SPAD array dToF sensors, filling a significant gap in the field. Its core technologies stem entirely from Xinshijie's independent R&D efforts. From SPAD detector design and ranging algorithm optimisation to full chip integration, the company has established comprehensive technological barriers, providing invaluable experience for the autonomous development of domestic sensors.
More significantly, the VI4310's highly integrated design substantially lowers the cost barrier for 3D imaging solutions. This enables solid-state LiDAR and 3D depth cameras to be more widely adopted in mid-to-low-end terminal devices, accelerating the widespread adoption of 3D imaging technology. With the ongoing expansion of autonomous driving, robotics, AR/VR and other industries, high-performance, cost-effective sensors like the VI4310 will become pivotal components within the supply chain. Their technological evolution and application expansion will further propel the advancement of the entire 3D imaging sector.
Conclusion: As a flagship product of highly integrated single-photon 3D ToF technology, the VI4310 not only demonstrates CoreVision's technical prowess in optoelectronic detection but also redefines the design paradigm for 3D imaging sensors. With ongoing technological refinement, the VI4310 and its successor iterations will achieve breakthroughs across more specialised fields, providing robust ‘visual’ propulsion for the advent of the intelligent era.
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