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Supply/Recycling Lattice LIFCL‑40 CrossLink‑NX: FPGA Chip for Embedded Vision and Edge Processing
Latest company news about Supply/Recycling Lattice LIFCL‑40 CrossLink‑NX: FPGA Chip for Embedded Vision and Edge Processing

Mingjiada Supply/Recycling Lattice LIFCL‑40 CrossLink‑NX: FPGA Chip for Embedded Vision and Edge Processing

 

The Lattice LIFCL‑40 CrossLink‑NX is an embedded vision-specific FPGA built upon the Nexus 28 nm FD‑SOI platform. Its core strengths lie in ultra-low power consumption, compact form factor, high-bandwidth interfaces, and robust vision processing and edge AI capabilities. It is specifically designed for multi-camera integration, video bridging, real-time pre-processing, and lightweight inference in industrial, automotive, consumer, and security applications.

 

【Core Positioning】

An integrated FPGA for embedded vision bridging + real-time processing + edge AI, addressing the pain points of traditional solutions—high power consumption, large footprint, interface incompatibility, and slow boot times. It serves as the ideal main controller/coprocessor for multi-camera systems, industrial vision, automotive imaging, and edge AI devices.

 

【Key Specifications (LIFCL-40)】

Process & Platform: 28 nm FD-SOI, Lattice Nexus

Logic Cells: 39 K

DSP Modules: 120 (supporting multiply-accumulate, filtering, FFT, CNN acceleration)

On-chip Memory: 1548 Kb (approx. 170 bits/LC, high compute-to-memory ratio)

User I/O: Up to 163

Supply Voltage: 0.95–1.05 V

Operating Temperature: -40°C to 100°C (industrial grade)

Package: Supports BGA, QFN, minimum 4 mm × 4 mm

 

latest company news about Supply/Recycling Lattice LIFCL‑40 CrossLink‑NX: FPGA Chip for Embedded Vision and Edge Processing  0

 

【Core Technical Advantages】

1. Ultra-low power consumption

Up to 75% lower power consumption compared to equivalent FPGAs

Standby current **<70 μA**

FD-SOI process significantly reduces leakage current, ideal for battery-powered/fanless devices

 

2. High-bandwidth native vision interfaces

Hardened MIPI D-PHY: 4×2.5 Gbps, direct connection to CSI-2/DSI cameras and displays

PCIe Gen2: 5 Gbps

USB 3.2: 5 Gbps

High-speed I/O: 1.5 Gbps; DDR3 up to 1066 Mbps

Compatible with LVDS/subLVDS/OpenLDI/GigE

 

3. Rapid Start-up and High Reliability

I/O configuration: 3 ms

Full device configuration: 8–14 ms

Soft error rate (SER) reduced by 100 times, ensuring greater stability for industrial/automotive applications

 

4. Vision and AI Acceleration

High memory-to-logic ratio + dedicated DSP efficiently supports image preprocessing, filtering, stitching, scaling, and colour correction

Supports lightweight CNN inference for defect detection, object recognition, and classification

 

【Typical Application Scenarios】

Industrial Vision: Industrial cameras, machine vision inspection, vision guidance, weld seam tracking

Automotive Imaging: Panoramic imaging, DMS/OMS, multi-camera surround view, in-vehicle display bridging

Security/Surveillance: Multi-camera integration, edge analytics, NVR front-end preprocessing

Consumer/Medical: Drone vision, AR/VR interface bridging, portable diagnostic devices

Embedded Computing: High-speed interface bridging, PCIe/USB/MIPI protocol conversion

 

【Core Value Summary】

The LIFCL‑40 CrossLink‑NX integrates native MIPI high-speed interfaces, low-power FD‑SOI, compact form factor, rapid boot-up, and edge vision/AI processing. This highly integrated, reliable, and energy-efficient FPGA solution for next-generation embedded vision systems significantly simplifies hardware design, reduces power consumption, minimises footprint, and accelerates product deployment.

 

【Related Products】

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Pub Time : 2026-02-27 14:35:50 >> News list
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